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1. 发明授权

US06916228B2 Wafer holding plate for wafer grinding apparatus and method for manufacturing the same 有权
标题翻译：晶片研磨装置的晶片保持板及其制造方法
公开(公告)号：US06916228B2
公开(公告)日：2005-07-12
申请号：US10236395
申请日：2002-09-05
申请人： Naoyuki Jimbo , Yuji Okuda , Shigeharu Ishikawa , Atsushi Mishima
发明人： Naoyuki Jimbo , Yuji Okuda , Shigeharu Ishikawa , Atsushi Mishima
IPC分类号： B24B1/00 , B24B7/22 , B24B37/30 , B24C1/04 , B24C3/32 , H01L21/463
CPC分类号： B24B37/30 , B24B7/228 , B24C1/04 , B24C3/322
摘要： A wafer holding plate for a wafer grinding apparatus. The plate includes a substrate having a wafer adhering surface to which a semiconductor wafer is adhered by an adhesive. The wafer adhering surface includes a mirror-like surface portion and a groove pattern, which anchors the adhesive. When the plate is used for grinding wafers, the quality and accuracy of the finished wafers is greatly improved.
摘要翻译：晶片研磨装置的晶片保持板。该板包括具有晶片粘附表面的基板，半导体晶片通过粘合剂粘合到该基板上。晶片粘附表面包括将粘合剂锚固的镜面状部分和凹槽图案。当板用于研磨晶片时，成品晶圆的质量和精度大大提高。

2. 发明授权

US06475068B1 Wafer holding plate for wafer grinding apparatus and method for manufacturing the same 有权
标题翻译：晶片研磨装置的晶片保持板及其制造方法
公开(公告)号：US06475068B1
公开(公告)日：2002-11-05
申请号：US09532532
申请日：2000-03-21
申请人： Naoyuki Jimbo , Yuji Okuda , Shigeharu Ishikawa , Atsushi Mishima
发明人： Naoyuki Jimbo , Yuji Okuda , Shigeharu Ishikawa , Atsushi Mishima
IPC分类号： B24B100
CPC分类号： B24B37/30 , B24B7/228 , B24C1/04 , B24C3/322
摘要： A wafer holding plate for a wafer grinding apparatus. The plate includes a substrate having a wafer adhering surface to which a semiconductor wafer is adhered by an adhesive. The wafer adhering surface includes a mirror-like surface portion and a groove pattern, which anchors the adhesive. When the plate is used for grinding wafers, the quality and accuracy of the finished wafers is greatly improved.
摘要翻译：晶片研磨装置的晶片保持板。该板包括具有晶片粘附表面的基板，半导体晶片通过粘合剂粘合到该基板上。晶片粘附表面包括将粘合剂锚固的镜面状部分和凹槽图案。当板用于研磨晶片时，成品晶圆的质量和精度大大提高。

3. 发明申请

US20050245177A1 Wafer holding plate for wafer grinding apparatus and method for manufacturing the same 有权
标题翻译：晶片研磨装置的晶片保持板及其制造方法
公开(公告)号：US20050245177A1
公开(公告)日：2005-11-03
申请号：US11175745
申请日：2005-07-06
申请人： Naoyuki Jimbo , Yuji Okuda , Shigeharu Ishikawa , Atsushi Mishima
发明人： Naoyuki Jimbo , Yuji Okuda , Shigeharu Ishikawa , Atsushi Mishima
IPC分类号： B24B1/00 , B24B7/22 , B24B37/30 , B24C1/04 , B24C3/32 , H01L21/463
CPC分类号： B24B37/30 , B24B7/228 , B24C1/04 , B24C3/322
摘要： A method for manufacturing a wafer holding plate for a wafer grinding apparatus wherein the plate includes a substrate having a wafer adhering surface to which a semiconductor wafer is adhered by an adhesive. The wafer adhering surface includes a mirror-like surface portion and a groove pattern, which anchors the adhesive. When the plate is used for grinding wafers, the quality and accuracy of the finished wafers is greatly improved.
摘要翻译：一种用于制造晶片研磨装置的晶片保持板的方法，其中所述板包括具有通过粘合剂粘附半导体晶片的晶片粘附表面的基板。晶片粘附表面包括将粘合剂锚固的镜面状部分和凹槽图案。当板用于研磨晶片时，成品晶圆的质量和精度大大提高。

4. 发明授权

US07029379B2 Wafer holding plate for wafer grinding apparatus and method for manufacturing the same 有权
标题翻译：晶片研磨装置的晶片保持板及其制造方法
公开(公告)号：US07029379B2
公开(公告)日：2006-04-18
申请号：US11175745
申请日：2005-07-06
申请人： Naoyuki Jimbo , Yuji Okuda , Shigeharu Ishikawa , Atsushi Mishima
发明人： Naoyuki Jimbo , Yuji Okuda , Shigeharu Ishikawa , Atsushi Mishima
IPC分类号： B24B1/00
CPC分类号： B24B37/30 , B24B7/228 , B24C1/04 , B24C3/322
摘要： A method for manufacturing a wafer holding plate for a wafer grinding apparatus wherein the plate includes a substrate having a wafer adhering surface to which a semiconductor wafer is adhered by an adhesive. The wafer adhering surface includes a mirror-like surface portion and a groove pattern, which anchors the adhesive. When the plate is used for grinding wafers, the quality and accuracy of the finished wafers is greatly improved.
摘要翻译：一种用于制造晶片研磨装置的晶片保持板的方法，其中所述板包括具有通过粘合剂粘附半导体晶片的晶片粘附表面的基板。晶片粘附表面包括将粘合剂锚固的镜面状部分和凹槽图案。当板用于研磨晶片时，成品晶圆的质量和精度大大提高。

5. 发明授权

US07040963B1 Table of wafer polishing apparatus, method for polishing semiconductor wafer, and method for manufacturing semiconductor wafer 有权
标题翻译：晶片抛光装置的表，半导体晶片的研磨方法以及半导体晶片的制造方法
公开(公告)号：US07040963B1
公开(公告)日：2006-05-09
申请号：US10018708
申请日：2000-06-15
申请人： Yuji Okuda , Naoyuki Jimbo , Kazutaka Majima , Masahiro Tsuji , Hideki Takagi , Shigeharu Ishikawa , Hiroyuki Yasuda
发明人： Yuji Okuda , Naoyuki Jimbo , Kazutaka Majima , Masahiro Tsuji , Hideki Takagi , Shigeharu Ishikawa , Hiroyuki Yasuda
IPC分类号： B24B1/00
CPC分类号： B24B55/02 , B24B37/015 , B24B37/12 , B24B37/14 , B24B37/16 , B24B41/047
摘要： A table for a wafer polishing apparatus having superior heat-resistant, anti-thermal-shock, and anti-abrasion characteristics and capable of increasing the diameter of a semiconductor wafer while improving the quality of the wafer. The table (2) includes a plurality of superimposed bases (11) each of which is formed of silicide ceramic or carbide ceramic. The bases (11) are joined together by an adhesive layer (14). A fluid passage (12) is formed in a joining interface between the bases (11).
摘要翻译：一种用于晶片抛光装置的桌子，其具有优异的耐热，抗热冲击和抗磨损特性，并且能够在提高晶片的质量的同时增加半导体晶片的直径。工作台（2）包括多个由硅化物陶瓷或碳化物陶瓷形成的重叠基座（11）。基底（11）通过粘合剂层（14）连接在一起。流体通道（12）形成在基部（11）之间的接合界面中。

6. 发明申请

US20050260938A1 Table of wafer polishing apparatus, method for polishing semiconductor wafer, and method for manufacturing semiconductor wafer 审中-公开
标题翻译：晶片抛光装置的表，半导体晶片的研磨方法以及半导体晶片的制造方法
公开(公告)号：US20050260938A1
公开(公告)日：2005-11-24
申请号：US11192846
申请日：2005-07-28
申请人： Yuji Okuda , Naoyuki Jimbo , Kazutaka Majima , Masahiro Tsuji , Hideki Takagi , Shigeharu Ishikawa , Hiroyuki Yasuda
发明人： Yuji Okuda , Naoyuki Jimbo , Kazutaka Majima , Masahiro Tsuji , Hideki Takagi , Shigeharu Ishikawa , Hiroyuki Yasuda
IPC分类号： B24B1/00 , B24B37/015 , B24B37/12 , B24B37/14 , B24B37/16 , B24B41/047 , B24B49/14
CPC分类号： B24B55/02 , B24B37/015 , B24B37/12 , B24B37/14 , B24B37/16 , B24B41/047
摘要： A table for a wafer polishing apparatus having superior heat-resistant, anti-thermal-shock, and anti-abrasion characteristics and capable of increasing the diameter of a semiconductor wafer while improving the quality of the wafer. The table includes a plurality of superimposed bases each of which is formed of silicide ceramic or carbide ceramic. The bases are joined together by an adhesive layer. A fluid passage is formed in a joining interface between the bases.
摘要翻译：一种用于晶片抛光装置的桌子，其具有优异的耐热，抗热冲击和抗磨损特性，并且能够在提高晶片的质量的同时增加半导体晶片的直径。该表包括多个叠加的基底，每个基底由硅化物陶瓷或碳化物陶瓷形成。基底通过粘合剂层连接在一起。在基座之间的接合界面中形成流体通道。

7. 发明申请

US20050260930A1 Table of wafer of polishing apparatus, method for polishing semiconductor wafer, and method for manufacturing semiconductor wafer 审中-公开
标题翻译：抛光装置的晶片表，半导体晶片的研磨方法以及半导体晶片的制造方法
公开(公告)号：US20050260930A1
公开(公告)日：2005-11-24
申请号：US11192821
申请日：2005-07-28
申请人： Yuji Okuda , Naoyuki Jimbo , Kazutaka Majima , Masahiro Tsuji , Hideki Takagi , Shigeharu Ishikawa , Hiroyuki Yasuda
发明人： Yuji Okuda , Naoyuki Jimbo , Kazutaka Majima , Masahiro Tsuji , Hideki Takagi , Shigeharu Ishikawa , Hiroyuki Yasuda
IPC分类号： B24B1/00 , B24B37/04 , B24B55/02
CPC分类号： B24B55/02 , B24B37/12
摘要： A table for a wafer polishing apparatus having superior heat-resistant, anti-thermal-shock, and anti-abrasion characteristics and capable of increasing the diameter of a semiconductor wafer while improving the quality of the wafer. The table includes a plurality of superimposed bases each of which is formed of silicide ceramic or carbide ceramic. The bases are joined together by an adhesive layer. A fluid passage is formed in a joining interface between the bases.
摘要翻译：一种用于晶片抛光装置的桌子，其具有优异的耐热，抗热冲击和抗磨损特性，并且能够在提高晶片的质量的同时增加半导体晶片的直径。该表包括多个叠加的基底，每个基底由硅化物陶瓷或碳化物陶瓷形成。基底通过粘合剂层连接在一起。在基座之间的接合界面中形成流体通道。

8. 发明授权

US5230036A Speech coding system utilizing a recursive computation technique for improvement in processing speed 失效
标题翻译：语音编码系统利用一种改进加工速度的计算技术
公开(公告)号：US5230036A
公开(公告)日：1993-07-20
申请号：US598989
申请日：1990-10-17
申请人： Masami Akamine , Yuji Okuda , Kimio Miseki
发明人： Masami Akamine , Yuji Okuda , Kimio Miseki
IPC分类号： G10L19/00 , G10L19/083 , G10L19/12 , G10L19/16
CPC分类号： G10L19/083 , G10L19/00 , G10L19/12 , G10L19/16
摘要： This invention provides a novel speech coding system which recursively executes a filter-applied "Toeplitz characteristic" by causing a drive signal (i.e., an excitation signal) to be converted into a "Toeplitz matrix" when detecting a pitch period in which distortion of the input vector and the vector subsequent to the application of filter-applied computation to the drive signal vector in the pitch forecast called either "closed loop" or "compatible code book" is minimized. The vector quantization method substantially making up the speech coding system of the invention is characteristically used by the system.

9. 发明授权

US09409478B2 Sway determination device and sway determination method 有权
标题翻译：摇摆确定装置和摇摆确定方法
公开(公告)号：US09409478B2
公开(公告)日：2016-08-09
申请号：US14416738
申请日：2012-07-26
申请人： Yuji Okuda , Shinya Kawamata
发明人： Yuji Okuda , Shinya Kawamata
IPC分类号： B60K28/06 , B60R16/02 , B60W40/08 , B60W50/14 , G08G1/16
CPC分类号： B60K28/066 , B60R16/02 , B60W40/08 , B60W50/14 , B60W2040/0827 , B60W2050/143 , B60W2540/18 , B60W2540/26 , B60W2710/20 , G08G1/167
摘要： A wobble determination device 1 appropriately determines the wobble of a vehicle and does not cause inconvenience for a driver.The wobble determination device 1 includes a steering determination unit 41 that determines whether the driver of a vehicle performs sudden steering after a non-steering state of the driver is maintained for a predetermined period of time and performs sudden return steering over a steering position in the non-steering state in a direction opposite to a direction of the sudden steering after the sudden steering and a wobble determination unit 42 that determines that the vehicle wobbles when the steering determination unit 41 determines that the steering of the driver is the sudden return steering which is performed over the steering position in the non-steering state.
摘要翻译：摆动判定装置1适当地确定车辆的摆动，并且不会对驾驶员造成不便。摆动判定装置1包括转向确定单元41，其确定驾驶员的非转向状态在驾驶员的非转向状态保持预定时间段之后是否执行突然转向，并且执行在转向位置上的突然返回转向在与突然转向后的突然转向方向相反的方向上的非转向状态以及当转向确定单元41确定驾驶员的转向是突然返回转向时确定车辆摆动的摆动判定单元42，在非转向状态下在转向位置上执行。

10. 发明授权

US09315194B2 Low-level consciousness determination system 有权
标题翻译：低层次意识确定体系
公开(公告)号：US09315194B2
公开(公告)日：2016-04-19
申请号：US14385350
申请日：2012-03-28
申请人： Yuji Okuda
发明人： Yuji Okuda
IPC分类号： G08B23/00 , B60W40/08 , B60W50/12 , G08B21/06
CPC分类号： B60W40/08 , B60W50/12 , B60W2040/0818 , B60W2530/14 , B60W2540/18 , B60W2550/146 , G08B21/06
摘要： The low-level consciousness determination system includes curved road determination means for determining whether a road on which the vehicle is traveling is a curved road and determining whether the vehicle is traveling on the outside of the curved road or on the inside of the curved road when the road is the curved road, threshold value setting means for setting different sudden steering determination threshold values when the curved road determination means determines that the road is not the curved road, when the curved road determination means determines that the vehicle is traveling on the outside of the curved road, and when the curved road determination means determines that the vehicle is traveling on the inside of the curved road, and sudden steering detection means for detecting the sudden steering on the basis of the threshold values set by the threshold value setting means after the non-steering state is detected.
摘要翻译：低级意识判定系统包括：曲线道路判定装置，用于判定车辆行驶的道路是否为弯道，并判断车辆是否在曲线路的外侧或曲线路的内侧行驶，所述道路是所述曲线路，所述阈值设定单元，当所述曲线路面判定单元判断为所述道路不是曲线路时，在所述曲线路面判定单元判断为所述车辆在外侧行驶时，设定不同的突然转向判定阈值并且当弯曲道路确定装置确定车辆在弯曲道路的内部行进时，以及用于基于由阈值设定装置设置的阈值来检测突然转向的突然转向检测装置在非转向状态被检测到之后。

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