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1. 发明授权

US09462698B2 Metallized substrate, metal paste composition, and method for manufacturing metallized substrate 有权
标题翻译：金属化基板，金属糊料组合物和金属化基板的制造方法
公开(公告)号：US09462698B2
公开(公告)日：2016-10-04
申请号：US13993463
申请日：2011-12-02
申请人： Naoto Takahashi , Yasuyuki Yamamoto , Emi Ushioda
发明人： Naoto Takahashi , Yasuyuki Yamamoto , Emi Ushioda
IPC分类号： H05K1/09 , H05K3/06 , H05K3/10 , H05K3/38 , H05K1/03
CPC分类号： H05K3/06 , H05K1/0306 , H05K1/092 , H05K3/108 , H05K3/388 , H05K2201/0317 , H05K2201/0338 , H05K2201/0341 , Y10T428/24967 , Y10T428/265
摘要： The present invention provides: a method for manufacturing a metallized substrate by which a fine pattern can be formed more easily; a metallized substrate manufactured by the method; and a metal paste composition to be used in the method. The metallized substrate has: a sintered nitride ceramic substrate (10); a titanium nitride layer (20) on the sintered substrate (10); an adhesion layer (30) on the titanium nitride layer (20); and a copper plating layer (40) on or above the adhesion layer (30), wherein the adhesion layer (30) contains copper and titanium, and has a thickness of no less than 0.1 μm and no more than 5 μm.
摘要翻译：本发明提供一种金属化基板的制造方法，能够更容易地形成精细图案，通过该方法制造的金属化基板; 以及该方法中使用的金属糊剂组合物。金属化基板具有：烧结氮化物陶瓷基板（10）; 在所述烧结基板（10）上的氮化钛层（20）; 在氮化钛层上的粘合层（30）; 以及在所述粘合层（30）上或上方的镀铜层（40），其中所述粘合层（30）含有铜和钛，并且具有不小于0.1μm且不大于5μm的厚度。

2. 发明申请

US20130256014A1 METALLIZED SUBSTRATE, METAL PASTE COMPOSITION, AND METHOD FOR MANUFACTURING METALLIZED SUBSTRATE 有权
标题翻译：金属化基材，金属组合物和制造金属化基材的方法
公开(公告)号：US20130256014A1
公开(公告)日：2013-10-03
申请号：US13993463
申请日：2011-12-02
申请人： Naoto Takahashi , Yasuyuki Yamamoto , Emi Ushioda
发明人： Naoto Takahashi , Yasuyuki Yamamoto , Emi Ushioda
IPC分类号： H05K3/06 , H05K1/09
CPC分类号： H05K3/06 , H05K1/0306 , H05K1/092 , H05K3/108 , H05K3/388 , H05K2201/0317 , H05K2201/0338 , H05K2201/0341 , Y10T428/24967 , Y10T428/265
摘要： The present invention provides: a method for manufacturing a metallized substrate by which a fine pattern can be formed more easily; a metallized substrate manufactured by the method; and a metal paste composition to be used in the method. The metallized substrate has: a sintered nitride ceramic substrate (10); a titanium nitride layer (20) on the sintered substrate (10); an adhesion layer (30) on the titanium nitride layer (20); and a copper plating layer (40) on or above the adhesion layer (30), wherein the adhesion layer (30) contains copper and titanium, and has a thickness of no less than 0.1 μm and no more than 5 μm.
摘要翻译：本发明提供一种金属化基板的制造方法，能够更容易地形成精细图案，通过该方法制造的金属化基板; 以及该方法中使用的金属糊剂组合物。金属化基板具有：烧结氮化物陶瓷基板（10）; 在所述烧结基板（10）上的氮化钛层（20）; 在氮化钛层上的粘合层（30）; 以及在所述粘合层（30）上或上方的铜镀层（40），其中所述粘合层（30）含有铜和钛，并且具有不小于0.1μm且不大于5μm的厚度。

3. 发明授权

US09215801B2 Via-holed ceramic substrate, metallized via-holed ceramic substrate, and method for manufacturing the same 有权
标题翻译：通孔孔陶瓷基板，金属化通孔孔陶瓷基板及其制造方法
公开(公告)号：US09215801B2
公开(公告)日：2015-12-15
申请号：US13818514
申请日：2011-12-02
申请人： Naoto Takahashi , Yasuyuki Yamamoto
发明人： Naoto Takahashi , Yasuyuki Yamamoto
IPC分类号： H05K1/16 , H05K1/03 , H05K3/40 , H01L23/15 , H01L23/498 , H05K3/00 , H01L33/62 , H05K3/24 , H05K1/09
CPC分类号： H05K1/0306 , H01L23/15 , H01L23/49827 , H01L33/62 , H01L2924/0002 , H05K1/092 , H05K3/0094 , H05K3/245 , H05K3/4061 , H05K2203/1476 , H01L2924/00
摘要： A via-holed ceramic substrate can be manufactured in a simple method by providing a via-holed ceramic substrate comprising: a sintered ceramic substrate; an electroconductive via formed in the sintered ceramic substrate, the electroconductive via having an electroconductive metal closely filled in a through-hole, the electroconductive metal containing a metal (A) having a melting point of 600° C. to 1100° C., a metal (B) having a melting point higher than the melting point of the metal (A), and an active metal; and an active layer formed in the interface between the electroconductive via and the sintered ceramic substrate.
摘要翻译：通孔孔陶瓷基板可以通过提供通孔孔陶瓷基板以简单的方法制造，包括：烧结陶瓷基板; 形成在烧结陶瓷基片中的导电通孔，导电孔通孔具有紧密填充在通孔中的导电金属，该导电金属含有熔点为600℃至1100℃的金属（A），熔点高于金属（A）的熔点的金属（B）和活性金属; 以及形成在导电通孔和烧结陶瓷基板之间的界面中的活性层。

4. 发明申请

US20130146340A1 VIA-HOLED CERAMIC SUBSTRATE, METALIIZED VIA-HOLED CERAMIC SUBSTRATE, AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：透明陶瓷基板，金属化透明陶瓷基板及其制造方法
公开(公告)号：US20130146340A1
公开(公告)日：2013-06-13
申请号：US13818514
申请日：2011-12-02
申请人： Naoto Takahashi , Yasuyuki Yamamoto
发明人： Naoto Takahashi , Yasuyuki Yamamoto
IPC分类号： H05K1/03 , H05K3/00
CPC分类号： H05K1/0306 , H01L23/15 , H01L23/49827 , H01L33/62 , H01L2924/0002 , H05K1/092 , H05K3/0094 , H05K3/245 , H05K3/4061 , H05K2203/1476 , H01L2924/00
摘要： A via-holed ceramic substrate can be manufactured in a simple method by providing a via-holed ceramic substrate comprising: a sintered ceramic substrate; an electroconductive via formed in the sintered ceramic substrate, the electroconductive via having an electroconductive metal closely filled in a through-hole, the electroconductive metal containing a metal (A) having a melting point of 600° C. to 1100° C., a metal (B) having a melting point higher than the melting point of the metal (A), and an active metal; and an active layer formed in the interface between the electroconductive via and the sintered ceramic substrate.
摘要翻译：通孔孔陶瓷基板可以通过提供通孔孔陶瓷基板以简单的方法制造，包括：烧结陶瓷基板; 形成在烧结陶瓷基片中的导电通孔，导电孔通孔具有紧密填充在通孔中的导电金属，该导电金属含有熔点为600℃至1100℃的金属（A），熔点高于金属（A）的熔点的金属（B）和活性金属; 以及形成在导电通孔和烧结陶瓷基板之间的界面中的活性层。

5. 发明授权

US09157631B2 Method for burning burner 有权
标题翻译：燃烧器燃烧方法
公开(公告)号：US09157631B2
公开(公告)日：2015-10-13
申请号：US13582020
申请日：2011-02-15
申请人： Tomoyuki Haneji , Kimio Iino , Yasuyuki Yamamoto , Yoshiyuki Hagihara
发明人： Tomoyuki Haneji , Kimio Iino , Yasuyuki Yamamoto , Yoshiyuki Hagihara
IPC分类号： F23C15/00 , F23C99/00 , F23L7/00 , F23N1/02
CPC分类号： F23C99/00 , F23C2205/00 , F23L7/007 , F23L2900/07007 , F23N1/022 , F23N2037/26 , Y02E20/344
摘要： The object of the present invention is to provide a method for burning a burner which has NOx reduction effects and has practical value, and a device therefore; the present invention provide A method for burning a burner in a heating furnace including a step of: periodically changing at least one of a flow rate of a fuel fluid and a flow rate of an oxidizing agent fluid which are supplied to the burner while periodically changing an oxygen concentration in the oxidizing agent fluid, thereby an oxygen ratio which is calculated by dividing an amount of oxygen supplied by a theoretical necessary amount of oxygen is periodically changed, and the periodical change of the oxygen ratio is made different from the periodical change of the oxygen concentration to cause combustion in periodically vibrational conditions.
摘要翻译：本发明的目的是提供一种燃烧具有NOx还原作用并具有实用价值的燃烧器的方法及其装置; 本发明提供一种用于在加热炉中燃烧燃烧器的方法，包括以下步骤：周期性地改变燃料流体的流量和供给到燃烧器的氧化剂流体的流量中的至少一种，同时周期性地改变氧化剂流体中的氧浓度，由此通过用理论必需量的氧气供给量除以氧气的比率而周期性地变化，并且使氧气比的周期性变化与周期性变化不同在周期性振动条件下引起燃烧的氧浓度。

6. 发明授权

US07825422B2 Ceramic substrate for mounting a light emitting element and method for manufacturing the same 有权
标题翻译：用于安装发光元件的陶瓷基板及其制造方法
公开(公告)号：US07825422B2
公开(公告)日：2010-11-02
申请号：US11660476
申请日：2005-08-16
申请人： Masakatsu Maeda , Yasuyuki Yamamoto
发明人： Masakatsu Maeda , Yasuyuki Yamamoto
IPC分类号： H01L33/58
CPC分类号： C04B41/009 , C04B41/5031 , C04B41/5063 , C04B41/5064 , C04B41/87 , C04B2111/80 , H01L33/60 , H01L33/641 , H01L2224/13 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H05K1/0274 , H05K1/0306 , H05K1/181 , H05K2201/017 , H05K2201/10106 , H05K2201/2054 , C04B41/0072 , C04B41/4556 , C04B41/4539 , C04B41/5045 , C04B35/58 , C04B35/581 , H01L2924/00014 , H01L2924/00
摘要： A ceramic substrate for mounting a light emitting element. The ceramic substrate has a placement surface for placing a light emitting element having an electrode; and an electrode electrically-connected with the electrode of the light emitting element, wherein the ceramic substrate comprises a substrate body consisting of a nitride ceramics; and a coat layer coating at least a part of a surface of the substrate body and consisting of a ceramics different from the nitride ceramics forming the substrate body; and the coat layer has an optical reflectance of 50% or more for any light having a wavelength of from 300 to 800 nm, which can increase a luminance of the light emitting element by reflecting the light emitted from the element efficiently with certainty, and which has a high heat radiation property; and a manufacturing method therefor.
摘要翻译：一种用于安装发光元件的陶瓷基板。陶瓷基板具有用于放置具有电极的发光元件的放置面; 以及与所述发光元件的电极电连接的电极，其中，所述陶瓷基板包括由氮化物陶瓷构成的基板主体; 以及涂覆在所述基板主体的表面的至少一部分上并由与形成所述基板主体的所述氮化物陶瓷不同的陶瓷构成的涂层; 并且涂层对于具有300至800nm波长的任何光都具有50％或更高的光学反射率，这可以通过有效地反映从元件发射的光来增加发光元件的亮度，并且其中具有较高的散热性能; 及其制造方法。

7. 发明申请

US20100167054A1 BURNER FOR PRODUCTION OF INORGANIC SPHEROIDIZED PARTICLE 有权
标题翻译：用于生产无机颗粒的燃烧器
公开(公告)号：US20100167054A1
公开(公告)日：2010-07-01
申请号：US12602408
申请日：2007-05-30
申请人： Yoshiyuki Hagihara , Kazuro Suzuki , Shinichi Miyake , Yasuyuki Yamamoto
发明人： Yoshiyuki Hagihara , Kazuro Suzuki , Shinichi Miyake , Yasuyuki Yamamoto
IPC分类号： F23D14/24 , B01J2/16 , C03C3/04
CPC分类号： F23D14/24 , F23D14/32 , Y02E20/344 , Y10T428/2982
摘要： A burner for production of inorganic spheroidized particles according to the present invention includes a raw material powder supply path that supplies raw material powder by using oxygen or an oxygen-enriched air as a carrier gas; a powder diffusion plate having a plurality of fine holes, which is provided at a downstream end of the raw material powder supply path; a raw material diffusion chamber that is formed in a diffusion pipe provided at a downstream end of the powder diffusion plate; a fuel supply path disposed around the outer circumference of the raw material powder supply path; an oxygen supply path disposed around the outer circumference of the fuel supply path; and a combustion chamber disposed at a downstream side of the raw material diffusion chamber, which has an inside diameter increasing along the downstream direction and communicates with the fuel supply path and the oxygen supply path.
摘要翻译：本发明的无机球状粒子的制造用燃烧器包括通过使用氧气或富氧空气作为载气而供给原料粉末的原料粉末供给路径，具有多个细孔的粉末扩散板，其设置在原料粉末供给路径的下游端; 原料扩散室，其形成在设置在所述粉末扩散板的下游端的扩散管中; 燃料供给路径，设置在原料粉末供给路径的外周附近; 设置在燃料供给路径的外周的供氧路径; 以及设置在所述原料扩散室的下游侧的燃烧室，所述燃烧室的内径沿着所述下游方向增大并与所述燃料供给路径和所述氧气供给路径连通。

8. 发明申请

US20080145518A1 Element Mounting Substrate and Method for Manufacturing Same 有权
标题翻译：元件安装基板及其制造方法
公开(公告)号：US20080145518A1
公开(公告)日：2008-06-19
申请号：US11791595
申请日：2005-11-18
申请人： Masakatsu Maeda , Yasuyuki Yamamoto , Kunihiro Gotoh
发明人： Masakatsu Maeda , Yasuyuki Yamamoto , Kunihiro Gotoh
IPC分类号： B05D5/12
CPC分类号： H01L23/49822 , H01L21/4857 , H01L33/486 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K3/28 , H05K3/3452 , H05K2201/017 , H01L2924/00
摘要： An element-mounting substrate includes a ceramic substrate, an electrode layer formed on the substrate and a ceramic coating layer which is formed on a part of the electrode layer and has a thickness of 5 to 50 μm. A process for producing the element-mounting substrate includes the steps of forming an electrode precursor layer in the shape of a pattern of an electrode layer on a ceramic plate or a green sheet of a large diameter, forming a ceramic coating precursor layer on a part of the electrode precursor layer and then firing the resulting precursor. In this process, it is preferable to form the ceramic coating layer so as to cover the electrode layer on a predetermined cutting line of the firing product. According to the element-mounting substrate in which a part of the electrode layer is covered with a ceramic, a failure in mounting an element attributable to the thickness of the ceramic coating layer can be prevented when the element is mounted. In addition, peeling or cracking of the electrode layer caused by impact during dicing can be prevented.
摘要翻译：元件安装衬底包括陶瓷衬底，形成在衬底上的电极层和形成在电极层的一部分上并具有5至50μm厚度的陶瓷涂层。一种用于制造元件安装基板的方法包括以下步骤：在陶瓷板或大直径的生片上形成电极层图案形状的电极前体层，在部件上形成陶瓷涂层前体层的电极前体层，然后烧结所得的前体。在该方法中，优选形成陶瓷被覆层，以覆盖烧制品的规定切断线上的电极层。根据其中电极层的一部分被陶瓷覆盖的元件安装基板，当安装元件时，可以防止由于陶瓷涂层的厚度而导致的元件的安装失败。此外，可以防止由切割期间的冲击引起的电极层的剥离或破裂。

9. 发明授权

US06659860B1 Game device, game machine operation device and game system which employ a half-duplex serial communication system and game device two-way communication method 失效
标题翻译：采用半双工串行通信系统和游戏机双向通信方式的游戏机，游戏机操作装置及游戏系统
公开(公告)号：US06659860B1
公开(公告)日：2003-12-09
申请号：US09303580
申请日：1999-05-03
申请人： Yasuyuki Yamamoto , Hideaki Io , Makoto Tanaka
发明人： Yasuyuki Yamamoto , Hideaki Io , Makoto Tanaka
IPC分类号： A63F1300
CPC分类号： A63F13/23 , A63F13/06 , A63F2300/1025 , G06F3/038 , H04L29/06 , H04L67/38 , H04L69/18
摘要： In a game system such as a television game system, a television game machine main unit includes a protocol controller and each game operation device connected to the television game machine unit via a serial port also has a protocol controller. The television game machine main unit when connected to a game operation device which has a unique identifier, combines a communication protocol that transmits and receives data for each character with a communication protocol which transmits or receives data for two or more characters in a row and switches the communication protocol which corresponds to that game operation device based on the identifier thereof to minimize the amount of information required between the television game machine main unit and the game operation device.
摘要翻译：在诸如电视游戏系统的游戏系统中，电视游戏机主单元包括协议控制器，并且经由串行端口连接到电视游戏机单元的每个游戏操作设备也具有协议控制器。当连接到具有唯一标识符的游戏操作装置时，电视游戏机主单元组合了用于发送和接收每个字符的数据的通信协议，该通信协议用于发送或接收一行中两个或更多个字符的数据并且切换基于其标识符对应于该游戏操作装置的通信协议，以最小化电视游戏机主机和游戏操作装置之间所需的信息量。

10. 发明授权

US5097249A Power status detecting apparatus 失效
标题翻译：电源状态检测装置
公开(公告)号：US5097249A
公开(公告)日：1992-03-17
申请号：US522725
申请日：1990-05-14
申请人： Yasuyuki Yamamoto
发明人： Yasuyuki Yamamoto
IPC分类号： H02J3/00 , H02J13/00 , H04B1/16 , H04B1/20 , H04Q9/00
CPC分类号： H02J13/0065 , H04B1/1607 , H04B1/205 , Y10T307/832
摘要： A power status detecting apparatus which is to be applied to a plurality of audio-visual equipments arranged such that currents flowing to AC lines of the respective equipments are detected so as to identify the power condition status of the respective equipments and in which identified information are supplied to a system control apparatus. Thus, system control for a plurality of equipments can be performed more positively and conveniently.

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