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1. 发明申请

US20100261314A1 THERMOSETTING DIE BONDING FILM 审中-公开
标题翻译：热敏胶带
公开(公告)号：US20100261314A1
公开(公告)日：2010-10-14
申请号：US12755810
申请日：2010-04-07
申请人： Naohide Takamoto , Yuuichirou Shishido
发明人： Naohide Takamoto , Yuuichirou Shishido
IPC分类号： H01L21/77 , H01L21/60 , B32B15/098
CPC分类号： H01L21/78 , C08L33/12 , C08L61/00 , C08L63/00 , C08L2203/162 , C08L2205/03 , H01L24/29 , H01L24/33 , H01L24/45 , H01L24/73 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29311 , H01L2224/29316 , H01L2224/29318 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29364 , H01L2224/29371 , H01L2224/29386 , H01L2224/29393 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2225/06565 , H01L2225/06568 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/10253 , H01L2924/15747 , H01L2924/15788 , H01L2924/181 , H01L2924/3025 , Y10T428/2874 , C08L2666/04 , H01L2924/00014 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2924/05442 , H01L2924/05432 , H01L2924/0532 , H01L2924/04642 , H01L2924/05042 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： The present invention has been made and an object thereof is to provide a thermosetting die-bonding film which can remarkably reduce working hours at the time of die bonding of a semiconductor chip, and a dicing die-bonding film including the thermosetting die-bonding film and a dicing film layered to each other. The present invention relates to a thermosetting die-bonding film used to produce a semiconductor device, comprising a thermosetting catalyst in a non-crystalline state in an amount within a range from 0.2 to 1 part by weight based on 100 parts by weight of an organic component in the film.
摘要翻译：本发明的目的在于提供一种能够显着降低半导体芯片的芯片接合时的工作时间的热固性芯片接合薄膜和包括热固性芯片接合薄膜的切割芯片接合薄膜和切割膜彼此层叠。本发明涉及一种用于制造半导体器件的热固性芯片接合膜，其包含基于100重量份的有机物的0.2〜1重量份的非结晶状态的热固性催化剂电影中的组成部分。

2. 发明申请

US20110057331A1 THERMOSETTING DIE BONDING FILM, DICING DIE BONDING FILM AND SEMICONDUCTOR DEVICE 审中-公开
标题翻译：热熔胶带，二极管接合膜和半导体器件
公开(公告)号：US20110057331A1
公开(公告)日：2011-03-10
申请号：US12875383
申请日：2010-09-03
申请人： Miki Hayashi , Shumpei Tanaka , Kenji Oonishi , Yuuichirou Shishido , Kouichi Inoue
发明人： Miki Hayashi , Shumpei Tanaka , Kenji Oonishi , Yuuichirou Shishido , Kouichi Inoue
IPC分类号： H01L23/52
CPC分类号： H01L21/6836 , C09J7/22 , C09J7/38 , C09J2203/326 , C09J2433/00 , C09J2461/00 , C09J2463/00 , H01L24/45 , H01L24/73 , H01L2221/68336 , H01L2221/68381 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/85207 , H01L2924/01012 , H01L2924/01015 , H01L2924/01047 , H01L2924/10253 , H01L2924/15747 , H01L2924/181 , H01L2924/3025 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2924/00014
摘要： An object of the present invention is to provide a thermosetting die-bonding film with which a die-bonding film is suitably broken with a tensile force. The object is achieved by a thermosetting die-bonding, film at least having an adhesive layer that is used to fix a semiconductor chip to an adherend, in which the breaking energy per unit area is 1 J/mm2 or less and the elongation at break is 40% or more to 500% or less at room temperature before thermal setting.
摘要翻译：本发明的一个目的是提供一种热塑性芯片接合薄膜，通过该热固性芯片接合薄膜，该拉伸粘合薄膜被适当地断裂。该目的通过热固性芯片接合来实现，其中至少具有用于将半导体芯片固定到被粘物上的粘合剂层，其中每单位面积的断裂能为1J / mm 2或更小，断裂伸长率在热固化之前的室温下为40％以上至500％以下。

3. 发明申请

US20110074050A1 FILM FOR SEMICONDUCTOR DEVICE 审中-公开
标题翻译：半导体器件薄膜
公开(公告)号：US20110074050A1
公开(公告)日：2011-03-31
申请号：US12890909
申请日：2010-09-27
申请人： Yasuhiro Amano , Yuuichirou Shishido , Kouichi Inoue
发明人： Yasuhiro Amano , Yuuichirou Shishido , Kouichi Inoue
IPC分类号： B32B33/00 , H01L29/00
CPC分类号： H01L21/67132 , Y10T428/14
摘要： The present invention provides a film for a semiconductor device, which is capable of preventing interface delamination between each of the films, a film lifting phenomenon, and transfer of the adhesive film onto the cover film even during transportation or after long-term storage in a low temperature condition. The film for a semiconductor device of the present invention is a film in which an adhesive film and a cover film are sequentially laminated on a dicing film, in which a peel force F1 between the adhesive film and the cover film in a T type peeling test is within a range of 0.025 to 0.075 N/100 mm, a peel force F2 between the adhesive film and the dicing film is within a range of 0.08 to 10 N/100 mm, and F1 and F2 satisfy a relationship of F1
摘要翻译：本发明提供一种半导体装置用薄膜，其能够防止各膜之间的界面分层，膜提起现象，以及即使在运输过程中或长期储存后也将胶粘剂膜转印到覆盖膜上低温条件。本发明的半导体装置用薄膜是将粘接薄膜和覆盖薄膜依次层叠在切断薄膜上的薄膜，在T型剥离试验中粘合薄膜与覆盖薄膜的剥离力F1 在0.025〜0.075N / 100mm的范围内，粘合膜与切割膜之间的剥离力F2在0.08〜10N / 100mm的范围内，F1和F2满足F1

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