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1. 发明申请

US20120153508A1 THERMOSETTING DIE-BONDING FILM 审中-公开
标题翻译：热成型贴膜
公开(公告)号：US20120153508A1
公开(公告)日：2012-06-21
申请号：US13141765
申请日：2009-12-22
申请人： Miki Hayashi , Naohide Takamoto , Kenji Oonishi
发明人： Miki Hayashi , Naohide Takamoto , Kenji Oonishi
IPC分类号： H01L23/488 , H01L21/60 , H01L21/78 , C08L63/00
CPC分类号： H01L23/3121 , C08L33/08 , C08L63/00 , C08L2666/22 , C09J7/10 , C09J133/08 , C09J161/06 , C09J163/00 , C09J2201/36 , C09J2203/326 , C09J2433/00 , C09J2463/00 , H01L21/565 , H01L23/293 , H01L23/296 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L25/0657 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29386 , H01L2224/32014 , H01L2224/32145 , H01L2224/32225 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83855 , H01L2224/85207 , H01L2224/92 , H01L2224/92247 , H01L2225/0651 , H01L2225/06575 , H01L2924/00013 , H01L2924/014 , H01L2924/04953 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/15788 , H01L2924/181 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2924/05442 , H01L2924/0532 , H01L2924/05432 , H01L2924/05032 , H01L2924/0503 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2924/20752
摘要： An object of the present invention is to provide a thermosetting die-bonding film having both storage modulus and high adhering strength that are necessary in manufacturing a semiconductor device and to provide a dicing die-bonding film including the thermosetting die-bonding film. The thermosetting die-bonding film of the present invention is a thermosetting die-bonding film that is used in manufacture of a semiconductor device and includes at least an epoxy resin, a phenol resin, an acrylic copolymer, and a filler, has a storage modulus at 80 to 140° C. before thermal curing in a range of 10 kPa to 10 MPa and a storage modulus at 175° C. before thermal curing in a range of 0.1 to 3 MPa.
摘要翻译：本发明的目的是提供一种在制造半导体器件中所需的储能模量和高粘附强度的热固性芯片接合薄膜，并提供包括该热固性芯片接合薄膜的切割芯片接合薄膜。本发明的热固性芯片接合薄膜是用于制造半导体器件的至少包含环氧树脂，酚醛树脂，丙烯酸共聚物和填料的热固性芯片接合薄膜，具有储能模量在热固化前，在10〜10MPa的范围内，在80〜140℃下进行热固化，在热固化前的储能模量为175℃，为0.1〜3MPa。

2. 发明申请

US20090112432A1 VEHICLE CONTROLLER AND CONTROL METHOD 有权
标题翻译：车辆控制器和控制方法
公开(公告)号：US20090112432A1
公开(公告)日：2009-04-30
申请号：US12252228
申请日：2008-10-15
申请人： Kiyoshiro UEOKA , Kenji OONISHI
发明人： Kiyoshiro UEOKA , Kenji OONISHI
IPC分类号： B60T8/52 , G06F17/00
CPC分类号： B60T7/122 , B60L15/2063 , B60L15/2081 , B60T2201/06 , Y02T10/645 , Y02T10/72 , Y02T10/7275
摘要： An ECU releases brake hold control when an actual accelerator pedal position A exceeds a predetermined position A(0) while the brake hold control is being executed. Further, the ECU determines whether or not the actual accelerator pedal position A is larger than a position A(1), which is a value smaller than the predetermined position A(0), and if it is larger than the predetermined position A(1), executes a process for increasing a creep torque reflection ratio R to recover creep force that has been stopped.
摘要翻译：当执行制动保持控制时，当实际的加速器踏板位置A超过预定位置A（0）时，ECU释放制动保持控制。此外，ECU判定实际的加速踏板位置A是否大于比规定位置A（0）小的值的位置A（1），如果大于预定位置A（1）），执行用于增加蠕变扭矩反射率R以恢复已经停止的蠕变力的处理。

3. 发明申请

US20140288740A1 CONTROL APPARATUS FOR HYBRID VEHICLE 审中-公开
标题翻译：混合动力车的控制装置
公开(公告)号：US20140288740A1
公开(公告)日：2014-09-25
申请号：US14219341
申请日：2014-03-19
申请人： Daisuke ITOYAMA , Hideaki YAGUCHI , Koji HOKOI , Kenji OONISHI , Hiroki ENDO , Kazuma AOKI , Mikihisa ARAI
发明人： Daisuke ITOYAMA , Hideaki YAGUCHI , Koji HOKOI , Kenji OONISHI , Hiroki ENDO , Kazuma AOKI , Mikihisa ARAI
IPC分类号： B60W20/00 , B60W10/30 , B60W10/06
CPC分类号： B60W10/30 , B60W10/06 , B60W20/18 , B60W2710/0644 , Y10S903/93
摘要： A control apparatus for a hybrid vehicle includes an engine for traveling, a motor for traveling, and a battery exchanging electric power with the motor. the control apparatus including: a heater is configured to perform heating inside a cabin of the hybrid vehicle by using the engine or an electric heat source as a heat source; and a controller is configured to operate the engine intermittently, the controller is configured to select the heat source for the heater, the controller is configured to determine whether or not a fuel for the engine is degraded when the engine is stopped, and the controller is configured to start the engine and select the engine as the heat source when the controller determines that the fuel is degraded.
摘要翻译：一种用于混合动力车辆的控制装置包括用于行驶的发动机，用于行驶的电动机和与电动机的电池更换电力。所述控制装置包括：加热器，其通过使用所述发动机或电热源作为热源来进行所述混合动力车辆的车厢内的加热; 并且控制器被配置为间歇地操作发动机，控制器被配置为选择加热器的热源，控制器被配置为确定当发动机停止时发动机的燃料是否劣化，并且控制器是配置为当控制器确定燃料劣化时启动发动机并选择发动机作为热源。

4. 发明授权

US08779586B2 Die bond film, dicing die bond film, and semiconductor device 失效
标题翻译：芯片接合膜，切割芯片接合膜和半导体器件
公开(公告)号：US08779586B2
公开(公告)日：2014-07-15
申请号：US13036277
申请日：2011-02-28
申请人： Kenji Oonishi , Miki Hayashi , Kouichi Inoue , Yuichiro Shishido
发明人： Kenji Oonishi , Miki Hayashi , Kouichi Inoue , Yuichiro Shishido
IPC分类号： H01L25/11
CPC分类号： H01L24/27 , C09J7/10 , C09J2203/326 , C09J2433/00 , C09J2461/00 , C09J2463/00 , H01L21/6836 , H01L23/3121 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L25/0657 , H01L2224/27436 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29386 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73215 , H01L2224/73265 , H01L2224/83191 , H01L2224/85206 , H01L2224/85207 , H01L2224/92247 , H01L2225/0651 , H01L2225/06568 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01051 , H01L2924/01057 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/10253 , H01L2924/181 , H01L2924/20103 , H01L2924/20104 , H01L2924/20105 , H01L2924/20106 , H01L2924/3025 , Y10T428/24959 , Y10T428/28 , Y10T428/2848 , Y10T428/287 , H01L2924/00014 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2924/05442 , H01L2924/0532 , H01L2924/05432 , H01L2924/05032 , H01L2924/0503 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： The present invention provides a die bond film for adhering, onto a semiconductor element that is electrically connected to an adherend with a bonding wire, another semiconductor element and that enables loading of the other semiconductor element and improvement in the manufacturing yield of a semiconductor device by preventing deformation and cutting of the bonding wire, and a dicing die bond film. The die bond film of the present invention is a die bond film for adhering, onto a semiconductor element that is electrically connected to an adherend with a bonding wire, another semiconductor element, in which at least a first adhesive layer that enables a portion of the bonding wire to pass through inside thereof by burying the portion upon press bonding and a second adhesive layer that prevents the other semiconductor element from contacting with the bonding wire are laminated.
摘要翻译：本发明提供一种芯片接合薄膜，用于通过接合线与另一个半导体元件电连接到与被粘物电连接的半导体元件上，并且能够通过以下方式将其它半导体元件加载并提高半导体器件的制造成品率防止接合线的变形和切断，以及切割模接合膜。本发明的芯片接合薄膜是一种芯片接合薄膜，用于将至少一个第一粘合剂层粘合到与接合线电连接到被粘物的半导体元件上，接合线通过在压接时埋入该部分而通过其内部，并且层压防止另一半导体元件与接合线接触的第二粘合层。

5. 发明申请

US20110210455A1 DIE BOND FILM, DICING DIE BOND FILM, AND SEMICONDUCTOR DEVICE 失效
标题翻译： DIE BOND FILM，DICING DIE BOND FILM，和SEMICONDUCTOR DEVICE
公开(公告)号：US20110210455A1
公开(公告)日：2011-09-01
申请号：US13036277
申请日：2011-02-28
申请人： Kenji Oonishi , Miki Hayashi , Kouichi Inoue , Yuichiro Shishido
发明人： Kenji Oonishi , Miki Hayashi , Kouichi Inoue , Yuichiro Shishido
IPC分类号： H01L23/00 , B32B27/38 , C09J7/00 , B32B7/12
CPC分类号： H01L24/27 , C09J7/10 , C09J2203/326 , C09J2433/00 , C09J2461/00 , C09J2463/00 , H01L21/6836 , H01L23/3121 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L25/0657 , H01L2224/27436 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29386 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73215 , H01L2224/73265 , H01L2224/83191 , H01L2224/85206 , H01L2224/85207 , H01L2224/92247 , H01L2225/0651 , H01L2225/06568 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01051 , H01L2924/01057 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/10253 , H01L2924/181 , H01L2924/20103 , H01L2924/20104 , H01L2924/20105 , H01L2924/20106 , H01L2924/3025 , Y10T428/24959 , Y10T428/28 , Y10T428/2848 , Y10T428/287 , H01L2924/00014 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2924/05442 , H01L2924/0532 , H01L2924/05432 , H01L2924/05032 , H01L2924/0503 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： The present invention provides a die bond film for adhering, onto a semiconductor element that is electrically connected to an adherend with a bonding wire, another semiconductor element and that enables loading of the other semiconductor element and improvement in the manufacturing yield of a semiconductor device by preventing deformation and cutting of the bonding wire, and a dicing die bond film. The die bond film of the present invention is a die bond film for adhering, onto a semiconductor element that is electrically connected to an adherend with a bonding wire, another semiconductor element, in which at least a first adhesive layer that enables a portion of the bonding wire to pass through inside thereof by burying the portion upon press bonding and a second adhesive layer that prevents the other semiconductor element from contacting with the bonding wire are laminated.
摘要翻译：本发明提供一种芯片接合薄膜，用于通过接合线与另一个半导体元件电连接到与被粘物电连接的半导体元件上，并且能够通过以下方式将其它半导体元件加载并提高半导体器件的制造成品率防止接合线的变形和切断，以及切割模接合膜。本发明的芯片接合薄膜是一种芯片接合薄膜，用于将至少一个第一粘合剂层粘合到与接合线电连接到被粘物的半导体元件上，接合线通过在压接时埋入该部分而通过其内部，并且层压防止另一半导体元件与接合线接触的第二粘合层。

6. 发明授权

US06838927B2 Semiconductor integrated circuit with stabilizing capacity 失效
标题翻译：具有稳定容量的半导体集成电路
公开(公告)号：US06838927B2
公开(公告)日：2005-01-04
申请号：US10330171
申请日：2002-12-30
申请人： Kenji Oonishi
发明人： Kenji Oonishi
IPC分类号： H01L27/04 , G05F1/46 , H01L21/822 , H03K3/01
CPC分类号： G05F1/465
摘要： A semiconductor integrated circuit with stabilizing capacity has a voltage drop circuit that drops a power supply voltage to a first voltage Vcc1 and supplies the Vcc1 to a plurality of function blocks; a stabilizing capacity that stabilizes the Vcc1; and a plurality of voltage switching circuits each of which is provided in each of the function blocks and selectively switches between the Vcc1 and a base voltage Vss to produce a second voltage Vcc2 and supplies the Vcc2 to each function block, and each of the function blocks forms a capacity for stabilizing an output of the voltage drop circuit by means of its semiconductor structure by the Vcc1 and the Vcc2 applied thereto.
摘要翻译：具有稳定容量的半导体集成电路具有将电源电压降低到第一电压Vcc1并将Vcc1提供给多个功能块的电压降电路; 稳定Vcc1的稳定能力; 以及多个电压切换电路，每个电压切换电路设置在每个功能块中，并且选择性地在Vcc1和基极电压Vss之间切换以产生第二电压Vcc2，并将Vcc2提供给每个功能块，并且每个功能块形成通过其施加到其上的Vcc1和Vcc2通过其半导体结构稳定电压降电路的输出的能力。

7. 发明授权

US09630615B2 Hybrid vehicle and control method therefor 有权
公开(公告)号：US09630615B2
公开(公告)日：2017-04-25
申请号：US14219428
申请日：2014-03-19
申请人： Kenji Oonishi , Koji Hokoi , Daisuke Itoyama , Hiroki Endo , Kazuma Aoki , Hideaki Yaguchi , Mikihisa Arai
发明人： Kenji Oonishi , Koji Hokoi , Daisuke Itoyama , Hiroki Endo , Kazuma Aoki , Hideaki Yaguchi , Mikihisa Arai
IPC分类号： B60L9/00 , B60W20/15 , B60W20/40 , B60W50/08 , B60W20/50 , B60W20/18 , B60K6/20 , B60W10/08
CPC分类号： B60W20/15 , B60K6/20 , B60W10/08 , B60W20/18 , B60W20/40 , B60W20/50 , B60W50/082 , B60W2400/00 , B60W2560/04 , B60W2710/08 , B60Y2300/182 , Y02T10/6239 , Y02T10/6286 , Y02T10/7077 , Y02T10/84 , Y10S903/902 , Y10S903/93
摘要： A hybrid vehicle includes: an engine configured to output power for traveling; a motor configured to output power for traveling; a switch configured to set a fuel economy priority mode, in which priority is given to fuel economy, and to cancel the fuel economy priority mode; and a controller configured (a) to operate the engine and the motor based on the switch setting; (b) to determine the presence/absence of degradation of fuel supplied to the engine; and (c) to prohibit setting of the fuel economy priority mode by the switch subsequently when determination is made that the fuel has degraded when the hybrid vehicle travels using power of the motor in a state in which the drive of the engine is stopped.

8. 发明申请

US20110190421A1 ADHESIVE COMPOSITION FOR PRODUCING SEMICONDUCTOR DEVICE, AND ADHESIVE SHEET FOR PRODUCING SEMICONDUCTOR DEVICE 审中-公开
标题翻译：用于制造半导体器件的粘合组合物和用于生产半导体器件的粘合片
公开(公告)号：US20110190421A1
公开(公告)日：2011-08-04
申请号：US13018619
申请日：2011-02-01
申请人： Yuta KIMURA , Yasushi INOUE , Takeshi MATSUMURA , Kenji OONISHI , Yuichiro SHISHIDO
发明人： Yuta KIMURA , Yasushi INOUE , Takeshi MATSUMURA , Kenji OONISHI , Yuichiro SHISHIDO
IPC分类号： C08L63/00
CPC分类号： C08L63/00 , H01L24/29 , H01L2924/181 , H01L2924/351 , H01L2924/00
摘要： Provided is an adhesive composition into which an additive for capturing a cation is incorporated, thereby making it possible to form a semiconductor-device-producing adhesive sheet capable of preventing deterioration of the electrical characteristic of a produced semiconductor device so as to improve the product reliability of the device. An adhesive composition, for producing a semiconductor device, which contains at least an additive for capturing a cation.
摘要翻译：提供一种其中并入有用于捕获阳离子的添加剂的粘合剂组合物，从而可以形成能够防止所制造的半导体器件的电特性劣化的半导体器件制造粘合片，从而提高产品可靠性的设备。一种用于制造半导体器件的粘合剂组合物，其至少包含用于捕获阳离子的添加剂。

9. 发明申请

US20110120614A1 THERMOSETTING ADHESIVE FILM, ADHESIVE FILM WITH DICING FILM, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE THERMOSETTING ADHESIVE FILM OR THE ADHESIVE FILM WITH DICING FILM 审中-公开
标题翻译：热固性胶膜，带薄膜的粘合膜，以及使用热固性胶膜制造半导体器件的方法或带有薄膜的粘合膜
公开(公告)号：US20110120614A1
公开(公告)日：2011-05-26
申请号：US12948992
申请日：2010-11-18
申请人： Yuki Sugo , Kouichi Inoue , Kenji Oonishi
发明人： Yuki Sugo , Kouichi Inoue , Kenji Oonishi
IPC分类号： H01L21/50 , B32B5/00 , B32B3/00 , C09J7/00 , C09J7/02
CPC分类号： C08G59/621 , C08L33/00 , C08L33/08 , C08L61/04 , C08L63/00 , C08L63/08 , C08L71/00 , C08L2205/03 , C08L2666/02 , C09J7/10 , C09J133/08 , C09J161/06 , C09J163/00 , C09J2201/61 , C09J2203/326 , C09J2433/00 , C09J2461/00 , C09J2463/00 , H01L21/561 , H01L23/3121 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L24/92 , H01L2224/29023 , H01L2224/2919 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73215 , H01L2224/73265 , H01L2224/83097 , H01L2224/83191 , H01L2224/83855 , H01L2224/85097 , H01L2224/85205 , H01L2224/9205 , H01L2224/92165 , H01L2224/92247 , H01L2224/94 , H01L2924/00013 , H01L2924/00014 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01029 , H01L2924/01047 , H01L2924/15747 , H01L2924/15788 , H01L2924/181 , H01L2924/3025 , Y10T156/10 , Y10T428/24355 , Y10T428/265 , H01L2224/27 , H01L2924/00 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/3512 , H01L2924/00012 , H01L2224/85399
摘要： The present invention provides a thermosetting adhesive film that is capable of improving the package reliability by preventing damage of a semiconductor chip due to pressure during die bonding of the film having a configuration where a filler is not substantially added, preventing a decrease of tensile storage modulus and preventing generation of warping due to heat shrinkage during thermosetting. It is a thermosetting adhesive film used at the time of manufacturing a semiconductor device, the film having a tensile storage modulus at 260° C. after thermosetting of 2×105 to 5×107 Pa, a content of a filler of 0.1% by weight or less based on the entire thermosetting adhesive film, and a thickness of 1 to 10 μm.
摘要翻译：本发明提供一种热固性粘合剂膜，其能够通过防止由于在具有未充分填充填料的构造的膜的芯片接合期间的压力导致的半导体芯片的损坏而提高封装可靠性，防止了拉伸储能模量的降低并且防止由于热固化期间的热收缩而产生翘曲。作为制造半导体装置时使用的热固性粘合膜，该膜在2×105〜5×107Pa的热固化后的拉伸储能模量为260℃，填料的含量为0.1重量％或更低，基于整个热固性粘合剂膜，厚度为1至10μm。

10. 发明申请

US20100314782A1 DICING TAPE-INTEGRATED FILM FOR SEMICONDUCTOR BACK SURFACE 审中-公开
标题翻译：用于半导体背面的双面胶带
公开(公告)号：US20100314782A1
公开(公告)日：2010-12-16
申请号：US12814745
申请日：2010-06-14
申请人： Kenji OONISHI , Naohide TAKAMOTO
发明人： Kenji OONISHI , Naohide TAKAMOTO
IPC分类号： H01L21/50 , B32B7/10 , H01L23/48
CPC分类号： H01L21/6836 , C09J7/20 , C09J2203/326 , H01L21/67132 , H01L23/544 , H01L2221/68327 , H01L2221/68336 , H01L2223/54473 , H01L2224/16 , H01L2224/27436 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01019 , H01L2924/0102 , H01L2924/01025 , H01L2924/01046 , H01L2924/01079 , Y10T428/28 , H01L2224/0401
摘要： The present invention provides a dicing tape-integrated film for semiconductor back surface, including: a dicing tape including a base material and a pressure-sensitive adhesive layer provided on the base material; and a film for flip chip type semiconductor back surface provided on the pressure-sensitive adhesive layer, in which the film for flip chip type semiconductor back surface is formed of a resin composition containing a thermosetting resin component and, as an optional component, a thermoplastic resin component in an amount of less than 50% by weight relative to the whole amount of resin components.
摘要翻译：本发明提供了一种半导体背面用切割带一体化膜，其特征在于，包括：切割带，其包括基材和设置在基材上的粘合剂层; 以及设置在压敏粘合剂层上的倒装芯片型半导体背面的膜，其中用于倒装芯片型半导体背表面的膜由含有热固性树脂组分的树脂组合物和作为任选组分的热塑性塑料树脂组分的量相对于树脂组分的总量小于50重量％。

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