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    • 6. 发明授权
    • Semiconductor memory device for high speed reading and writing
    • 半导体存储器件,用于高速读写
    • US09152594B2
    • 2015-10-06
    • US13547799
    • 2012-07-12
    • Nakaba KaiwaYoshinori Matsui
    • Nakaba KaiwaYoshinori Matsui
    • G06F13/36G06F13/40
    • G06F13/40G06F13/4059
    • A semiconductor memory device includes a memory cell array section including a plurality of memory cell arrays, a peripheral circuit section, and an internal bus connecting the plurality of memory cell arrays and the peripheral circuit section. The peripheral circuit section includes external input/output buffers, and bus interface circuits. The bus interface circuits execute conversion between data inputted/outputted in parallel to/from the memory cell arrays through the internal bus and data inputted/outputted in serial through the plurality of external input/output buffers. The bus interface circuits are densely arranged between the internal bus and the input/output buffers, so that a width d1 of the area of the plurality of bus interface circuits being arranged is narrower than a width d2 of the area of the external input/output buffers being arranged and a bus width maximum value d3 of the internal bus.
    • 半导体存储器件包括存储单元阵列部分,其包括多个存储单元阵列,外围电路部分和连接多个存储单元阵列和外围电路部分的内部总线。 外围电路部分包括外部输入/输出缓冲器和总线接口电路。 总线接口电路通过内部总线和通过多个外部输入/输出缓冲器以串行方式输入/输出的数据在与存储单元阵列并行输入/输出的数据之间执行转换。 总线接口电路密集地布置在内部总线和输入/输出缓冲器之间,使得布置的多个总线接口电路的区域的宽度d1比外部输入/输出区域的宽度d2窄 布置的缓冲器和内部总线的总线宽度最大值d3。