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    • 5. 发明授权
    • Semiconductor memory device and method of manufacturing the same
    • 半导体存储器件及其制造方法
    • US5400278A
    • 1995-03-21
    • US114229
    • 1993-09-01
    • Yuichi KunoriNatsuo AjikaHiroshi OnodaMakoto OhiAtsushi Fukumoto
    • Yuichi KunoriNatsuo AjikaHiroshi OnodaMakoto OhiAtsushi Fukumoto
    • H01L21/8242H01L21/8246H01L21/8247H01L27/10H01L27/105H01L27/112H01L27/115H01L29/788H01L29/792
    • H01L27/10844H01L27/105H01L27/11517H01L27/11526
    • In a semiconductor memory device according to the present invention, a conductive layer is formed on a field oxide film in a boundary region on the main surface of a semiconductor substrate. A floating gate electrode, an interlayer insulating film, and a control gate electrode are formed on the semiconductor substrate in a memory cell array region with a gate insulating film interposed therebetween. A gate electrode is formed in a peripheral circuit region with the gate insulating film interposed therebetween. An interlayer insulating film is formed on the conductive layer, the gate electrode, and the control gate electrode. A contact hole is formed at a predetermined position of the interlayer insulating film. An interconnection layer is selectively formed on the interlayer insulating film including the inner surface of the contact hole. According to the present invention, it is possible to prevent formation of a concave portion on the surface of the field oxide film in the boundary region. It is also possible to protect the memory cell array region from an external noise by forming the conductive layer on the field oxide film in the boundary region and by fixing the potential of the conductive layer.
    • 在根据本发明的半导体存储器件中,在半导体衬底的主表面上的边界区域中的场氧化物膜上形成导电层。 在半导体衬底上形成有一个栅极绝缘膜和一个控制栅电极的存储单元阵列区域中,栅极绝缘膜插在其间。 栅极电极形成在外围电路区域中,栅极绝缘膜插入其间。 在导电层,栅电极和控制栅电极上形成层间绝缘膜。 在层间绝缘膜的预定位置处形成接触孔。 在包括接触孔的内表面的层间绝缘膜上选择性地形成布线层。 根据本发明,可以防止在边界区域的场氧化膜的表面上形成凹部。 也可以通过在边界区域的场氧化膜上形成导电层,并通过固定导电层的电位来保护存储单元阵列区域免受外部噪声的影响。
    • 6. 发明授权
    • Non-volatile semiconductor memory device
    • 非易失性半导体存储器件
    • US06172397B2
    • 2001-01-09
    • US09222794
    • 1998-12-30
    • Takahiro OonakadoHiroshi OnodaNatsuo AjikaKiyohiko Sakakibara
    • Takahiro OonakadoHiroshi OnodaNatsuo AjikaKiyohiko Sakakibara
    • H01L29788
    • H01L29/7885
    • In a non-volatile semiconductor memory device according to the present invention, a p type source region and a p type drain region are formed in the surface of an n well. A floating gate electrode and a control gate electrode are formed on a channel region with a tunnel oxide film interposed therebetween. According to this structure, a negative potential is applied to the drain region and a positive potential is applied to the control gate electrode when data is programmed, whereby electrons are injected from the drain region to the floating gate electrode by a band-to-band tunnel current induced hot electron injection current in the drain region. As a result, a non-volatile semiconductor memory device is provided which can prevent deterioration of the tunnel oxide film and which can be miniaturized.
    • 在根据本发明的非易失性半导体存储器件中,在n阱的表面中形成p型源极区和p型漏极区。 在沟道区域上形成浮栅电极和控制栅电极,其间具有隧道氧化膜。 根据该结构,在漏极区域施加负电位,在编程数据时向控制栅电极施加正电位,由此通过带对频从漏极区域向浮栅电极注入电子 隧道电流在漏区引起热电子注入电流。 结果,提供了可以防止隧道氧化膜劣化并且可以小型化的非易失性半导体存储器件。
    • 9. 发明授权
    • Method of making memory cells with peripheral transistors
    • 制造具有外围晶体管的存储单元的方法
    • US5538912A
    • 1996-07-23
    • US370755
    • 1995-01-10
    • Yuichi KunoriNatsuo AjikaHiroshi OnodaMakoto OhiAtsushi Fukumoto
    • Yuichi KunoriNatsuo AjikaHiroshi OnodaMakoto OhiAtsushi Fukumoto
    • H01L21/8242H01L21/8246H01L21/8247H01L27/10H01L27/105H01L27/112H01L27/115H01L29/788H01L29/792
    • H01L27/10844H01L27/105H01L27/11517H01L27/11526
    • In a semiconductor memory device according to the present invention, a conductive layer is formed on a field oxide film in a boundary region on the main surface of a semiconductor substrate. A floating gate electrode, an interlayer insulating film, and a control gate electrode are formed on the semiconductor substrate in a memory cell array region with a gate insulating film interposed therebetween. A gate electrode is formed in a peripheral circuit region with the gate insulating film interposed therebetween. An interlayer insulating film is formed on the conductive layer, the gate electrode, and the control gate electrode. A contact hole is formed at a predetermined position of the interlayer insulating film. An interconnection layer is selectively formed on the interlayer insulating film including the inner surface of the contact hole. According to the present invention, it is possible to prevent formation of a concave portion on the surface of the field oxide film in the boundary region. It is also possible to protect the memory cell array region from an external noise by forming the conductive layer on the field oxide film in the boundary region and by fixing the potential of the conductive layer.
    • 在根据本发明的半导体存储器件中,在半导体衬底的主表面上的边界区域中的场氧化物膜上形成导电层。 在半导体衬底上形成有一个栅极绝缘膜和一个控制栅电极的存储单元阵列区域中,栅极绝缘膜插在其间。 栅极电极形成在外围电路区域中,栅极绝缘膜插入其间。 在导电层,栅电极和控制栅电极上形成层间绝缘膜。 在层间绝缘膜的预定位置处形成接触孔。 在包括接触孔的内表面的层间绝缘膜上选择性地形成布线层。 根据本发明,可以防止在边界区域的场氧化膜的表面上形成凹部。 也可以通过在边界区域的场氧化膜上形成导电层,并通过固定导电层的电位来保护存储单元阵列区域免受外部噪声的影响。