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1. 发明申请

US20120064326A1 POLYURETHANE RESIN COMPOSITION FOR MOUNTING PAD AND POLYURETHANE MOUNTING PAD USING THE SAME 有权
标题翻译：聚氨酯树脂组合物用于安装垫片和聚氨酯安装垫
公开(公告)号：US20120064326A1
公开(公告)日：2012-03-15
申请号：US13233747
申请日：2011-09-15
申请人： Na-Ri KIM , Dong-Mok SHIN , Byeong-In AHN , Sang-Soon CHOI , Keong-Yeon YOON
发明人： Na-Ri KIM , Dong-Mok SHIN , Byeong-In AHN , Sang-Soon CHOI , Keong-Yeon YOON
IPC分类号： B32B27/40 , C08L75/04 , C08K5/42
CPC分类号： C09D175/04 , B32B7/12 , B32B27/10 , B32B27/36 , C08K5/42
摘要： This disclosure relates to a polyurethane resin composition for a mounting pad, including a polyurethane resin, C9-15 alkyl benzene sulfonic acid or a salt thereof, and a DMF solvent, and a polyurethane mounting pad using the same, whereby long and large pores may be uniformly formed thereinside to provide a mounting pad having low hardness, excellent compressibility, and a high compression modulus.
摘要翻译：本公开涉及一种用于安装垫的聚氨酯树脂组合物，其包括聚氨酯树脂，C 9-15烷基苯磺酸或其盐和DMF溶剂，以及使用其的聚氨酯安装垫，其中长孔和大孔可以均匀地形成在其中以提供具有低硬度，优异的压缩性和高压缩模量的安装垫。

2. 发明申请

US20130018118A1 POLY-URETHANE RESIN AND POLY-URETHANE ABSORBING PAD USING THE SAME 有权
标题翻译：聚环氧树脂和聚氨酯吸水垫
公开(公告)号：US20130018118A1
公开(公告)日：2013-01-17
申请号：US13549787
申请日：2012-07-16
申请人： Sang-Soon CHOI , Young-Ji TAE , Dong-Mok SHIN , Keong-Yeon YOON , Na-Ri KIM , Byeong-In AHN
发明人： Sang-Soon CHOI , Young-Ji TAE , Dong-Mok SHIN , Keong-Yeon YOON , Na-Ri KIM , Byeong-In AHN
IPC分类号： C08L75/06 , C08K5/20
CPC分类号： C08G18/4238 , C08G18/664 , C08G18/7671 , C08K5/42 , C08L75/06 , C08L2205/025 , C08J2201/0522 , C08J2375/06 , C08J9/28
摘要： The present invention relates to a polyurethane resin composition including a first polyurethane resin and a second polyurethane resin that are different from each other in their compositions, an organic solvent, and a surfactant, and a polyurethane mounting pad manufactured from the resin composition.
摘要翻译：本发明涉及包含由组合物彼此不同的第一聚氨酯树脂和第二聚氨酯树脂的聚氨酯树脂组合物，有机溶剂和表面活性剂以及由该树脂组合物制造的聚氨酯安装垫。

3. 发明申请

US20120071068A1 POLISHING PAD FOR CHEMICAL MECHANICAL POLISHING APPARATUS 有权
标题翻译：化学机械抛光设备抛光垫
公开(公告)号：US20120071068A1
公开(公告)日：2012-03-22
申请号：US13233715
申请日：2011-09-15
申请人： Ah-Ram KIM , Byeong-In AHN , Dong-Mok SHIN
发明人： Ah-Ram KIM , Byeong-In AHN , Dong-Mok SHIN
IPC分类号： B24D11/00 , B24B53/017
CPC分类号： B24B37/22
摘要： This disclosure relates to a polishing pad for chemical mechanical polishing, having a shape where 3 or more semi-oval or semicircular curves that connect 2 valleys neighboring on the plane are connected, and including 2 or more modified patterns that are formed to a determined thickness on the polishing pad, wherein a peak of one modified pattern and a valley of another modified pattern neighboring thereto are sequentially located on the same line. The polishing pad may uniformly disperse slurry over the whole area during a polishing process to provide improved polishing uniformity, and appropriately control residence time of the slurry to increase polishing rate.
摘要翻译：本公开涉及一种用于化学机械抛光的抛光垫，其具有连接3个或更多个连接在平面上相邻的2个谷的半椭圆形或半圆形曲线的形状，并且包括形成为确定厚度的2个或更多个修改图案在抛光垫上，其中一个修改图案的峰值和与其相邻的另一个修改图案的谷值依次位于同一行上。抛光垫可以在抛光过程中将浆料均匀地分散在整个区域上，以提供改进的抛光均匀性，并适当地控制浆料的停留时间以提高抛光速率。

4. 发明申请

US20120098948A1 FINGERPRINT AUTHENTICATION APPARATUS HAVING A PLURALITY OF FINGERPRINT SENSORS AND METHOD FOR SAME 有权
标题翻译：具有多个指纹传感器的指纹识别装置及其相关方法
公开(公告)号：US20120098948A1
公开(公告)日：2012-04-26
申请号：US13338932
申请日：2011-12-28
申请人： Jea-Won LEE , Bong-Seop SONG , Young-Soo MOON , Ja-Sung KU , Seong-Jik LEE , Dong-Mok SHIN
发明人： Jea-Won LEE , Bong-Seop SONG , Young-Soo MOON , Ja-Sung KU , Seong-Jik LEE , Dong-Mok SHIN
IPC分类号： G06K9/00 , H04N7/18
CPC分类号： A61B5/1172 , G06K9/00087 , G06K9/00885 , G06K9/6292
摘要： A fingerprint authentication apparatus and method which processes fingerprint data input through a plurality of fingerprint sensors and uses the processed fingerprint data in authentication to thereby increase security and performance. The fingerprint authentication apparatus includes a first sensor configured to acquire first fingerprint data from a user; a second sensor configured to acquire second fingerprint data that is different from the first fingerprint data; and a control unit configured to determine whether or not to authenticate the user based on similarities obtained from the comparison of each of the first fingerprint data and the second fingerprint data with registered fingerprint data.
摘要翻译：一种指纹认证装置和方法，其处理通过多个指纹传感器输入的指纹数据，并使用经过处理的指纹数据进行认证，从而提高安全性和性能。指纹认证装置包括被配置为从用户获取第一指纹数据的第一传感器; 第二传感器，被配置为获取与所述第一指纹数据不同的第二指纹数据; 以及控制单元，被配置为基于从所述第一指纹数据和所述第二指纹数据与所登记的指纹数据的比较获得的相似度来确定是否认证所述用户。

5. 发明申请

US20100151684A1 SLURRY COMPOSITION FOR PRIMARY CHEMICAL MECHANICAL POLISHING AND CHEMICAL MECHANICAL POLISHING METHOD 审中-公开
标题翻译：主要化学机械抛光和化学机械抛光方法的浆料组合物
公开(公告)号：US20100151684A1
公开(公告)日：2010-06-17
申请号：US12630556
申请日：2009-12-03
申请人： Eun-Mi CHOI , Dong-Mok SHIN , Seung-Beom CHO
发明人： Eun-Mi CHOI , Dong-Mok SHIN , Seung-Beom CHO
IPC分类号： H01L21/306 , C09K13/00 , C09K13/06
CPC分类号： C09K3/1463 , C09G1/02 , H01L21/3212
摘要： The present invention relates to a slurry composition for primary chemical mechanical polishing that can show more improved WIWNU (Within Wafer Non-Uniformity) while exhibiting excellent polishing rate and polishing selectivity, and a chemical mechanical polishing method. The slurry composition for primary chemical mechanical polishing comprises an abrasive; an oxidant, an organic acid; a specific corrosion inhibitor, and, a polymeric additive comprising polyvinylpyrrolidone having weight average molecular weight of about 3000 to 100000, and has polishing selectivity of polishing rates between a copper layer:a tantalum layer of about 30:1 or more.
摘要翻译：本发明涉及一种主要化学机械抛光的浆料组合物，其可以显示出更优异的WIWNU（晶片非均匀性），同时具有优异的抛光速率和抛光选择性，以及化学机械抛光方法。用于初级化学机械抛光的浆料组合物包括研磨剂; 氧化剂，有机酸; 特定的腐蚀抑制剂，以及包含重均分子量为约3000至100000的聚乙烯吡咯烷酮的聚合物添加剂，并且在铜层：约30:1或更大的钽层之间具有抛光速率的抛光选择性。

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