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1. 发明授权

US10344187B2 Polishing composition and polishing method using the same 有权
公开(公告)号：US10344187B2
公开(公告)日：2019-07-09
申请号：US14561188
申请日：2014-12-04
申请人： NITTA HAAS INCORPORATED , SUMCO CORPORATION
发明人： Masashi Teramoto , Shinichi Ogata , Ryuichi Tanimoto
IPC分类号： C09G1/04 , H01L21/02 , C09G1/02 , H01L21/306
摘要： Provided is a polishing composition that does not contain abrasives and that is used for polishing a silicon wafer, the polishing composition including a pH buffer, a polishing accelerator, a water-soluble polymer, and a block-type compound. By polishing a silicon wafer by using the polishing composition, a polishing speed of greater than 0.1 μm/min can be achieved.

2. 发明授权

US09289876B2 Method and apparatus for polishing work 有权
标题翻译：抛光工作的方法和装置
公开(公告)号：US09289876B2
公开(公告)日：2016-03-22
申请号：US14405660
申请日：2013-06-24
申请人： SUMCO CORPORATION
发明人： Shinichi Ogata , Keiichi Takanashi
IPC分类号： B24B37/08 , H01L21/304 , B24B37/013
CPC分类号： B24B37/08 , B24B37/013 , H01L21/304
摘要： The method for polishing work, in which work in a retaining opening provided in a carrier plate, the center of the retaining opening being positioned apart from the center of the carrier plate, is sandwiched between an upper plate and a lower plate provided with polishing pads; the carrier plate is rotated by a drive mechanism; and the upper plate and the lower plate are also rotated, so that the distance changes periodically with the rotation of the carrier plate, and both surfaces of the work are simultaneously polished, includes the steps of: measuring at least one of torque of the drive mechanism, the upper plate, and the lower plate; and controlling an amount of polishing removal of the work based on the fluctuation of the torque component due to the periodic change in the distance.
摘要翻译：一种用于抛光工作的方法，其中设置在承载板中的保持开口中的工件，保持开口的中心位于离开载板的中心的位置，夹在上板和设有抛光垫的下板之间 ; 承载板通过驱动机构旋转; 并且上板和下板也旋转，使得距离随着承载板的旋转而周期性地变化，并且工件的两个表面被同时抛光，包括以下步骤：测量驱动器的扭矩中的至少一个机构，上板和下板; 并且基于由距离的周期性变化引起的扭矩分量的波动来控制工件的抛光量。

3. 发明申请

US20150165585A1 METHOD AND APPARATUS FOR POLISHING WORK 有权
标题翻译：抛光工艺的方法和装置
公开(公告)号：US20150165585A1
公开(公告)日：2015-06-18
申请号：US14405660
申请日：2013-06-24
申请人： SUMCO CORPORATION
发明人： Shinichi Ogata , Keiichi Takanashi
IPC分类号： B24B37/08 , H01L21/304 , B24B37/013
CPC分类号： B24B37/08 , B24B37/013 , H01L21/304
摘要： The method for polishing work, in which work in a retaining opening provided in a carrier plate, the center of the retaining opening being positioned apart from the center of the carrier plate, is sandwiched between an upper plate and a lower plate provided with polishing pads; the carrier plate is rotated by a drive mechanism; and the upper plate and the lower plate are also rotated, so that the distance changes periodically with the rotation of the carrier plate, and both surfaces of the work are simultaneously polished, includes the steps of: measuring at least one of torque of the drive mechanism, the upper plate, and the lower plate; and controlling an amount of polishing removal of the work based on the fluctuation of the torque component due to the periodic change in the distance.
摘要翻译：一种用于抛光工作的方法，其中设置在承载板中的保持开口中的工件，保持开口的中心位于离开载板的中心的位置，夹在上板和设有抛光垫的下板之间 ; 承载板通过驱动机构旋转; 并且上板和下板也旋转，使得距离随着承载板的旋转而周期性地变化，并且工件的两个表面被同时抛光，包括以下步骤：测量驱动器的扭矩中的至少一个机构，上板和下板; 并且基于由距离的周期性变化引起的扭矩分量的波动来控制工件的抛光量。

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