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    • 2. 发明授权
    • Vapor deposition source and vapor deposition apparatus having the same
    • 蒸气沉积源及其蒸镀装置
    • US07914621B2
    • 2011-03-29
    • US11342681
    • 2006-01-31
    • Do Geun KimMyung Soo HuhSeok Heon JeongHee Cheol KangKazuo Furuno
    • Do Geun KimMyung Soo HuhSeok Heon JeongHee Cheol KangKazuo Furuno
    • C23C16/00
    • C23C14/243C23C14/24
    • A vapor deposition source has a reduced size by disposing a crucible, a heating portion, and a nozzle portion in one defined space. A vapor deposition apparatus deposits deposition materials on a substrate using the vapor deposition source. The vapor deposition source includes a housing, and the crucible is mounted in the housing for vaporizing the deposition materials. The heating portion is installed adjacent to the crucible in the housing for heating the crucible. The nozzle portion injects the vaporized deposition materials into a substrate disposed at an exterior of the housing through an injection nozzle. The vapor deposition source is manufactured in a smaller and lightweight form in comparison with conventional vapor deposition sources in which a crucible and a nozzle portion are arranged in different spaces. The diameter and number of injection nozzles of the invention are restricted to block radiant heat discharged from the vapor deposition source, so that deposition materials are uniformly deposited. Furthermore, the output power of a conveyer for conveying the vapor deposition source is reduced. In addition, a plurality of vapor deposition sources is arranged in a line to perform concentrated deposition of deposition materials so that quality of the resultant product is improved.
    • 气相沉积源通过在一个限定的空间内设置坩埚,加热部分和喷嘴部分而具有减小的尺寸。 气相沉积设备使用蒸镀源将沉积材料沉积在基板上。 气相沉积源包括壳体,并且坩埚安装在壳体中以使沉积材料蒸发。 加热部分安装在坩埚附近,用于加热坩埚。 喷嘴部分通过注射喷嘴将蒸发的沉积材料注入设置在外壳外部的基板中。 与其中坩埚和喷嘴部分布置在不同空间中的常规气相沉积源相比,气相沉积源以更小和轻质的形式制造。 本发明的注射喷嘴的直径和数量被限制为阻挡从蒸镀源排出的辐射热,从而均匀地沉积沉积材料。 此外,用于输送气相沉积源的输送机的输出功率降低。 此外,多个气相沉积源被排列成一行,以进行沉积材料的浓缩沉积,从而提高所得产品的质量。
    • 4. 发明申请
    • Catalyst enhanced chemical vapor deposition apparatus and deposition method using the same
    • 催化剂增强化学气相沉积装置及其沉积方法
    • US20060254513A1
    • 2006-11-16
    • US11405552
    • 2006-04-18
    • Hee-Cheol KangKazuo FurunoHan-Ki KimMyoung-Soo Kim
    • Hee-Cheol KangKazuo FurunoHan-Ki KimMyoung-Soo Kim
    • C23C16/00
    • C23C16/44C23C16/46
    • A catalyst-enhanced chemical vapor deposition (CECVD) apparatus and a deposition method, in which tension is applied to a catalyst wire in order to prevent the catalyst wire from sagging due to thermal deformation, and additional gas is used to prevent foreign material from being generated. The CECVD apparatus may be constructed with a process chamber, a showerhead to introduce process gas into process chamber, a tensile catalyst wire structure provided in the process chamber to decompose the gas introduced from the showerhead, and a substrate on which the gas decomposed by the catalyst wire structure is deposited, so that the tension is applied to a catalyst wire in order to prevent the catalyst wire from sagging due to thermal deformation, and additional gas is used to prevent foreign material from being generated, thereby eliminating occurrences of non-uniform temperatures of a substrate and non-uniform film growth, and concomitantly enhancing the durability of the catalyst wire.
    • 催化剂增强化学气相沉积(CECVD)装置和沉积方法,其中向催化剂丝施加张力以防止催化剂丝由于热变形而下垂,并且使用另外的气体来防止异物 生成。 CECVD装置可以构造有处理室,将工艺气体引入处理室的喷头,设置在处理室中的分解从喷头引入的气体的拉伸催化剂丝线结构以及由其分解的气体 催化剂丝线结构被沉积,使得张力被施加到催化剂丝上,以防止催化剂丝由于热变形而下垂,并且使用额外的气体来防止产生异物,从而消除不均匀的发生 底物的温度和不均匀的膜生长,并且伴随地提高催化剂丝的耐久性。
    • 5. 发明申请
    • Vapor deposition source and vapor deposition apparatus having the same
    • 蒸气沉积源及其蒸镀装置
    • US20060169211A1
    • 2006-08-03
    • US11342681
    • 2006-01-31
    • Do KimMyung HuhSeok JeongHee KangKazuo Furuno
    • Do KimMyung HuhSeok JeongHee KangKazuo Furuno
    • C23C16/00
    • C23C14/243C23C14/24
    • A vapor deposition source has a reduced size by disposing a crucible, a heating portion, and a nozzle portion in one defined space. A vapor deposition apparatus deposits deposition materials on a substrate using the vapor deposition source. The vapor deposition source includes a housing, and the crucible is mounted in the housing for vaporizing the deposition materials. The heating portion is installed adjacent to the crucible in the housing for heating the crucible. The nozzle portion injects the vaporized deposition materials into a substrate disposed at an exterior of the housing through an injection nozzle. The vapor deposition source is manufactured in a smaller and lightweight form in comparison with conventional vapor deposition sources in which a crucible and a nozzle portion are arranged in different spaces. The diameter and number of injection nozzles of the invention are restricted to block radiant heat discharged from the vapor deposition source, so that deposition materials are uniformly deposited. Furthermore, the output power of a conveyer for conveying the vapor deposition source is reduced. In addition, a plurality of vapor deposition sources is arranged in a line to perform concentrated deposition of deposition materials so that quality of the resultant product is improved.
    • 气相沉积源通过在一个限定的空间内设置坩埚,加热部分和喷嘴部分而具有减小的尺寸。 气相沉积设备使用蒸镀源将沉积材料沉积在基板上。 气相沉积源包括壳体,并且坩埚安装在壳体中以使沉积材料蒸发。 加热部分安装在坩埚附近,用于加热坩埚。 喷嘴部分通过注射喷嘴将蒸发的沉积材料注入设置在外壳外部的基板中。 与其中坩埚和喷嘴部分布置在不同空间中的常规气相沉积源相比,气相沉积源以更小和轻质的形式制造。 本发明的注射喷嘴的直径和数量被限制为阻挡从蒸镀源排出的辐射热,从而均匀地沉积沉积材料。 此外,用于输送气相沉积源的输送机的输出功率降低。 此外,多个气相沉积源被排列成一行,以进行沉积材料的浓缩沉积,从而提高所得产品的质量。
    • 6. 发明授权
    • Catalyst enhanced chemical vapor deposition apparatus and deposition method using the same
    • 催化剂增强化学气相沉积装置及其沉积方法
    • US08052795B2
    • 2011-11-08
    • US11405552
    • 2006-04-18
    • Hee-Cheol KangKazuo FurunoHan-Ki KimMyoung-Soo Kim
    • Hee-Cheol KangKazuo FurunoHan-Ki KimMyoung-Soo Kim
    • C23C16/00
    • C23C16/44C23C16/46
    • A catalyst-enhanced chemical vapor deposition (CECVD) apparatus and a deposition method, in which tension is applied to a catalyst wire in order to prevent the catalyst wire from sagging due to thermal deformation, and additional gas is used to prevent foreign material from being generated. The CECVD apparatus may be constructed with a process chamber, a showerhead to introduce process gas into process chamber, a tensile catalyst wire structure provided in the process chamber to decompose the gas introduced from the showerhead, and a substrate on which the gas decomposed by the catalyst wire structure is deposited, so that the tension is applied to a catalyst wire in order to prevent the catalyst wire from sagging due to thermal deformation, and additional gas is used to prevent foreign material from being generated, thereby eliminating occurrences of non-uniform temperatures of a substrate and non-uniform film growth, and concomitantly enhancing the durability of the catalyst wire.
    • 催化剂增强化学气相沉积(CECVD)装置和沉积方法,其中向催化剂丝施加张力以防止催化剂丝由于热变形而下垂,并且使用另外的气体来防止异物 生成。 CECVD装置可以构造有处理室,将工艺气体引入处理室的喷头,设置在处理室中的分解从喷头引入的气体的拉伸催化剂丝线结构以及由其分解的气体 催化剂丝线结构被沉积,使得张力被施加到催化剂丝上,以防止催化剂丝由于热变形而下垂,并且使用额外的气体来防止产生异物,从而消除不均匀的发生 底物的温度和不均匀的膜生长,并且伴随地提高催化剂丝的耐久性。