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1. 发明授权

US09473104B2 Surface acoustic wave filter 有权
标题翻译：表面声波滤波器
公开(公告)号：US09473104B2
公开(公告)日：2016-10-18
申请号：US14541242
申请日：2014-11-14
申请人： Murata Manufacturing Co., Ltd.
发明人： Yuji Toyota
IPC分类号： H03H9/64 , H03H9/02 , H03H9/05
CPC分类号： H03H9/02992 , H03H9/02897 , H03H9/6469
摘要： A surface acoustic wave filter includes a piezoelectric substrate, a lower-layer wiring line, an upper-layer wiring line, and an interlayer insulating film. The lower-layer wiring line is disposed on the piezoelectric substrate. The upper-layer wiring line crosses the lower-layer wiring line. The upper-layer wiring line has a potential that is different from the potential of the lower-layer wiring line. The interlayer insulating film is disposed between the lower-layer wiring line and the upper-layer wiring line. The interlayer insulating film has a portion that has a width that is not greater than the width of the upper-layer wiring line in a cross-sectional view taken along a direction in which the lower-layer wiring line extends.
摘要翻译：表面声波滤波器包括压电基板，下层布线，上层布线和层间绝缘膜。下层布线配置在压电基板上。上层布线穿过下层布线。上层布线具有与下层布线的电位不同的电位。层间绝缘膜设置在下层布线和上层布线之间。层间绝缘膜在沿着下层布线延伸的方向截取的截面图中具有宽度不大于上层布线的宽度的部分。

2. 发明授权

US11509289B2 Composite component and mounting structure therefor 有权
公开(公告)号：US11509289B2
公开(公告)日：2022-11-22
申请号：US16429117
申请日：2019-06-03
申请人： Murata Manufacturing Co., Ltd.
发明人： Katsuya Matsumoto , Yuji Toyota
IPC分类号： H03H9/25 , H01L23/00 , H01L25/00 , H01L41/08 , H01L41/083 , H03H9/02 , H03H9/05 , H03H9/10
摘要： In a composite component, a semiconductor device is stacked on an elastic wave device. Side electrodes extend from at least one side surface of a piezoelectric substrate of the elastic wave device to at least a side surface of a semiconductor substrate of the semiconductor device and are connected to an IDT electrode and functional electrodes. The side electrodes extend onto at least one of a second main surface of the piezoelectric substrate and a second main surface of the semiconductor substrate.

3. 发明授权

US10298274B2 Multiplexer, transmission device, and reception device 有权
公开(公告)号：US10298274B2
公开(公告)日：2019-05-21
申请号：US16194484
申请日：2018-11-19
申请人： Murata Manufacturing Co., Ltd.
发明人： Yuichi Takamine , Tsutomu Takai , Yuji Toyota
IPC分类号： H04B1/00 , H04B1/04 , H04B1/16 , H04B3/21 , H03H9/72 , H03H9/00 , H03H9/145 , H03H9/64 , H03H9/70 , H04B1/18
摘要： A multiplexer includes filters, a common terminal with which an inductance element is connected to a connection path of the common terminal and an antenna element and a capacitance element is connected in series to the connection path, and another inductance element. An input terminal of one of the filters is connected to the common terminal via the another inductance element, and is connected to a parallel resonator. In each of the filters other than the one filter, one of the input terminal and the output terminal, which is a terminal closer to the antenna element, is connected to the common terminal, and is connected to the series resonator.

4. 发明授权

US10840879B2 Surface acoustic wave device 有权
公开(公告)号：US10840879B2
公开(公告)日：2020-11-17
申请号：US15667751
申请日：2017-08-03
申请人： Murata Manufacturing Co., Ltd.
发明人： Yuji Toyota
IPC分类号： H03H9/10 , H03H9/25 , H03H9/05
CPC分类号： H03H9/1071 , H03H9/059 , H03H9/25
摘要： A surface acoustic wave device includes a piezoelectric substrate with an IDT electrode that excites a surface acoustic wave provided on a principal surface, a cover layer opposing the principal surface and that covers the IDT electrode, a support provided in a standing manner around the IDT electrode on the one principal surface, and that, with the cover layer separated from the IDT electrode, supports a piezoelectric-substrate-side surface of the cover layer, and a connector that is provided on the piezoelectric-substrate-side surface of the cover layer and that joins the cover layer and the support to each other. At least a portion of a cover-layer-side end portion of the support exists in the connector. A dimension of the connector in a normal direction to the one principal surface is less than a dimension of the support in the normal direction.

5. 发明授权

US10171113B2 Multiplexer, transmission device, and reception device 有权
公开(公告)号：US10171113B2
公开(公告)日：2019-01-01
申请号：US15901969
申请日：2018-02-22
申请人： Murata Manufacturing Co., Ltd.
发明人： Yuichi Takamine , Tsutomu Takai , Yuji Toyota
IPC分类号： H04B1/38 , H04B1/00 , H04B1/04 , H04B1/16 , H03H9/70 , H03H9/72 , H03H9/64 , H03H9/00 , H03H9/145 , H04B3/21 , H04B1/18
摘要： A multiplexer includes filters, a common terminal with which an inductance element is connected to a connection path of the common terminal and an antenna element and a capacitance element is connected in series to the connection path, and another inductance element. An input terminal of one of the filters is connected to the common terminal via the another inductance element, and is connected to a parallel resonator. In each of the filters other than the one filter, one of the input terminal and the output terminal, which is a terminal closer to the antenna element, is connected to the common terminal, and is connected to the series resonator.

6. 发明授权

US11985903B2 Wiring electrode 有权
公开(公告)号：US11985903B2
公开(公告)日：2024-05-14
申请号：US17528227
申请日：2021-11-17
申请人： Murata Manufacturing Co., Ltd.
发明人： Yuji Toyota
IPC分类号： H10N30/87
CPC分类号： H10N30/877
摘要： A wiring electrode on a piezoelectric substrate includes layers including an adhesive layer in contact with the piezoelectric substrate, an outermost layer indirectly above the adhesive layer, a low-resistance layer between the adhesive layer and the outermost layer, including first and second principal surfaces, and having a lowest electric resistance among the layers, and a barrier layer between the low-resistance layer and the outermost layer. An outer peripheral edge of the second principal surface of the low-resistance layer is inside an outer peripheral edge of the barrier layer, and an outer peripheral edge of the adhesive layer is outside an outer peripheral edge of the low-resistance layer, in plan view.

7. 发明授权

US10644671B2 Surface acoustic wave device 有权
公开(公告)号：US10644671B2
公开(公告)日：2020-05-05
申请号：US15285536
申请日：2016-10-05
申请人： Murata Manufacturing Co., Ltd.
发明人： Yuji Toyota
IPC分类号： H03H3/08 , H03H9/64 , H03H9/02 , H03H9/13
CPC分类号： H03H9/02535 , H03H3/08 , H03H9/02992 , H03H9/131 , H03H9/64
摘要： A surface acoustic wave device includes a piezoelectric substrate, an IDT electrode that is provided on the piezoelectric substrate and includes combtooth-shaped electrode fingers, and a wiring electrode that is connected to the IDT electrode. A line width of the electrode fingers at a lower edge thereof and a line width of the electrode fingers at an upper edge thereof in a cross section of the electrode fingers that is perpendicular or substantially perpendicular to a longitudinal direction of the electrode fingers is smaller than a maximum line width of the electrode fingers.

8. 发明授权

US09748194B2 Electronic device 有权
公开(公告)号：US09748194B2
公开(公告)日：2017-08-29
申请号：US15290131
申请日：2016-10-11
申请人： Murata Manufacturing Co., Ltd.
发明人： Yuji Toyota
IPC分类号： H01L23/48 , H01L23/00 , H01L23/31 , H01L23/29 , H01L21/60
CPC分类号： H01L24/17 , H01L23/29 , H01L23/31 , H01L23/3107 , H01L23/3121 , H01L2021/60022 , H01L2224/1703 , H01L2224/175 , H01L2924/0002 , H01L2924/141 , H01L2924/142 , H03H9/0576 , H03H9/059 , H03H9/1085 , H01L2924/00012
摘要： An electronic device includes a mount board, first and second electronic components flip-chip mounted on a surface of the mount board with bumps interposed therebetween, and a sealing member that seals the first and second electronic components on the mount board. A thickness of the first electronic component is larger than a thickness of the second electronic component, and a height of the bump bonded to the first electronic component is smaller than a height of the bump bonded to the second electronic component.

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