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1. 发明授权

US09813595B2 Camera module including multilayer base body, image sensor IC, lens unit, peripheral circuit components, and connector element and electronic device including same 有权
公开(公告)号：US09813595B2
公开(公告)日：2017-11-07
申请号：US14840103
申请日：2015-08-31
申请人： Murata Manufacturing Co., Ltd.
发明人： Shigeru Tago , Hirofumi Shinagawa , Jerry Hsieh , Satoshi Sasaki , Jun Sasaki , Nobuo Ikemoto , Yuki Wakabayashi
IPC分类号： H04N5/225
CPC分类号： H04N5/2253 , H04N5/2254 , H04N5/2257
摘要： A camera module includes a multilayer base body including a first mounting portion, a second mounting portion, and a connecting portion. The first mounting portion and the second mounting portion are connected to the connecting portion. A connector element is arranged in the second mounting portion. The first mounting portion includes a cavity, and a penetration hole penetrating from the cavity to one surface of the first mounting portion. An image sensor IC is arranged in the cavity, and the lens unit is arranged on the one surface of the first mounting portion at a location at or near the penetration hole. Peripheral circuit components and conductor patterns are mounted to or incorporated in the first mounting portion.

2. 发明授权

US09673502B2 High-frequency signal transmission line and electronic device 有权
公开(公告)号：US09673502B2
公开(公告)日：2017-06-06
申请号：US15285615
申请日：2016-10-05
申请人： Murata Manufacturing Co., Ltd.
发明人： Satoshi Sasaki , Nobuo Ikemoto , Shigeru Tago
IPC分类号： H01P3/08 , H01P3/00 , H05K1/02 , H05K1/03 , H05K1/14
CPC分类号： H01P3/003 , H01P3/08 , H01P3/085 , H05K1/0225 , H05K1/0253 , H05K1/0284 , H05K1/0393 , H05K1/147 , H05K2201/09245 , H05K2201/09281 , H05K2201/09727
摘要： A dielectric element assembly includes a plurality of dielectric layers stacked on each other in a direction of lamination and extends in an x-axis direction. A signal line is provided in the dielectric element assembly and extends in the x-axis direction. A reference ground conductor is provided on a positive side in a z-axis direction relative to the signal line. An auxiliary ground conductor is provided on a negative side in the z-axis direction relative to the signal line. Via-hole conductors connect the reference ground conductor and the auxiliary ground conductor and are provided in the dielectric element assembly on the negative side relative to the center in a y-axis direction. A portion of the signal line in a section which includes the via-hole conductors is positioned on the positive side in the y-axis direction relative to another portion of the signal line in a section which does not include the via-hole conductors.

3. 发明授权

US09583836B2 High-frequency transmission line and antenna device 有权
标题翻译：高频传输线和天线装置
公开(公告)号：US09583836B2
公开(公告)日：2017-02-28
申请号：US14077345
申请日：2013-11-12
申请人： Murata Manufacturing Co., Ltd.
发明人： Noboru Kato , Satoshi Sasaki
IPC分类号： H01P3/02 , H01Q9/04 , H01P3/08 , H01P5/02
CPC分类号： H01Q9/045 , H01P1/02 , H01P3/085 , H01P5/028 , H01Q21/065
摘要： An antenna is connected to a first end of a high-frequency transmission line, and a connector is connected to a second end of the high-frequency transmission line. A characteristic impedance of a microstrip line is higher than characteristic impedances of first and second strip lines, and a characteristic impedance of a coplanar line is higher than a characteristic impedance of the second strip line. Thus, at a certain frequency, a standing wave develops in which the position of the microstrip line and the position of the coplanar line are maximum voltage points and three-quarter-wavelength resonance is a fundamental wave mode. Thus, the cutoff frequency of the high-frequency transmission line is high, and an insertion loss of a signal is significantly reduced to be low over a wide band.
摘要翻译：天线连接到高频传输线的第一端，连接器连接到高频传输线的第二端。微带线的特性阻抗高于第一和第二带状线的特性阻抗，并且共面线的特性阻抗高于第二带状线的特性阻抗。因此，在一定频率下，产生驻波，其中微带线的位置和共面线的位置是最大电压点，并且三分之四波长谐振是基波模式。因此，高频传输线的截止频率高，并且在宽带上信号的插入损耗显着降低到低。

4. 发明授权

US09263559B2 Semiconductor device and radio communication device 有权
标题翻译：半导体器件和无线电通信设备
公开(公告)号：US09263559B2
公开(公告)日：2016-02-16
申请号：US14469674
申请日：2014-08-27
申请人： Murata Manufacturing Co., Ltd.
发明人： Satoshi Sasaki , Yasunari Umemoto , Yasuo Osone , Tsutomu Kobori , Chushiro Kusano , Isao Ohbu , Kenji Sasaki
IPC分类号： H01L25/04 , H01L29/73 , H01L23/66 , H01L23/00 , H01L27/06 , H01L29/737 , H01L49/02 , H01L29/08
CPC分类号： H01L29/7304 , H01L23/66 , H01L24/48 , H01L24/49 , H01L25/042 , H01L27/0605 , H01L27/067 , H01L28/40 , H01L29/0808 , H01L29/7371 , H01L2223/6627 , H01L2223/6644 , H01L2224/05553 , H01L2224/05554 , H01L2224/32225 , H01L2224/48091 , H01L2224/48095 , H01L2224/48137 , H01L2224/48227 , H01L2224/48235 , H01L2224/49113 , H01L2224/49171 , H01L2224/73265 , H01L2924/00014 , H01L2924/01002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/0102 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/01031 , H01L2924/01032 , H01L2924/01033 , H01L2924/01037 , H01L2924/01041 , H01L2924/01042 , H01L2924/01049 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/10329 , H01L2924/10336 , H01L2924/1305 , H01L2924/13091 , H01L2924/14 , H01L2924/1423 , H01L2924/19032 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/30105 , H01L2924/3011 , H01L2924/30111 , H01L2924/00 , H01L2224/45099
摘要： A radio communication device includes a power amplifier having a semiconductor device formed with a plurality of unit transistors. Base electrodes of the unit transistors are connected with each other by a base line, and an input capacitor is connected to the base line such that the input capacitor is commonly and electrically connected to the base electrodes of a plurality of the unit transistors.
摘要翻译：无线电通信装置包括具有形成有多个单位晶体管的半导体器件的功率放大器。单元晶体管的基极通过基线相互连接，输入电容器连接到基极线，使得输入电容器与多个单位晶体管的基极电连接。

5. 发明授权

US08975986B2 High-frequency signal transmission line and electronic device 有权
标题翻译：高频信号传输线和电子设备
公开(公告)号：US08975986B2
公开(公告)日：2015-03-10
申请号：US14196269
申请日：2014-03-04
申请人： Murata Manufacturing Co., Ltd.
发明人： Kanto Iida , Yoichi Saito , Satoshi Sasaki , Noboru Kato
IPC分类号： H01P3/08 , H03H7/38 , H05K1/11 , H05K1/02
CPC分类号： H01P3/082 , H05K1/0225 , H05K1/025 , H05K1/0271 , H05K1/028 , H05K1/115 , H05K1/162 , H05K2201/09709 , H05K2201/09727 , H05K2201/09845
摘要： A high-frequency signal transmission line includes a flexible body including a plurality of insulating layers. A linear signal line is located in or on the body. A first ground conductor is located opposite to the signal line via at least one of the insulating layers. A second ground conductor extends along the signal line. An interlayer connection portion that connects the first ground conductor and the second ground conductor includes a plurality of interlayer connection conductors individually pierced in some of6 the insulating layers and connected to each other. The plurality of interlayer connection conductors includes two interlayer connection conductors that are pierced in adjacent ones of the insulating layers with respect to a layer-stacking direction and that have central axes located in different positions when viewed from the layer-stacking direction.
摘要翻译：高频信号传输线包括具有多个绝缘层的柔性主体。线性信号线位于身体中或身上。第一接地导体经由至少一个绝缘层位于与信号线相对的位置。第二个接地导体沿信号线延伸。连接第一接地导体和第二接地导体的层间连接部分包括多个层间连接导体，其分别穿过绝缘层中的一些并彼此连接。多个层间连接导体包括两层层间连接导体，其相对于层堆叠方向在相邻的绝缘层中被刺穿，并且当从层堆叠方向观察时具有位于不同位置的中心轴。

6. 发明授权

US09627735B2 High-frequency signal line and electronic device provided with the same 有权
公开(公告)号：US09627735B2
公开(公告)日：2017-04-18
申请号：US15159967
申请日：2016-05-20
申请人： Murata Manufacturing Co., Ltd.
发明人： Yuki Wakabayashi , Bunta Okamoto , Satoshi Sasaki
IPC分类号： H01P3/08 , H05K1/02 , H01P1/203 , H05K1/11
CPC分类号： H01P3/08 , H01P1/2039 , H01P3/082 , H05K1/0237 , H05K1/028 , H05K1/111 , H05K2201/09236 , H05K2201/093 , H05K2201/09609 , H05K2201/0969 , H05K2201/09727 , H05K2201/10189
摘要： A high-frequency signal line includes a dielectric base with a first line portion and a second line portion each extending along a predetermined straight line parallel or substantially parallel to a predetermined direction, and a third line portion mutually connecting first side ends of the first line portion and the second line portion in the predetermined direction, a signal line, a first ground conductor located on the first side in the layer stacking direction of the signal line, a second ground conductor located on a second side in the layer stacking direction of the signal line, and one or more interlayer connection conductors connecting the first ground conductor and the second ground conductor. In the third line portion, the interlayer connection conductor is provided on the second side in the predetermined direction of the signal line when viewed from the layer stacking direction.

7. 发明授权

US09490513B2 High-frequency signal transmission line and electronic device 有权
标题翻译：高频信号传输线和电子设备
公开(公告)号：US09490513B2
公开(公告)日：2016-11-08
申请号：US14503612
申请日：2014-10-01
申请人： Murata Manufacturing Co., Ltd.
发明人： Satoshi Sasaki , Nobuo Ikemoto , Shigeru Tago
IPC分类号： H01P3/08 , H01P3/00 , H05K1/02 , H05K1/03 , H05K1/14
CPC分类号： H01P3/003 , H01P3/08 , H01P3/085 , H05K1/0225 , H05K1/0253 , H05K1/0284 , H05K1/0393 , H05K1/147 , H05K2201/09245 , H05K2201/09281 , H05K2201/09727
摘要： A dielectric element assembly includes a plurality of dielectric layers stacked on each other in a direction of lamination and extends in an x-axis direction. A signal line is provided in the dielectric element assembly and extends in the x-axis direction. A reference ground conductor is provided on a positive side in a z-axis direction relative to the signal line. An auxiliary ground conductor is provided on a negative side in the z-axis direction relative to the signal line. Via-hole conductors connect the reference ground conductor and the auxiliary ground conductor and are provided in the dielectric element assembly on the negative side relative to the center in a y-axis direction. A portion of the signal line in a section which includes the via-hole conductors is positioned on the positive side in the y-axis direction relative to another portion of the signal line in a section which does not include the via-hole conductors.
摘要翻译：电介质元件组件包括在层叠方向上彼此堆叠并沿x轴方向延伸的多个电介质层。信号线设置在电介质元件组件中并沿x轴方向延伸。参考接地导体相对于信号线在z轴方向的正侧设置。辅助接地导体相对于信号线设置在z轴方向的负侧。通孔导体连接参考接地导体和辅助接地导体，并且在y轴方向相对于中心的负侧设置介质元件组件。包括通孔导体的部分中的信号线的一部分在不包括通孔导体的部分中位于相对于信号线的另一部分的y轴方向的正侧。

8. 发明授权

US09401532B2 High-frequency signal line and electronic device including the same 有权
标题翻译：高频信号线和电子设备包括相同
公开(公告)号：US09401532B2
公开(公告)日：2016-07-26
申请号：US14191605
申请日：2014-02-27
申请人： Murata Manufacturing Co., Ltd.
发明人： Shigeru Tago , Satoshi Sasaki , Noboru Kato
IPC分类号： H01P3/08 , H05K1/02 , H05K1/14 , H05K3/46 , H01P5/02
CPC分类号： H01P3/08 , H01P3/081 , H01P3/085 , H01P5/028 , H05K1/0225 , H05K1/0253 , H05K1/028 , H05K1/147 , H05K3/4635 , H05K2201/0191 , H05K2201/09309 , H05K2201/09618 , H05K2201/09727 , H05K2201/10037
摘要： A high-frequency signal line includes a dielectric element body including regions and a plurality of flexible dielectric sheets. A signal conductive layer is provided in or on the dielectric element body. Ground conductive layers are provided in or on the dielectric element body and face the signal conductive layer. A distance between the ground conductive layer and the signal conductive layer in the region is smaller than a distance between the ground conductive layer and the signal conductive layer in the regions. The dielectric element body is bent in the region.
摘要翻译：高频信号线包括具有区域和多个柔性电介质片的电介质元件体。信号导电层设置在电介质元件主体中或其上。接地导电层设置在电介质元件主体中或其上，并面向信号导电层。该区域中的接地导电层和信号导电层之间的距离小于该区域中的接地导电层与信号导电层之间的距离。电介质元件体在该区域中弯曲。

9. 发明授权

US10992042B2 High-frequency transmission line 有权
公开(公告)号：US10992042B2
公开(公告)日：2021-04-27
申请号：US16258862
申请日：2019-01-28
申请人： Murata Manufacturing Co., Ltd.
发明人： Noboru Kato , Satoshi Sasaki
IPC分类号： H01Q9/04 , H01P3/08 , H01P5/02 , H01P1/02 , H01Q21/06
摘要： An antenna is connected to a first end of a high-frequency transmission line, and a connector is connected to a second end of the high-frequency transmission line. A characteristic impedance of a microstrip line is higher than characteristic impedances of first and second strip lines, and a characteristic impedance of a coplanar line is higher than a characteristic impedance of the second strip line. Thus, at a certain frequency, a standing wave develops in which the position of the microstrip line and the position of the coplanar line are maximum voltage points and three-quarter-wavelength resonance is a fundamental wave mode. Thus, the cutoff frequency of the high-frequency transmission line is high, and an insertion loss of a signal is significantly reduced to be low over a wide band.

10. 发明授权

US09882256B2 High-frequency signal transmission line and electronic apparatus 有权
公开(公告)号：US09882256B2
公开(公告)日：2018-01-30
申请号：US15156395
申请日：2016-05-17
申请人： Murata Manufacturing Co., Ltd.
发明人： Noboru Kato , Shigeru Tago , Jun Sasaki , Junichi Kurita , Satoshi Sasaki
IPC分类号： H01P3/08 , H01P3/02 , H04B15/00 , H01P3/10 , H03H7/38 , H01P3/12 , H01P3/00 , H05K1/02 , H05K1/03 , H05K1/11 , H01P1/203
CPC分类号： H01P3/085 , H01L2224/16225 , H01L2924/19105 , H01P1/20363 , H01P3/003 , H01P3/026 , H01P3/08 , H01P3/10 , H01P3/121 , H03H7/38 , H04B15/00 , H05K1/0219 , H05K1/0225 , H05K1/0242 , H05K1/025 , H05K1/0253 , H05K1/028 , H05K1/0393 , H05K1/113 , H05K2201/09618 , H05K2201/0969 , H05K2201/09727
摘要： An easily bendable high-frequency signal transmission line includes a dielectric body including a protection layer and dielectric sheets laminated on each other, a surface and an undersurface. A signal line is a linear conductor disposed in the dielectric body. A ground conductor is disposed in the dielectric body, faces the signal line via the dielectric sheet, and continuously extends along the signal line. A ground conductor is disposed in the dielectric body, faces the ground conductor via the signal line sandwiched therebetween, and includes a plurality of openings arranged along the signal line. The surface of the dielectric body on the side of the ground conductor with respect to the signal line is in contact with a battery pack.

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