专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US09275884B2 Systems and methods for inhibiting oxide growth in substrate handler vacuum chambers 有权
标题翻译：用于抑制衬底处理器真空室中的氧化物生长的系统和方法
公开(公告)号：US09275884B2
公开(公告)日：2016-03-01
申请号：US13419625
申请日：2012-03-14
申请人： Mukul Khosla , Ronald Powell , Arun Keshavamurthy , Richard Blank
发明人： Mukul Khosla , Ronald Powell , Arun Keshavamurthy , Richard Blank
IPC分类号： H01L21/677 , C23C14/56
CPC分类号： H01L21/67742 , C23C14/564 , C23C14/568
摘要： A substrate handling robot includes an arm section and a wrist portion connected to the arm section. An end effector is connected to the wrist portion and is configured to support a substrate. A housing is arranged adjacent to the end effector and includes a gas outlet that directs gas onto an exposed surface of the substrate during transport.
摘要翻译：基板处理机器人包括臂部和连接到臂部的腕部。端部执行器连接到腕部并被构造成支撑衬底。壳体布置成与端部执行器相邻，并且包括在运输期间将气体引导到衬底的暴露表面上的气体出口。

2. 发明申请

US20120251271A1 SYSTEMS AND METHODS FOR INHIBITING OXIDE GROWTH IN SUBSTRATE HANDLER VACUUM CHAMBERS 有权
标题翻译：用于抑制基底处理器真空室中氧化物生长的系统和方法
公开(公告)号：US20120251271A1
公开(公告)日：2012-10-04
申请号：US13419625
申请日：2012-03-14
申请人： Mukul Khosla , Ronald Powell , Arun Keshavamurthy , Richard Blank
发明人： Mukul Khosla , Ronald Powell , Arun Keshavamurthy , Richard Blank
IPC分类号： B65G47/90
CPC分类号： H01L21/67742 , C23C14/564 , C23C14/568
摘要： A substrate handling robot includes an arm section and a wrist portion connected to the arm section. An end effector is connected to the wrist portion and is configured to support a substrate. A housing is arranged adjacent to the end effector and includes a gas outlet that directs gas onto an exposed surface of the substrate during transport.
摘要翻译：基板处理机器人包括臂部和连接到臂部的腕部。端部执行器连接到腕部并被构造成支撑衬底。壳体布置成与端部执行器相邻，并且包括在运输期间将气体引导到衬底的暴露表面上的气体出口。

3. 发明授权

US07048316B1 Compound angled pad end-effector 有权
标题翻译：复合角垫片末端执行器
公开(公告)号：US07048316B1
公开(公告)日：2006-05-23
申请号：US10194529
申请日：2002-07-12
申请人： Richard Blank , Simon Chan , Edmund Minshall , Peter Woytowitz
发明人： Richard Blank , Simon Chan , Edmund Minshall , Peter Woytowitz
IPC分类号： B66C1/00
CPC分类号： H01L21/68707 , H01L21/67748 , Y10S294/902 , Y10S414/135 , Y10S414/141
摘要： This invention provides a method and a support device for a wafer transfer process which has a first vertical, second horizontal and third compound angled surfaces, as well as a pair of sidewalls all contiguously connected to one another. The third surface has at least two angled receiving surfaces whereby one of such angled receiving surfaces has a small angle of incline for initially receiving and delivering a wafer. The other angled receiving surface has a steep angle of incline for effectively receiving, holding and transporting a semiconductor wafer by increasing an effective coefficient of friction of the wafer to provide a secure resting point for such wafer during a transfer process while simultaneously increasing the speed thereof. Furthermore, a hole may be provided in the support device for attaching the support device, or a plurality of support devices having holes, to an end-effector.
摘要翻译：本发明提供了一种用于晶片转移过程的方法和支持装置，其具有第一垂直，第二水平和第三复合物的倾斜表面，以及一对彼此连续地连接的侧壁。第三表面具有至少两个成角度的接收表面，由此这种成角度的接收表面中的一个具有小的倾斜角度，用于初始接收和传送晶片。另一个倾斜的接收表面具有陡峭的倾斜角，用于通过增加晶片的有效摩擦系数来有效地接收，保持和传输半导体晶片，以在转移过程中为这种晶片提供安全的静止点，同时增加其速度。此外，可以在支撑装置中设置孔，用于将支撑装置或具有孔的多个支撑装置附接到端部执行器。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式