专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US07579685B2 Wafer level packaging cap and fabrication method thereof 有权
标题翻译：晶圆级封装盖及其制造方法
公开(公告)号：US07579685B2
公开(公告)日：2009-08-25
申请号：US11339500
申请日：2006-01-26
申请人： Moon-chul Lee , Woon-bae Kim , Kae-dong Back , Qian Wang , Jun-sik Hwang , Kyu-dong Jung
发明人： Moon-chul Lee , Woon-bae Kim , Kae-dong Back , Qian Wang , Jun-sik Hwang , Kyu-dong Jung
IPC分类号： H01L23/12 , H01L23/043
CPC分类号： B81C1/00301 , B81B2207/095 , H01L21/76898 , H01L23/04 , H01L23/10 , H01L23/481 , H01L2924/0002 , H01L2924/00
摘要： A wafer level packaging cap and method thereof for a wafer level packaging are provided. The wafer level packaging cap covering a device wafer with a device thereon, includes a cap wafer having on a bottom surface a cavity providing a space for receiving the device, and integrally combined with the device wafer, a plurality of metal lines formed on the bottom surface of the cap wafer to correspond to a plurality of device pads formed on the device wafer to be electrically connected to the device, a plurality of buffer portions connected to the plurality of metal lines and comprising a buffer wafer with a plurality of grooves and a metal filled in the plurality of grooves, a plurality of connection rods electrically connected to the plurality of buffer portions and penetrating the cap wafer from a top portion of the buffer portion, and a plurality of cap pads formed on a top surface of the cap wafer and electrically connected to a plurality of connection rods.
摘要翻译：提供了一种用于晶片级封装的晶片级封装盖及其方法。覆盖其上具有器件的器件晶片的晶片级封装盖包括盖晶片，其在底表面上具有提供用于接收器件的空间并与器件晶片整体结合的空腔，形成在底部的多个金属线盖片晶片的表面对应于形成在器件晶片上以电连接到器件的多个器件焊盘，多个缓冲部分连接到多个金属线并且包括具有多个沟槽的缓冲晶片和填充在所述多个槽中的金属，多个连接杆，电连接到所述多个缓冲部分，并且从所述缓冲部分的顶部穿透所述盖片;以及形成在所述盖片的顶表面上的多个帽垫并且电连接到多个连接杆。

2. 发明申请

US20060175707A1 Wafer level packaging cap and fabrication method thereof 有权
公开(公告)号：US20060175707A1
公开(公告)日：2006-08-10
申请号：US11339500
申请日：2006-01-26
申请人： Moon-chul Lee , Woon-bae Kim , Kae-dong Back , Qian Wang , Jun-sik Hwang , Kyu-dong Jung
发明人： Moon-chul Lee , Woon-bae Kim , Kae-dong Back , Qian Wang , Jun-sik Hwang , Kyu-dong Jung
IPC分类号： H01L23/52
CPC分类号： B81C1/00301 , B81B2207/095 , H01L21/76898 , H01L23/04 , H01L23/10 , H01L23/481 , H01L2924/0002 , H01L2924/00
摘要： A wafer level packaging cap and method thereof for a wafer level packaging are provided. The wafer level packaging cap covering a device wafer with a device thereon, includes a cap wafer having on a bottom surface a cavity providing a space for receiving the device, and integrally combined with the device wafer, a plurality of metal lines formed on the bottom surface of the cap wafer to correspond to a plurality of device pads formed on the device wafer to be electrically connected to the device, a plurality of buffer portions connected to the plurality of metal lines and comprising a buffer wafer with a plurality of grooves and a metal filled in the plurality of grooves, a plurality of connection rods electrically connected to the plurality of buffer portions and penetrating the cap wafer from a top portion of the buffer portion, and a plurality of cap pads formed on a top surface of the cap wafer and electrically connected to a plurality of connection rods.

3. 发明授权

US07510968B2 Cap for semiconductor device package, and manufacturing method thereof 有权
标题翻译：半导体器件封装用封装及其制造方法
公开(公告)号：US07510968B2
公开(公告)日：2009-03-31
申请号：US11412900
申请日：2006-04-28
申请人： Moon-chul Lee , Jong-oh Kwon , Kae-dong Back , Qian Wang , Jun-sik Hwang , Kyu-dong Jung
发明人： Moon-chul Lee , Jong-oh Kwon , Kae-dong Back , Qian Wang , Jun-sik Hwang , Kyu-dong Jung
IPC分类号： H01L21/44
CPC分类号： B81C1/00301 , B81B2207/095 , H01L23/04 , H01L2924/0002 , H01L2924/01079 , H01L2924/00
摘要： A cap for a semiconductor device package, including a body formed at a predetermined thickness with a cavity. The cap further includes a first seed layer formed on an inner circumference of a first via hole formed at a predetermined depth from the cavity formation surface of the body, a second seed layer formed on an inner circumference of a second via hole formed at a predetermined depth from the opposite surface to the cavity formation surface of the body, and plating materials filled in the first via hole and the second via hole.
摘要翻译：一种用于半导体器件封装的帽，包括以预定厚度形成有空腔的主体。所述盖还包括形成在与所述主体的空腔形成表面形成在预定深度的第一通孔的内周上的第一籽晶层，形成在形成为预定的第二通孔的第二通孔的内周上的第二籽晶层深度从主体的相对表面到空腔形成表面，以及填充在第一通孔和第二通孔中的电镀材料。

4. 发明申请

US20060286798A1 Cap for semiconductor device package, and manufacturing method thereof 有权
公开(公告)号：US20060286798A1
公开(公告)日：2006-12-21
申请号：US11412900
申请日：2006-04-28
申请人： Moon-chul Lee , Jong-oh Kwon , Kae-dong Back , Qian Wang , Jun-sik Hwang , Kyu-dong Jung
发明人： Moon-chul Lee , Jong-oh Kwon , Kae-dong Back , Qian Wang , Jun-sik Hwang , Kyu-dong Jung
IPC分类号： H01L21/44
CPC分类号： B81C1/00301 , B81B2207/095 , H01L23/04 , H01L2924/0002 , H01L2924/01079 , H01L2924/00
摘要： A cap for a semiconductor device package, including a body formed at a predetermined thickness with a cavity. The cap further includes a first seed layer formed on an inner circumference of a first via hole formed at a predetermined depth from the cavity formation surface of the body, a second seed layer formed on an inner circumference of a second via hole formed at a predetermined depth from the opposite surface to the cavity formation surface of the body, and plating materials filled in the first via hole and the second via hole.

5. 外观设计

USD1024599S1 Adjustable beverage can storage organizer rack 有权
公开(公告)号：USD1024599S1
公开(公告)日：2024-04-30
申请号：US29861439
申请日：2022-11-30
申请人： Qian Wang
设计人： Qian Wang
摘要： FIG. 1 is a top perspective view of an adjustable beverage can storage organizer rack, showing my new design;
FIG. 2 is a bottom perspective view thereof;
FIG. 3 is a front elevation view thereof, the rear elevations view being a mirror image of FIG. 3;
FIG. 4 is a left side elevation view thereof;
FIG. 5 is a right side elevation view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof;
FIG. 8 is a partial enlarged view of FIG. 1;
FIG. 9 is a partial enlarged view of FIG. 1; and,
FIG. 10 is a partial enlarged view of FIG. 2.
The broken lines in the figures demarcate enlarged areas and form no part of the claimed design.

6. 发明授权

US10487309B2 Incorporation of plant virus particles and polymers as 2D and 3D scaffolds to manipulate cellular behaviors 有权
公开(公告)号：US10487309B2
公开(公告)日：2019-11-26
申请号：US15424064
申请日：2017-02-03
申请人： Qian Wang , Lim Andrew Lee
发明人： Qian Wang , Lim Andrew Lee
IPC分类号： C12N7/00 , C12N5/00
CPC分类号： C12N5/0068 , C12N7/00 , C12N2501/11 , C12N2501/115 , C12N2501/15 , C12N2533/50 , C12N2770/00031
摘要： Methods are generally disclosed for attaching a cell binding motif to a carboxy end of a coat protein of a Tobacco Mosaic Virus particle to form a modified-TMV particle; and attaching a cell to the cell binding motif of the modified-TMV particle. Methods are also disclosed for incorporated virus particles, e.g., TMV virus particles into hydrogels.

7. 发明授权

US09881217B2 Method for detecting crowd density, and method and apparatus for detecting interest degree of crowd in target position 有权
公开(公告)号：US09881217B2
公开(公告)日：2018-01-30
申请号：US14935627
申请日：2015-11-09
申请人： Xin Wang , Shengyin Fan , Gang Qiao , Qian Wang
发明人： Xin Wang , Shengyin Fan , Gang Qiao , Qian Wang
IPC分类号： H04N7/18 , G06K9/00 , G06K9/46
CPC分类号： G06K9/00778 , G06K9/00369 , G06K2009/4666
摘要： A method and an apparatus for detecting an interest degree of a crowd in a target position are disclosed. The interest degree detection method includes projecting a depth image obtained by photographing onto a height-top-view, the depth image including the crowd and the target position; dividing the height-top-view into cells; determining density of the crowd in each cell; determining a moving speed and a moving direction of the crowd in each cell; determining orientation of the crowd in each cell; and determining, based on the density, the moving speed, the moving direction and the orientation of the crowd, the interest degree of the crowd in each cell in the target position. According to this method, the interest degree of the crowd in the target position can be detected accurately, even at a crowded place where it is difficult to detect and track a single person.

8. 发明申请

US20170175079A1 Incorporation of Plant Virus Particles and Polymers as 2D and 3D Scaffolds to Manipulate Cellular Behaviors 审中-公开
公开(公告)号：US20170175079A1
公开(公告)日：2017-06-22
申请号：US15424064
申请日：2017-02-03
申请人： Qian Wang , Lim Andrew Lee
发明人： Qian Wang , Lim Andrew Lee
IPC分类号： C12N5/00 , C12N7/00
CPC分类号： C12N5/0068 , C12N7/00 , C12N2501/11 , C12N2501/115 , C12N2501/15 , C12N2533/50 , C12N2770/00031
摘要： Methods are generally disclosed for attaching a cell binding motif to a carboxy end of a coat protein of a Tobacco Mosaic Virus particle to form a modified-TMV particle; and attaching a cell to the cell binding motif of the modified-TMV particle. Methods are also disclosed for incorporated virus particles, e.g., TMV virus particles into hydrogels.

9. 发明申请

US20160335490A1 METHOD AND APPARATUS FOR DETECTING PERSONS, AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM 有权
标题翻译：用于检测人员的方法和装置以及非终端计算机可读记录介质
公开(公告)号：US20160335490A1
公开(公告)日：2016-11-17
申请号：US15148391
申请日：2016-05-06
申请人： Xin WANG , Shengyin Fan , Qian Wang , Jiadan Zhu
发明人： Xin WANG , Shengyin Fan , Qian Wang , Jiadan Zhu
IPC分类号： G06K9/00 , G06T7/00 , G06T7/40 , G06K9/62
CPC分类号： G06K9/00369 , G06K9/00778
摘要： A method and an apparatus for detecting persons are disclosed. The method includes initially detecting the persons in a height-top-view; dividing the height-top-view into one or more regions, and estimating crowd density in each region; determining, based on the crowd density, visible regions of the initially detected persons in each of the regions; for each of the initially detected persons, extracting a first gradient feature and a second gradient feature of the person from the height-top-view, and a grayscale image or a color image corresponding to the height-top-view, respectively; for each of the initially detected persons, determining, based on the extracted first gradient feature and second gradient feature, using a previously constructed classifier corresponding to the determined visible region of the person, a confidence level of the initially detected person; and correcting, based on the confidence level, a detection result of the initially detected persons.
摘要翻译：公开了一种用于检测人的方法和装置。该方法包括：首先检测身高高的人物; 将高空视图划分为一个或多个区域，并估算每个区域的人群密度; 基于人群密度确定每个区域中初始检测到的人的可见区域; 对于每个初始检测到的人，分别从高空俯视图提取人的第一梯度特征和第二梯度特征，以及灰度图像或与高度 - 俯视图相对应的彩色图像; 对于每个初始检测到的人，基于所提取的第一梯度特征和第二梯度特征，使用与所确定的人的可见区域相对应的先前构造的分类器来确定初始检测到的人的置信水平; 以及基于置信水平来校正初始检测到的人的检测结果。

10. 发明申请

US20150115437A1 UNIVERSAL ENCAPSULATION SUBSTRATE, ENCAPSULATION STRUCTURE AND ENCAPSULATION METHOD 审中-公开
标题翻译：通用封装基材，封装结构和封装方法
公开(公告)号：US20150115437A1
公开(公告)日：2015-04-30
申请号：US14365100
申请日：2011-12-23
申请人： Jian Cai , Yuanyuan Pu , Qian Wang , Han Guo
发明人： Jian Cai , Yuanyuan Pu , Qian Wang , Han Guo
IPC分类号： H01L23/498 , H01L23/00
CPC分类号： H01L23/49827 , H01L23/147 , H01L23/3128 , H01L23/49816 , H01L23/49833 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/85 , H01L24/92 , H01L25/0655 , H01L2224/29339 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/48471 , H01L2224/48624 , H01L2224/48644 , H01L2224/48647 , H01L2224/48724 , H01L2224/48744 , H01L2224/48747 , H01L2224/48824 , H01L2224/48844 , H01L2224/48847 , H01L2224/73265 , H01L2224/85181 , H01L2224/85186 , H01L2224/85424 , H01L2224/85444 , H01L2224/85447 , H01L2224/92247 , H01L2924/01013 , H01L2924/01047 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/157 , H01L2924/15787 , H01L2924/181 , H01L2924/00014 , H01L2924/00012 , H01L2224/73204 , H01L2224/16225 , H01L2924/00015 , H01L2924/00
摘要： A universal packaging substrate, comprising a first substrate (102) and a silicon interposer (103), wherein, a plurality of bumps (106) are formed between the upper surface of the first substrate (102) and the lower surface of the silicon interposer (103) and electrically connect the upper surface of the first substrate (102) and the lower surface of the silicon interposer (103), and a plurality of wire bonding pads are formed on the upper surface of the silicon interposer (103) and are electrically connected to the bumps (106) respectively via silicon through holes (105). Also disclosed are a packaging structure provided with the packaging substrate and an packaging method. The substrate is suitable for small batch integrated circuit products, providing low cost and short cycle for packaging.
摘要翻译：一种通用封装基板，包括第一基板（102）和硅插入件（103），其中在第一基板（102）的上表面和硅插入件的下表面之间形成多个凸块（106）（103）并且将所述第一基板（102）的上表面和所述硅插入件（103）的下表面电连接，并且在所述硅插入件（103）的上表面上形成多个引线接合焊盘，并且分别经由硅通孔（105）与凸块（106）电连接。还公开了设置有包装基板的包装结构和包装方法。该基板适用于小批量集成电路产品，为包装提供低成本和短周期。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式