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1. 发明申请

US20070221920A1 Semiconductor component having test pads and method and apparatus for testing same 有权
标题翻译：具有测试焊盘的半导体部件及其测试方法和装置
公开(公告)号：US20070221920A1
公开(公告)日：2007-09-27
申请号：US11804391
申请日：2007-05-17
申请人： Mohsen Mardi , Jae Cho , Xin Wu , Chih-Chung Wu , Shih-Liang Liang , Sanjiv Stokes , Hassan Bazargan
发明人： Mohsen Mardi , Jae Cho , Xin Wu , Chih-Chung Wu , Shih-Liang Liang , Sanjiv Stokes , Hassan Bazargan
IPC分类号： H01L23/485
CPC分类号： H01L22/32 , H01L24/05 , H01L24/06 , H01L2224/02166 , H01L2224/0401 , H01L2224/05552 , H01L2224/05554 , H01L2224/05567 , H01L2224/05599 , H01L2924/00014 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H05K1/0268 , H01L2924/00012 , H01L2924/00
摘要： A semiconductor component having test pads and a method and apparatus for testing the same is described. In an example, an un-bumped substrate is obtained having a pattern of bond pads configured to support bumped contacts and a plurality of test pads. Each of the plurality of test pads is in electrical communication with a respective one of the bond pads. The substrate is tested using the plurality of test pads. In another example, a substrate is fabricated having a pattern of bond pads configured to support bumped contacts and a plurality of test pads. Each of the plurality of test pads is in electrical communication with a respective one of the bond pads. The substrate is tested using the plurality of test pads. An insulating layer is formed over the plurality of test pads.
摘要翻译：描述了具有测试焊盘的半导体部件及其测试方法和装置。在一个示例中，获得具有被配置为支撑凸起的触点和多个测试焊盘的接合焊盘图案的未凸起的衬底。多个测试焊盘中的每一个与相应的一个接合焊盘电连通。使用多个测试垫测试衬底。在另一示例中，制造具有被配置为支撑凸起的触点和多个测试焊盘的接合焊盘图案的衬底。多个测试焊盘中的每一个与相应的一个接合焊盘电连通。使用多个测试垫测试衬底。绝缘层形成在多个测试焊盘上。

2. 发明申请

US20070218573A1 Semiconductor component having test pads and method and apparatus for testing same 审中-公开
公开(公告)号：US20070218573A1
公开(公告)日：2007-09-20
申请号：US11804496
申请日：2007-05-17
申请人： Mohsen Mardi , Jae Cho , Xin Wu , Chih-Chung Wu , Shih-Liang Liang , Sanjiv Stokes , Hassan Bazargan
发明人： Mohsen Mardi , Jae Cho , Xin Wu , Chih-Chung Wu , Shih-Liang Liang , Sanjiv Stokes , Hassan Bazargan
IPC分类号： H01L21/66
CPC分类号： H01L22/32 , H01L24/05 , H01L24/06 , H01L2224/02166 , H01L2224/0401 , H01L2224/05552 , H01L2224/05554 , H01L2224/05567 , H01L2224/05599 , H01L2924/00014 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H05K1/0268 , H01L2924/00012 , H01L2924/00
摘要： A semiconductor component having test pads and a method and apparatus for testing the same is described. In an example, an un-bumped substrate is obtained having a pattern of bond pads configured to support bumped contacts and a plurality of test pads. Each of the plurality of test pads is in electrical communication with a respective one of the bond pads. The substrate is tested using the plurality of test pads. In another example, a substrate is fabricated having a pattern of bond pads configured to support bumped contacts and a plurality of test pads. Each of the plurality of test pads is in electrical communication with a respective one of the bond pads. The substrate is tested using the plurality of test pads. An insulating layer is formed over the plurality of test pads.

3. 发明授权

US07737439B2 Semiconductor component having test pads and method and apparatus for testing same 有权
标题翻译：具有测试焊盘的半导体部件及其测试方法和装置
公开(公告)号：US07737439B2
公开(公告)日：2010-06-15
申请号：US11804391
申请日：2007-05-17
申请人： Mohsen Hossein Mardi , Jae Cho , Xin X. Wu , Chih-Chung Wu , Shih-Liang Liang , Sanjiv Stokes , Hassan K. Bazargan
发明人： Mohsen Hossein Mardi , Jae Cho , Xin X. Wu , Chih-Chung Wu , Shih-Liang Liang , Sanjiv Stokes , Hassan K. Bazargan
IPC分类号： H01L23/485
CPC分类号： H01L22/32 , H01L24/05 , H01L24/06 , H01L2224/02166 , H01L2224/0401 , H01L2224/05552 , H01L2224/05554 , H01L2224/05567 , H01L2224/05599 , H01L2924/00014 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H05K1/0268 , H01L2924/00012 , H01L2924/00
摘要： A semiconductor component having test pads and a method and apparatus for testing the same is described. In an example, an un-bumped substrate is obtained having a pattern of bond pads configured to support bumped contacts and a plurality of test pads. Each of the plurality of test pads is in electrical communication with a respective one of the bond pads. The substrate is tested using the plurality of test pads. In another example, a substrate is fabricated having a pattern of bond pads configured to support bumped contacts and a plurality of test pads. Each of the plurality of test pads is in electrical communication with a respective one of the bond pads. The substrate is tested using the plurality of test pads. An insulating layer is formed over the plurality of test pads.
摘要翻译：描述了具有测试焊盘的半导体部件及其测试方法和装置。在一个示例中，获得具有被配置为支撑凸起的触点和多个测试焊盘的接合焊盘图案的未凸起的衬底。多个测试焊盘中的每一个与相应的一个接合焊盘电连通。使用多个测试垫测试衬底。在另一示例中，制造具有被配置为支撑凸起的触点和多个测试焊盘的接合焊盘图案的衬底。多个测试焊盘中的每一个与相应的一个接合焊盘电连通。使用多个测试垫测试衬底。绝缘层形成在多个测试焊盘上。

4. 发明授权

US07235412B1 Semiconductor component having test pads and method and apparatus for testing same 有权
公开(公告)号：US07235412B1
公开(公告)日：2007-06-26
申请号：US10842770
申请日：2004-05-11
申请人： Mohsen Hossein Mardi , Jae Cho , Xin X. Wu , Chih-Chung Wu , Shih-Liang Liang , Sanjiv Stokes , Hassan K. Bazargan
发明人： Mohsen Hossein Mardi , Jae Cho , Xin X. Wu , Chih-Chung Wu , Shih-Liang Liang , Sanjiv Stokes , Hassan K. Bazargan
IPC分类号： H01L21/66
CPC分类号： H01L22/32 , H01L24/05 , H01L24/06 , H01L2224/02166 , H01L2224/0401 , H01L2224/05552 , H01L2224/05554 , H01L2224/05567 , H01L2224/05599 , H01L2924/00014 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H05K1/0268 , H01L2924/00012 , H01L2924/00
摘要： A semiconductor component having test pads and a method and apparatus for testing the same is described. In an example, an un-bumped substrate is obtained having a pattern of bond pads configured to support bumped contacts and a plurality of test pads. Each of the plurality of test pads is in electrical communication with a respective one of the bond pads. The substrate is tested using the plurality of test pads. In another example, a substrate is fabricated having a pattern of bond pads configured to support bumped contacts and a plurality of test pads. Each of the plurality of test pads is in electrical communication with a respective one of the bond pads. The substrate is tested using the plurality of test pads. An insulating layer is formed over the plurality of test pads.

5. 发明授权

US07952969B2 Read and write power control methods and system for optical recording device 有权
标题翻译：读写功率控制方法和系统的光学记录装置
公开(公告)号：US07952969B2
公开(公告)日：2011-05-31
申请号：US12762206
申请日：2010-04-16
申请人： Chih-Chung Wu , Chi-Pei Huang , Ming-Jiou Yu
发明人： Chih-Chung Wu , Chi-Pei Huang , Ming-Jiou Yu
IPC分类号： G11B7/00
CPC分类号： G11B7/1263 , G11B7/0045 , G11B7/00745
摘要： The present invention discloses read and write power control methods and system for an optical recording device that records information on an optical disk having read-only areas. The read and write power control methods respectively introduce the steps of determining a specific level of a former power control signal output based on a former power control, and then according to the specific level, setting a predetermined level of a power control signal to induce a present power control for rapidly outputting a proper power of the pick-up head. Accordingly, the level transition of the read/write power control signal can be shortened and even eliminated. An unstable read/write power output for the pick-up head can be avoided.
摘要翻译：本发明公开了一种用于在具有只读区域的光盘上记录信息的光记录装置的读写功率控制方法和系统。读取和写入功率控制方法分别引入了基于先前的功率控制来确定前一个功率控制信号输出的特定电平的步骤，然后根据特定的电平，设置功率控制信号的预定电平以诱导提供用于快速输出拾取头的适当功率的功率控制。因此，读/写功率控制信号的电平转换可以被缩短甚至消除。可以避免拾取头的不稳定的读/写功率输出。

6. 发明授权

US07266076B2 Automatic detecting device for land pre-pits signals 失效
标题翻译：土地预坑信号自动检测装置
公开(公告)号：US07266076B2
公开(公告)日：2007-09-04
申请号：US10743429
申请日：2003-12-23
申请人： Feng-Hsiang Lo , Yong-Long Lee , Kuo-Ding Shin , Chin-Shou Huang , Shin-Huei Wu , Chih-Chung Wu , Shin-Bo Wang
发明人： Feng-Hsiang Lo , Yong-Long Lee , Kuo-Ding Shin , Chin-Shou Huang , Shin-Huei Wu , Chih-Chung Wu , Shin-Bo Wang
IPC分类号： G11B7/00
CPC分类号： G11B7/0053 , G11B7/0941
摘要： An automatic detecting device of land pre-pits signal is disclosed. The device adjusts gain of push-pull signals to raise the signal to noise ratio of the land pre-pits signal to the wobble signal. Digital logic computation is also utilized to recognize the practical position of the land pre-pits. The level automatic detection of the RC circuit and the fixed slice level compose an automatic slice level, which is the basis for detecting the land pre-pits. The disclosed device eliminates the drawback of not easy to obtain correct land pre-pits signal from written disks by the conventional of fixed land pre-pits slice level technology.
摘要翻译：公开了一种陆地预制坑信号的自动检测装置。该装置调整推挽信号的增益，以将陆地预制凹坑信号的信噪比提高到摆动信号。数字逻辑计算也用于识别土地预制坑的实际位置。 RC电路的电平自动检测和固定切片电平构成自动切片电平，是检测土地预制坑的基础。所公开的装置消除了通过常规的固定地面预制切片级技术不容易从写入盘获得正确的地面预制凹坑信号的缺点。

7. 发明申请

US20050002304A1 Automatic detecting device for land pre-pits signals 失效
标题翻译：土地预坑信号自动检测装置
公开(公告)号：US20050002304A1
公开(公告)日：2005-01-06
申请号：US10743429
申请日：2003-12-23
申请人： Feng-Hsiang Lo , Yong-Long Lee , Kuo-Ding Shin , Chin-Shou Huang , Shin-Huei Wu , Chih-Chung Wu , Shin-Bo Wang
发明人： Feng-Hsiang Lo , Yong-Long Lee , Kuo-Ding Shin , Chin-Shou Huang , Shin-Huei Wu , Chih-Chung Wu , Shin-Bo Wang
IPC分类号： G11B7/00 , G11B7/005 , G11B7/09
CPC分类号： G11B7/0053 , G11B7/0941
摘要： An automatic detecting device of land pre-pits signal is disclosed. The device adjusts gain of push-pull signals to raise the signal to noise ratio of the land pre-pits signal to the wobble signal. Digital logic computation is also utilized to recognize the practical position of the land pre-pits. The level automatic detection of the RC circuit and the fixed slice level compose an automatic slice level, which is the basis for detecting the land pre-pits. The disclosed device eliminates the drawback of not easy to obtain correct land pre-pits signal from written disks by the conventional of fixed land pre-pits slice level technology.
摘要翻译：公开了一种陆地预制坑信号的自动检测装置。该装置调整推挽信号的增益，以将陆地预制凹坑信号的信噪比提高到摆动信号。数字逻辑计算也用于识别土地预制坑的实际位置。 RC电路的电平自动检测和固定切片电平构成自动切片电平，是检测土地预制坑的基础。所公开的装置消除了通过常规的固定地面预制切片级技术不容易从写入盘获得正确的地面预制凹坑信号的缺点。

8. 发明申请

US20090317939A1 Fabrication Methods for Nano-Scale Chalcopyritic Powders and Polymeric Thin-Film Solar Cells 有权
标题翻译：纳米级黄铜矿粉末和聚合物薄膜太阳能电池的制备方法
公开(公告)号：US20090317939A1
公开(公告)日：2009-12-24
申请号：US12110295
申请日：2008-04-26
申请人： Yu Huang , Bing-Joe Hwang , Hsuan-Fu Wang , Chih-Chung Wu , Shih-Hong Chang
发明人： Yu Huang , Bing-Joe Hwang , Hsuan-Fu Wang , Chih-Chung Wu , Shih-Hong Chang
IPC分类号： H01L31/18 , C01B19/00
CPC分类号： C01B19/002 , C01G3/00 , C01G15/00 , C01P2002/72 , C01P2002/85 , C01P2006/40 , H01L51/0037
摘要： Fabrication methods for nano-scale chalcopyritic powders and polymeric thin-film solar cells are presented. The fabrication method for nano-scale chalcopyritic powders includes providing a solution consisting of group IB, IIIA, VIA elements on the chemistry periodic table or combinations thereof. The solution is heated by a microwave generator. The solution is washed and filtered by a washing agent. The solution is subsequently dried, thereby acquiring nano-scale chalcopyritic powders.
摘要翻译：提出了纳米级黄铜矿粉末和聚合物薄膜太阳能电池的制备方法。纳米级黄铜矿粉末的制造方法包括在化学周期表上提供由IB，IIIA，VIA族元素组成的溶液或其组合。溶液由微波发生器加热。将溶液洗涤并用洗涤剂过滤。随后将溶液干燥，从而获得纳米级黄铜矿粉末。

9. 发明申请

US20070217308A1 Header region protection apparatus and method of optical storage medium 有权
标题翻译：光存储介质的头区保护装置及方法
公开(公告)号：US20070217308A1
公开(公告)日：2007-09-20
申请号：US11385530
申请日：2006-03-20
申请人： Hong-Ching Chen , Chih-Chung Wu , Kun-Hung Hsieh
发明人： Hong-Ching Chen , Chih-Chung Wu , Kun-Hung Hsieh
IPC分类号： G11B27/36
CPC分类号： G11B20/1426 , G11B20/10222 , G11B2020/1232 , G11B2020/1281
摘要： A header region protection apparatus of an optical storage medium. The apparatus comprises an encoder, a header location generator, and a header protector. The encoder converts user data to an EFM signal and a write enable signal according to a write clock. The header location generator generates a header location signal. The header protector is coupled to the encoder and the header location generator and generates a header protect write enable signal according to the write enable signal and the header location signal.
摘要翻译：光存储介质的标题区域保护装置。该装置包括编码器，报头位置发生器和报头保护器。编码器根据写时钟将用户数据转换为EFM信号和写使能信号。报头位置发生器产生报头位置信号。头部保护器耦合到编码器和头部位置发生器，并根据写入使能信号和头部位置信号产生头部保护写入使能信号。

10. 发明授权

US06400572B1 Fastener for a heat sink 失效
标题翻译：用于散热器的紧固件
公开(公告)号：US06400572B1
公开(公告)日：2002-06-04
申请号：US09772368
申请日：2001-01-30
申请人： Chih-Chung Wu
发明人： Chih-Chung Wu
IPC分类号： H05K720
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A fastener for combining a heat sink with an integrated circuit comprises a lateral strip and a lever. The lateral strip has a main portion with a first end formed as a first buckle that defines an aperture and a second end formed as a link for pivotally connecting the lever. Two taps extend perpendicularly downward from the lateral strip. The lever has a bottom end formed as a second buckle that defines an opening. When the fastener is applied to the heat sink that contacts with an integrated circuit which is attached on an integrated circuit base, the first and second buckles clasp two hooks of the integrated circuit base hence the two taps tightly contact with the heat sink so as to enhance the heat dissipating efficiency.
摘要翻译：用于将散热器与集成电路组合的紧固件包括侧向条和杠杆。横向条具有主要部分，其第一端形成为限定孔的第一带扣，第二端形成为用于枢转地连接杠杆的连杆。两个水龙头从侧向条垂直向下延伸。杠杆具有形成为限定开口的第二带扣的底端。当紧固件被施加到与附接在集成电路基座上的集成电路接触的散热器时，第一和第二扣环扣住集成电路基座的两个钩，因此两个抽头与散热器紧密接触，以便提高散热效率。

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