专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US4509035A Humidity-sensitive element and process for producing the same 失效
标题翻译：湿度敏感元件及其制造方法
公开(公告)号：US4509035A
公开(公告)日：1985-04-02
申请号：US556598
申请日：1983-11-30
申请人： Mituo Harata , Hideaki Hiraki , Shigeki Uno , Kazuo Sakuma , Kiyosi Matsunaga
发明人： Mituo Harata , Hideaki Hiraki , Shigeki Uno , Kazuo Sakuma , Kiyosi Matsunaga
IPC分类号： H01C7/00 , G01N27/12
CPC分类号： G01N27/121
摘要： A humidity-sensitive element which has excellent humidity-sensitive characteristics and has a small drift after being exposed to a high humidity for a long period of time. The humidity-sensitive element of the invention includes a porous metal oxide sintered body, a simple substance or an oxide of phosphorus or sulfur carried on the porous metal oxide sintered body, and copper ions carried on the porous metal oxide sintered body.
摘要翻译：一种湿度敏感元件，其具有优异的湿度敏感性，并且在长时间暴露于高湿度之后具有较小的漂移。本发明的湿度敏感元件包括多孔金属氧化物烧结体，承载在多孔金属氧化物烧结体上的单质或磷或硫的氧化物，以及携带在多孔金属氧化物烧结体上的铜离子。

2. 发明授权

US4529540A Humidity-sensitive resistive element 失效
标题翻译：湿敏电阻元件
公开(公告)号：US4529540A
公开(公告)日：1985-07-16
申请号：US582553
申请日：1984-02-22
申请人： Shigeki Uno , Mituo Harata , Kazuo Sakuma , Hideaki Hiraki
发明人： Shigeki Uno , Mituo Harata , Kazuo Sakuma , Hideaki Hiraki
IPC分类号： H01C7/00 , G01N27/12 , H01B1/06
CPC分类号： G01N27/121
摘要： A humidity-sensitive element comprises a humidity-sensitive body which includes 21-73 mol % of Cr.sub.2 O.sub.3, 25-55 mol % of at least one member selected from the group consisting of ZnO and MgO, 0.5-8.0 mol % of CuO, 0.5-8.0 mol % of Li.sub.2 O, and 0.5-8.0 mol % of V.sub.2 O.sub.5, and a pair of electrodes attached to the body. Such an element provides excellent stability over a wide range of humidity and temperature levels.
摘要翻译：湿敏元件包括湿敏体，其包含21-73mol％的Cr 2 O 3，25-55mol％的选自ZnO和MgO中的至少一种，0.5-8.0mol％的CuO，0.5 -8.0摩尔％的Li 2 O和0.5-8.0摩尔％的V 2 O 5，以及一对电极，附着于该体。这样的元件在宽范围的湿度和温度水平下提供优异的稳定性。

3. 发明申请

US20050097727A1 Multi-layer wiring board, method for producing multi-layer wiring board, polishing machine for multi-layer wiring board, and metal sheet for producing wiring board 审中-公开
标题翻译：多层布线板，多层布线板的制造方法，多层布线板的研磨机，以及制造布线板的金属板
公开(公告)号：US20050097727A1
公开(公告)日：2005-05-12
申请号：US10450844
申请日：2002-03-27
申请人： Tomoo Iijima , Yoshiro Kato , Hiroshi Odaira , Masayuki Ohsawa , Inetaro Kurosawa , Kazuo Sakuma , Toshihiko Asano , Kimitaka Endo
发明人： Tomoo Iijima , Yoshiro Kato , Hiroshi Odaira , Masayuki Ohsawa , Inetaro Kurosawa , Kazuo Sakuma , Toshihiko Asano , Kimitaka Endo
IPC分类号： B24B1/00 , B24B7/22 , B24B37/04 , H05K3/06 , H05K3/40 , H05K3/46 , H01R3/00 , B23P19/00
CPC分类号： H05K3/4614 , B24B1/00 , B24B7/228 , B24B37/04 , H05K3/06 , H05K3/4038 , H05K3/4652 , H05K2201/0355 , H05K2203/0143 , H05K2203/025 , H05K2203/0384 , H05K2203/061 , Y10T29/5313
摘要： A plurality of multi-layer metal plates (1) each being composed of a bump forming metal layer (2), an etching stop layer (3), and a wiring film forming metal layer (4), and in which a wiring film (4a) is formed from the wiring film forming metal layer and a bump 2a is formed from the bump forming metal layer are prepared, and on a bump forming surface of a multi-layer metal plate, a wiring film of another multi-layer metal plate is overlapped. Such lamination process is repeated in succession for multi-layering. In addition, a polishing machine for multi-layer wiring board (11a) which includes metal plate holding means (13) for holding a metal plate (1a), cutter holding means (25) for holding a cutter (26) above the metal plate, height adjustment mechanism (20) for adjusting the height of the cutter holding means, and cutter parallel moving mechanism (15) for relatively moving the cutter holding means in parallel to the surface of the metal plate is used to conduct polishing.
摘要翻译：多个多层金属板（1）各自由凸块形成金属层（2），蚀刻停止层（3）和布线膜形成金属层（4）构成，其中布线膜由凸极形成金属层形成由布线膜形成金属层形成的凸块2a，并且在多层金属板的凸块形成表面上形成另一多层的布线膜金属板重叠。这样的层压方法被连续重复进行多层。另外，包括用于保持金属板（1a）的金属板保持装置（13）的多层布线板（11a）的抛光机，用于将切割器（26）保持在其上方的切割器保持装置（25）金属板，用于调节刀具保持装置的高度的高度调节机构（20）以及用于使刀具保持装置平行于金属板的表面相对移动的刀具平行移动机构（15）进行抛光。

4. 发明授权

US08618659B2 Package-on-package assembly with wire bonds to encapsulation surface 有权
标题翻译：封装在封装上的组件，其中引线键合到封装表面
公开(公告)号：US08618659B2
公开(公告)日：2013-12-31
申请号：US13462158
申请日：2012-05-02
申请人： Hiroaki Sato , Teck-Gyu Kang , Belgacem Haba , Philip R. Osborn , Wei-Shun Wang , Ellis Chau , Ilyas Mohammed , Norihito Masuda , Kazuo Sakuma , Kiyoaki Hashimoto , Kurosawa Inetaro , Tomoyuki Kikuchi
发明人： Hiroaki Sato , Teck-Gyu Kang , Belgacem Haba , Philip R. Osborn , Wei-Shun Wang , Ellis Chau , Ilyas Mohammed , Norihito Masuda , Kazuo Sakuma , Kiyoaki Hashimoto , Kurosawa Inetaro , Tomoyuki Kikuchi
IPC分类号： H01L23/48
CPC分类号： H01L21/4885 , H01L21/565 , H01L23/13 , H01L23/3121 , H01L23/49517 , H01L23/49811 , H01L23/5389 , H01L24/73 , H01L25/105 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/4824 , H01L2224/48247 , H01L2224/73204 , H01L2224/73215 , H01L2224/73265 , H01L2225/06565 , H01L2225/1023 , H01L2225/1029 , H01L2225/1041 , H01L2225/1058 , H01L2924/00013 , H01L2924/181 , H01L2924/1815 , H01L2924/19107 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要： A microelectronic assembly includes a substrate having a first surface and a second surface remote from the first surface. A microelectronic element overlies the first surface and first electrically conductive elements are exposed at one of the first surface and the second surface. Some of the first conductive elements are electrically connected to the microelectronic element. Wire bonds have bases joined to the conductive elements and end surfaces remote from the substrate and the bases, each wire bond defining an edge surface extending between the base and the end surface. An encapsulation layer extends from the first surface and fills spaces between the wire bonds such that the wire bonds are separated by the encapsulation layer. Unencapsulated portions of the wire bonds are defined by at least portions of the end surfaces of the wire bonds that are uncovered by the encapsulation layer.
摘要翻译：微电子组件包括具有第一表面和远离第一表面的第二表面的衬底。微电子元件覆盖在第一表面上，并且第一导电元件暴露在第一表面和第二表面中的一个处。一些第一导电元件电连接到微电子元件。线接合具有连接到远离基板和基座的导电元件和端表面的基部，每个引线接合限定在基部和端表面之间延伸的边缘表面。封装层从第一表面延伸并填充引线键合之间的空间，使得引线键合被封装层分离。引线键合的未封装的部分由未被封装层覆盖的引线接合端表面的至少部分限定。

5. 发明申请

US20120280386A1 PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE 有权
标题翻译：包装在包装上装配有电线到封装表面
公开(公告)号：US20120280386A1
公开(公告)日：2012-11-08
申请号：US13462158
申请日：2012-05-02
申请人： Hiroaki Sato , Teck-Gyu Kang , Belgacem Haba , Philip R. Osborn , Wei-Shun Wang , Ellis Chau , Ilyas Mohammed , Norihito Masuda , Kazuo Sakuma , Kiyoaki Hashimoto , Kurosawa Inetaro , Tomoyuki Kikuchi
发明人： Hiroaki Sato , Teck-Gyu Kang , Belgacem Haba , Philip R. Osborn , Wei-Shun Wang , Ellis Chau , Ilyas Mohammed , Norihito Masuda , Kazuo Sakuma , Kiyoaki Hashimoto , Kurosawa Inetaro , Tomoyuki Kikuchi
IPC分类号： H01L23/498 , H01L21/56 , H01L21/50 , H01L23/48
CPC分类号： H01L21/4885 , H01L21/565 , H01L23/13 , H01L23/3121 , H01L23/49517 , H01L23/49811 , H01L23/5389 , H01L24/73 , H01L25/105 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/4824 , H01L2224/48247 , H01L2224/73204 , H01L2224/73215 , H01L2224/73265 , H01L2225/06565 , H01L2225/1023 , H01L2225/1029 , H01L2225/1041 , H01L2225/1058 , H01L2924/00013 , H01L2924/181 , H01L2924/1815 , H01L2924/19107 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要： A microelectronic assembly includes a substrate having a first surface and a second surface remote from the first surface. A microelectronic element overlies the first surface and first electrically conductive elements are exposed at one of the first surface and the second surface. Some of the first conductive elements are electrically connected to the microelectronic element. Wire bonds have bases joined to the conductive elements and end surfaces remote from the substrate and the bases, each wire bond defining an edge surface extending between the base and the end surface. An encapsulation layer extends from the first surface and fills spaces between the wire bonds such that the wire bonds are separated by the encapsulation layer. Unencapsulated portions of the wire bonds are defined by at least portions of the end surfaces of the wire bonds that are uncovered by the encapsulation layer.
摘要翻译：微电子组件包括具有第一表面和远离第一表面的第二表面的衬底。微电子元件覆盖在第一表面上，并且第一导电元件暴露在第一表面和第二表面中的一个处。一些第一导电元件电连接到微电子元件。线接合具有连接到远离基板和基座的导电元件和端表面的基部，每个引线接合限定在基部和端表面之间延伸的边缘表面。封装层从第一表面延伸并填充引线键合之间的空间，使得引线键合被封装层分离。引线键合的未封装的部分由未被封装层覆盖的引线接合端表面的至少部分限定。

6. 发明申请

US20070221329A1 Apparatus and method for distributing a liquid onto a surface of an item 审中-公开
标题翻译：将液体分配到物品表面上的装置和方法
公开(公告)号：US20070221329A1
公开(公告)日：2007-09-27
申请号：US11585287
申请日：2006-10-23
申请人： Kazuo Sakuma , Inetaro Kurosawa , Kiyoshi Hyodo
发明人： Kazuo Sakuma , Inetaro Kurosawa , Kiyoshi Hyodo
IPC分类号： H01L21/306 , B44C1/22
CPC分类号： H05K3/0085 , H01L21/6708 , H01L21/67706 , H01L21/67721 , H01L21/6776 , H05K1/0393 , H05K3/068 , H05K2201/09018 , H05K2203/0746 , H05K2203/1572
摘要： An apparatus and method are provided for processing an item by distributing a liquid onto a surface of the item. The apparatus includes a conveyor which defines an undulating path which varies in vertical position relative to the direction of movement of the item conveyable along the path. Thus, the path has at least one apex at a location of the path higher than other locations in the direction of movement along the path. A sprayer is operable to spray the liquid onto the surface of the item at a location that is substantially aligned to the apex of the path.
摘要翻译：提供了一种通过将液体分配到物品的表面上来处理物品的装置和方法。该设备包括一个输送机，该输送机限定了一个波浪路径，该波纹路径相对于沿该路径可传送的物品的移动方向在垂直位置上变化。因此，路径在路径的位置处具有比沿着路径的移动方向上的其他位置更高的位置处的至少一个顶点。喷雾器可操作以在基本上与路径的顶点对准的位置处将液体喷射到物品的表面上。

7. 发明授权

US08884432B2 Substrate and assembly thereof with dielectric removal for increased post height 有权
标题翻译：衬底及其组装与电介质去除增加后柱高度
公开(公告)号：US08884432B2
公开(公告)日：2014-11-11
申请号：US13155845
申请日：2011-06-08
申请人： Kazuo Sakuma , Philip Damberg , Belgacem Haba
发明人： Kazuo Sakuma , Philip Damberg , Belgacem Haba
IPC分类号： H05K1/09 , H01L23/498
CPC分类号： H01L21/4853 , H01L23/3142 , H01L23/498 , H01L23/49816 , H01L23/49838 , H01L24/01 , H01L24/15 , H01L24/16 , H01L24/17 , H01L24/81 , H01L2224/16225 , H01L2224/16238 , H01L2224/32225 , H01L2224/73204 , H01L2224/81192 , H01L2224/81193 , H01L2224/81801 , H01L2924/01013 , H01L2924/01028 , H01L2924/01029 , H01L2924/01079 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/2064 , H01L2924/20641 , H05K1/0284 , H05K1/0306 , H05K1/09 , H05K3/002 , H05K2201/0166 , H01L2924/00
摘要： An interconnection substrate includes a plurality of electrically conductive elements of at least one wiring layer defining first and second lateral directions. Electrically conductive projections for bonding to electrically conductive contacts of at least one component external to the substrate, extend from the conductive elements above the at least one wiring layer. The conductive projections have end portions remote from the conductive elements and neck portions between the conductive elements and the end portions. The end portions have lower surfaces extending outwardly from the neck portions in at least one of the lateral directions. The substrate further includes a dielectric layer overlying the conductive elements and extending upwardly along the neck portions at least to the lower surfaces. At least portions of the dielectric layer between the conductive projections are recessed below a height of the lower surfaces.
摘要翻译：互连衬底包括限定第一和第二横向方向的至少一个布线层的多个导电元件。导电突起，用于粘合到基板外部的至少一个部件的导电触点，从导电元件延伸到至少一个布线层之上。导电突起具有远离导电元件的端部和导电元件与端部之间的颈部。端部具有在至少一个横向方向上从颈部部分向外延伸的下表面。衬底还包括覆盖导电元件并且沿着颈部部分至少向下表面向上延伸的电介质层。导电突起之间的电介质层的至少部分凹陷在下表面的高度之下。

8. 发明授权

US08637992B2 Flip chip package for DRAM with two underfill materials 有权
标题翻译：具有两个底层填充材料的DRAM的倒装芯片封装
公开(公告)号：US08637992B2
公开(公告)日：2014-01-28
申请号：US13307395
申请日：2011-11-30
申请人： Kazuo Sakuma , Ilyas Mohammed , Philip Damberg
发明人： Kazuo Sakuma , Ilyas Mohammed , Philip Damberg
IPC分类号： H01L23/48
CPC分类号： H01L21/563 , H01L23/13 , H01L23/3128 , H01L23/49816 , H01L23/49827 , H01L24/05 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/0401 , H01L2224/05647 , H01L2224/131 , H01L2224/13111 , H01L2224/1329 , H01L2224/133 , H01L2224/14136 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/2919 , H01L2224/29191 , H01L2224/32145 , H01L2224/32227 , H01L2224/3303 , H01L2224/33051 , H01L2224/331 , H01L2224/33505 , H01L2224/73203 , H01L2224/73204 , H01L2224/81801 , H01L2224/8184 , H01L2224/8185 , H01L2224/83102 , H01L2224/83192 , H01L2224/8385 , H01L2224/9211 , H01L2224/92125 , H01L2924/01322 , H01L2924/07811 , H01L2924/12042 , H01L2924/15151 , H01L2924/15311 , H01L2924/181 , H01L2924/014 , H01L2924/00014 , H01L2224/81 , H01L2224/83 , H01L2924/00 , H01L2924/00012
摘要： A microelectronic package can include a substrate having a first surface and a plurality of substrate contacts at the first surface and a microelectronic element having a front surface and contacts arranged within a contact-bearing region of the front surface. The contacts of the microelectronic element can face the substrate contacts and can be joined thereto. An underfill can be disposed between the substrate first surface and the contact-bearing region of the front surface of the microelectronic element. The underfill can reinforce the joints between the contacts and the substrate contacts. A joining material can bond the substrate first surface with the front surface of the microelectronic element. The joining material can have a Young's modulus less than 75% of a Young's modulus of the underfill.
摘要翻译：微电子封装可以包括在第一表面具有第一表面和多个基板触点的基板和具有前表面的微电子元件和布置在前表面的接触区域内的触点。微电子元件的触点可以面对基板触点并且可以与其接合。可以在基板第一表面和微电子元件的前表面的接触区域之间设置底部填充物。底部填充物可以加强触点和基板触点之间的接合。接合材料可以将基板第一表面与微电子元件的前表面接合。接合材料的杨氏模量可以小于底部填充物的杨氏模量的75％。

9. 发明申请

US20120313242A1 SUBSTRATE AND ASSEMBLY THEREOF WITH DIELECTRIC REMOVAL FOR INCREASED POST HEIGHT 有权
标题翻译：基板和组件，用于提高后置高度的电介质去除
公开(公告)号：US20120313242A1
公开(公告)日：2012-12-13
申请号：US13155845
申请日：2011-06-08
申请人： Kazuo Sakuma , Philip Damberg , Belgacem Haba
发明人： Kazuo Sakuma , Philip Damberg , Belgacem Haba
IPC分类号： H01L23/48 , H01L21/60 , H01L21/768
CPC分类号： H01L21/4853 , H01L23/3142 , H01L23/498 , H01L23/49816 , H01L23/49838 , H01L24/01 , H01L24/15 , H01L24/16 , H01L24/17 , H01L24/81 , H01L2224/16225 , H01L2224/16238 , H01L2224/32225 , H01L2224/73204 , H01L2224/81192 , H01L2224/81193 , H01L2224/81801 , H01L2924/01013 , H01L2924/01028 , H01L2924/01029 , H01L2924/01079 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/2064 , H01L2924/20641 , H05K1/0284 , H05K1/0306 , H05K1/09 , H05K3/002 , H05K2201/0166 , H01L2924/00
摘要： An interconnection substrate includes a plurality of electrically conductive elements of at least one wiring layer defining first and second lateral directions. Electrically conductive projections for bonding to electrically conductive contacts of at least one component external to the substrate, extend from the conductive elements above the at least one wiring layer. The conductive projections have end portions remote from the conductive elements and neck portions between the conductive elements and the end portions. The end portions have lower surfaces extending outwardly from the neck portions in at least one of the lateral directions. The substrate further includes a dielectric layer overlying the conductive elements and extending upwardly along the neck portions at least to the lower surfaces. At least portions of the dielectric layer between the conductive projections are recessed below a height of the lower surfaces.
摘要翻译：互连衬底包括限定第一和第二横向方向的至少一个布线层的多个导电元件。导电突起，用于粘合到基板外部的至少一个部件的导电触点，从导电元件延伸到至少一个布线层之上。导电突起具有远离导电元件的端部和导电元件与端部之间的颈部。端部具有在至少一个横向方向上从颈部部分向外延伸的下表面。衬底还包括覆盖导电元件并且沿着颈部部分至少向下表面向上延伸的电介质层。导电突起之间的电介质层的至少部分凹陷在下表面的高度之下。

10. 发明申请

US20120069578A1 ILLUMINATING DEVICE 有权
标题翻译：照明设备
公开(公告)号：US20120069578A1
公开(公告)日：2012-03-22
申请号：US13322821
申请日：2010-05-20
申请人： Norihiro Sakai , Tomohiro Iwazaki , Kazuo Sakuma , Ichirou Mori , Masaki Kanai , Maki Takenaga , Hiroyuki Ootsuka
发明人： Norihiro Sakai , Tomohiro Iwazaki , Kazuo Sakuma , Ichirou Mori , Masaki Kanai , Maki Takenaga , Hiroyuki Ootsuka
IPC分类号： F21V7/00
CPC分类号： F21V14/04 , F21S8/006 , F21Y2103/00
摘要： An illuminating device that can reduce illuminance unevenness of an irradiation target face with a simple construction is provided. In a pseudo sunlight illuminating device 1 having a lamp 22 for illuminating an irradiation target face 10A, a transmission light amount adjusting unit 60 for adjusting a transmission light amount so that the illuminance distribution on the irradiation target face 10a is made uniform is provided between the lamp 22 and the irradiation target face 10A, and the transmission light amount adjusting unit 60 is provided with a light transmission plate laminate member 64 which is constructed by stacking light transmission plates 65 which are constant in transmittance in a wavelength range of light to be transmitted and whose number corresponds to an adjustment amount of the transmission light amount so that incident light is reflected at each boundary of the front and back surfaces of each light transmission plate 65.
摘要翻译：提供能够以简单的结构减少照射目标面的照度不均的照明装置。在具有用于照射照射目标面10A的灯22的伪太阳光照明装置1中，设置用于调整透射光量使得照射目标面10a上的照度分布均匀的透射光量调节单元60 灯22和照射目标面10A，传输光量调节单元60设置有透光板层叠构件64，该透光板层叠构件64通过堆叠在透射的光的波长范围内透射率恒定的透光板65而构成并且其数量对应于透射光量的调节量，使得入射光在每个透光板65的前表面和后表面的每个边界处被反射。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式