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1. 发明申请

US20080241488A1 Thermally conductive sheet and method of manufacturing the same 有权
标题翻译：导热片及其制造方法
公开(公告)号：US20080241488A1
公开(公告)日：2008-10-02
申请号：US12079399
申请日：2008-03-26
申请人： Mitsuru Ohta , Motoki Ozawa , Yoshiaki Okabayashi
发明人： Mitsuru Ohta , Motoki Ozawa , Yoshiaki Okabayashi
IPC分类号： B32B3/10 , B32B7/02 , B32B37/00
CPC分类号： H01L23/3735 , H01L23/3733 , H01L23/3737 , H01L2224/29499 , H01L2924/0002 , H01L2924/12044 , Y10T156/10 , Y10T428/24802 , Y10T428/24826 , Y10T428/24851 , Y10T428/24893 , Y10T428/24942 , H01L2924/00
摘要： A thermally conductive sheet comprises a thermally conductive polymer layer, an adhesive layer provided on an outer surface of the thermally conductive polymer layer, and a thermal diffusion layer, which is a functional layer provided on the adhesive layer. The thermally conductive polymer layer is formed of a thermally conductive polymer composition containing a polymer matrix and a thermally conductive filler. The coefficient of static friction of the thermally conductive polymer layer is 1.0 or lower. The adhesive layer has an outer shape smaller than that of the thermally conductive polymer layer.
摘要翻译：导热片包括导热聚合物层，设置在导热聚合物层的外表面上的粘合剂层和作为设置在粘合剂层上的功能层的热扩散层。导热聚合物层由含有聚合物基质和导热填料的导热聚合物组合物形成。导热性聚合物层的静摩擦系数为1.0以下。粘合剂层的外形小于导热聚合物层的外形。

2. 发明授权

US08691368B2 Thermally conductive sheet and method of manufacturing the same 有权
标题翻译：导热片及其制造方法
公开(公告)号：US08691368B2
公开(公告)日：2014-04-08
申请号：US12079399
申请日：2008-03-26
申请人： Mitsuru Ohta , Motoki Ozawa , Yoshiaki Okabayashi
发明人： Mitsuru Ohta , Motoki Ozawa , Yoshiaki Okabayashi
IPC分类号： B32B3/10
CPC分类号： H01L23/3735 , H01L23/3733 , H01L23/3737 , H01L2224/29499 , H01L2924/0002 , H01L2924/12044 , Y10T156/10 , Y10T428/24802 , Y10T428/24826 , Y10T428/24851 , Y10T428/24893 , Y10T428/24942 , H01L2924/00
摘要： A thermally conductive sheet comprises a thermally conductive polymer layer, an adhesive layer provided on an outer surface of the thermally conductive polymer layer, and a thermal diffusion layer, which is a functional layer provided on the adhesive layer. The thermally conductive polymer layer is formed of a thermally conductive polymer composition containing a polymer matrix and a thermally conductive filler. The coefficient of static friction of the thermally conductive polymer layer is 1.0 or lower. The adhesive layer has an outer shape smaller than that of the thermally conductive polymer layer.
摘要翻译：导热片包括导热聚合物层，设置在导热聚合物层的外表面上的粘合剂层和作为设置在粘合剂层上的功能层的热扩散层。导热聚合物层由含有聚合物基质和导热填料的导热聚合物组合物形成。导热性聚合物层的静摩擦系数为1.0以下。粘合剂层的外形小于导热聚合物层的外形。

3. 发明授权

US08287975B2 Laminated body 有权
标题翻译：层压体
公开(公告)号：US08287975B2
公开(公告)日：2012-10-16
申请号：US12055594
申请日：2008-03-26
申请人： Mitsuru Ohta , Motoki Ozawa , Fumitaka Arai
发明人： Mitsuru Ohta , Motoki Ozawa , Fumitaka Arai
IPC分类号： B32B7/12 , F28F3/00
CPC分类号： B32B27/00 , F28F13/00 , F28F2013/006 , H01L23/3733 , H01L23/3735 , H01L2924/0002 , Y10T428/14 , Y10T428/1471 , Y10T428/149 , Y10T428/15 , Y10T428/23 , Y10T428/239 , Y10T428/24752 , Y10T428/24777 , Y10T428/24793 , Y10T428/24802 , Y10T428/24851 , Y10T428/2486 , Y10T428/28 , Y10T428/2848 , Y10T428/30 , H01L2924/00
摘要： A laminated body comprises a thermally conductive sheet, a protective sheet, an auxiliary sheet, a carrier sheet and a coating sheet. The thermally conductive sheet comprises a main sheet body and an adhesive layer. The coefficient of static friction of the main sheet body is 1.0 or lower. The adhesive layer has high adhesiveness in comparison with the main sheet body, and has an outer shape smaller than that of the main sheet body. The protective sheet is formed having an outer shape larger than that of the adhesive layer, and provided with a cutting line extending toward the adhesive layer from the peripheral portion of the protective sheet so that the protective sheet can be cut along the cutting line.
摘要翻译：层压体包括导热片，保护片，辅助片，载体片和涂层片。导热片包括主片体和粘合剂层。主片体的静摩擦系数为1.0以下。粘合剂层与主片体相比具有高粘附性，并且具有比主片体的外形小的外形。保护片形成为具有比粘合剂层大的外形，并且设置有从保护片的周边部朝向粘合剂层延伸的切割线，使得可以沿着切割线切割保护片。

4. 发明申请

US20070000642A1 Thermally conductive member and cooling system using the same 审中-公开
标题翻译：导热构件和使用其的冷却系统
公开(公告)号：US20070000642A1
公开(公告)日：2007-01-04
申请号：US11474236
申请日：2006-06-23
申请人： Jun Yamazaki , Mitsuru Ohta , Motoki Ozawa , Kikuo Fujiwara
发明人： Jun Yamazaki , Mitsuru Ohta , Motoki Ozawa , Kikuo Fujiwara
IPC分类号： H05K7/20
CPC分类号： H01L23/3737 , H01L23/3677 , H01L2224/32245
摘要： A thermally conductive member including a thermal diffusion sheet having at least one opening with an inner periphery; and a thermally conductive elastomer piece passing through the opening of the sheet is provided. The thermally conductive elastomer piece includes at least one base portion fitting with the inner periphery of the opening of the thermal diffusion sheet and at least one projecting portion connected to the base portion and projecting out from the surface of the thermal diffusion sheet.
摘要翻译：一种导热构件，包括具有至少一个具有内周边的开口的热扩散片; 并且设置穿过片材的开口的导热弹性体片。导热弹性体件包括与热扩散片的开口的内周配合的至少一个基部和连接到基部并且从热扩散片的表面突出的至少一个突出部。

5. 发明申请

US20080236806A1 Laminated Body 有权
标题翻译：层压体
公开(公告)号：US20080236806A1
公开(公告)日：2008-10-02
申请号：US12055594
申请日：2008-03-26
申请人： Mitsuru Ohta , Motoki Ozawa , Fumitaka Arai
发明人： Mitsuru Ohta , Motoki Ozawa , Fumitaka Arai
IPC分类号： B32B7/12 , F28F3/00
CPC分类号： B32B27/00 , F28F13/00 , F28F2013/006 , H01L23/3733 , H01L23/3735 , H01L2924/0002 , Y10T428/14 , Y10T428/1471 , Y10T428/149 , Y10T428/15 , Y10T428/23 , Y10T428/239 , Y10T428/24752 , Y10T428/24777 , Y10T428/24793 , Y10T428/24802 , Y10T428/24851 , Y10T428/2486 , Y10T428/28 , Y10T428/2848 , Y10T428/30 , H01L2924/00
摘要： A laminated body comprises a thermally conductive sheet, a protective sheet, an auxiliary sheet, a carrier sheet and a coating sheet. The thermally conductive sheet comprises a main sheet body and an adhesive layer. The coefficient of static friction of the main sheet body is 1.0 or lower. The adhesive layer has high adhesiveness in comparison with the main sheet body, and has an outer shape smaller than that of the main sheet body. The protective sheet is formed having an outer shape larger than that of the adhesive layer, and provided with a cutting line extending toward the adhesive layer from the peripheral portion of the protective sheet so that the protective sheet can be cut along the cutting line.
摘要翻译：层压体包括导热片，保护片，辅助片，载体片和涂层片。导热片包括主片体和粘合剂层。主片体的静摩擦系数为1.0以下。粘合剂层与主片体相比具有高粘附性，并且具有比主片体的外形小的外形。保护片形成为具有比粘合剂层大的外形，并且设置有从保护片的周边部朝向粘合剂层延伸的切割线，使得可以沿着切割线切割保护片。

6. 发明授权

US07378607B2 Key sheet 失效
标题翻译：钥匙表
公开(公告)号：US07378607B2
公开(公告)日：2008-05-27
申请号：US11546432
申请日：2006-10-12
申请人： Shigeru Koyano , Yutaka Nakanishi , Motoki Ozawa
发明人： Shigeru Koyano , Yutaka Nakanishi , Motoki Ozawa
IPC分类号： H01H3/12
CPC分类号： H01H13/702 , H01H9/52 , H01H2239/072
摘要： Disclosed is a key sheet efficiently diffusing local heat generated by a device mounted on a board. A base sheet of a key sheet is provided with a heat diffusion sheet. The heat diffusion sheet is provided with a graphite sheet and a resin film and, in some cases, a thin metal plate. The base sheet itself thus constitutes the heat diffusion sheet, so even if no member for heat diffusion is provided between a board and the key sheet, it is possible to diffuse local heat generated by a semiconductor device in the face direction of the base sheet. Thus, with the key sheet, it is possible to meet the requirement for heat diffusion to eliminate local heat storage in electronic apparatuses and to meet the requirement for a reduction in the thickness and further in weight of electronic apparatuses.
摘要翻译：公开了一种有效地扩散由安装在板上的装置产生的局部热的按键板。按键板的基片设置有热扩散片。热扩散片设置有石墨片和树脂膜，并且在一些情况下设置有薄金属片。因此，基片本身构成热扩散片，因此即使没有在基板和键板之间设置用于热扩散的部件，也可以在基片的面方向扩散由半导体器件产生的局部热。因此，通过按键板，可以满足热扩散的要求，以消除电子设备中的局部蓄热，并且满足电子设备的厚度和重量的降低的要求。

7. 发明申请

US20100009109A1 Thermally conductive sheet composite and method for manufacturing the same 失效
标题翻译：导热片复合材料及其制造方法
公开(公告)号：US20100009109A1
公开(公告)日：2010-01-14
申请号：US12456964
申请日：2009-06-25
申请人： Motoki Ozawa
发明人： Motoki Ozawa
IPC分类号： B32B33/00 , B32B37/00
CPC分类号： F28F13/00 , F28F2013/006 , H01L23/3737 , H01L2924/0002 , Y10T428/1476 , Y10T428/25 , Y10T428/31504 , H01L2924/00
摘要： A thermally conductive sheet composite comprises a gelatinous thermally conductive sheet molded of a thermally conductive polymer composition containing a polymeric material and a thermally conductive filler, and a release sheet molded separately from the thermally conductive sheet and peelably laminated on at least one surface of a pair of surfaces of the thermally conductive sheet. The release sheet has a hardness of 30 or more as measured by a type A durometer in conformity with ISO 7619.
摘要翻译：导热片复合材料包括由包含聚合物材料和导热填料的导热聚合物组合物模制的凝胶状导热片，以及与导热片单独模制的剥离片，并且可剥离地层叠在一对表面上的导热片的表面。脱模片的硬度为30或更高，通过符合ISO 7619的A型硬度计测量。

8. 发明申请

US20070084709A1 Key sheet 失效
标题翻译：钥匙表
公开(公告)号：US20070084709A1
公开(公告)日：2007-04-19
申请号：US11546341
申请日：2006-10-12
申请人： Shigeru Koyano , Yutaka Nakanishi , Motoki Ozawa
发明人： Shigeru Koyano , Yutaka Nakanishi , Motoki Ozawa
IPC分类号： H01H13/14
CPC分类号： H01H9/52 , H01H13/702 , H01H2239/072 , H01H2300/036
摘要： Disclosed is a key sheet efficiently diffusing local heat generated by a device mounted on a board. A key sheet has a base sheet formed of a rubber-like elastic material in which a heat conductive filler is mixed. Thus, if a semiconductor device on a board generates heat, it is possible to suppress local heat storage by the heat conductive filler of the base sheet. Further, there is no need to provide a separate member for heat diffusion between the board and the key sheet, making it possible to realize a reduction in thickness. Thus, with the key sheet, it is possible to meet the requirement for heat diffusion to eliminate local heat storage in electronic apparatuses, and the requirement for a reduction in the thickness and weight of electronic apparatuses.
摘要翻译：公开了一种有效地扩散由安装在板上的装置产生的局部热的按键板。钥匙片具有由其中混合有导热填料的橡胶状弹性材料形成的基片。因此，如果板上的半导体器件产生热量，则可以抑制基片的导热性填料的局部蓄热。此外，不需要在板和键板之间提供用于热扩散的单独构件，使得可以实现厚度的减小。因此，通过按键板，可以满足热扩散的要求，以消除电子设备中的局部蓄热，以及降低电子设备的厚度和重量的要求。

9. 发明授权

US08377557B2 Thermally conductive sheet composite and method for manufacturing the same 失效
标题翻译：导热片复合材料及其制造方法
公开(公告)号：US08377557B2
公开(公告)日：2013-02-19
申请号：US12456964
申请日：2009-06-25
申请人： Motoki Ozawa
发明人： Motoki Ozawa
IPC分类号： B32B9/04 , B32B5/16
CPC分类号： F28F13/00 , F28F2013/006 , H01L23/3737 , H01L2924/0002 , Y10T428/1476 , Y10T428/25 , Y10T428/31504 , H01L2924/00
摘要： A thermally conductive sheet composite comprises a gelatinous thermally conductive sheet molded of a thermally conductive polymer composition containing a polymeric material and a thermally conductive filler, and a release sheet molded separately from the thermally conductive sheet and peelably laminated on at least one surface of a pair of surfaces of the thermally conductive sheet. The release sheet has a hardness of 30 or more as measured by a type A durometer in conformity with ISO 7619.
摘要翻译：导热片复合材料包括由包含聚合物材料和导热填料的导热聚合物组合物模制的凝胶状导热片，以及与导热片单独模制的剥离片，并且可剥离地层叠在一对表面上的导热片的表面。脱模片的硬度为30或更高，通过符合ISO 7619的A型硬度计测量。

10. 发明申请

US20080199688A1 Thermal Diffusion Sheet and Manufacturing Method of the Same 审中-公开
标题翻译：热扩散片及其制造方法
公开(公告)号：US20080199688A1
公开(公告)日：2008-08-21
申请号：US12027466
申请日：2008-02-07
申请人： Motoki Ozawa
发明人： Motoki Ozawa
IPC分类号： B32B7/02 , B32B15/04 , B05D5/12
CPC分类号： H01L23/3737 , B32B27/02 , H01L2924/0002 , Y10T428/26 , Y10T428/31678 , H01L2924/00
摘要： A thermal diffusion sheet is provided with a heat conducting layer, a thermal diffusion layer provided on the surface of the heat conducting layer and a heat insulating layer provided on the surface of the thermal diffusion layer. The heat conducting layer is formed of a composition containing an organic polymer and a heat conductive filler. The thermal diffusion layer is formed of a metal material. The heat insulating layer is formed of a material having electrical insulation properties. The thermal diffusion sheet is manufactured through providing a heat insulating layer on the surface of a thermal diffusion layer, preparing a composition, and forming a heat conducting layer. When preparing a composition, an organic polymer in liquid form having thermosetting properties and a heat conductive filler are mixed. When forming a heat conducting layer, the above described composition is applied to the surface of the thermal diffusion layer facing the surface on which the heat insulating layer has been provided, and after that, the composition is heated so that the organic polymer is cured.
摘要翻译：热扩散片设置有导热层，设置在导热层的表面上的热扩散层和设置在热扩散层的表面上的绝热层。导热层由含有有机聚合物和导热填料的组合物形成。热扩散层由金属材料形成。绝热层由具有电绝缘性的材料形成。通过在热扩散层的表面上设置绝热层，制备组合物并形成导热层来制造热扩散片。当制备组合物时，混合具有热固性质的液体形式的有机聚合物和导热填料。当形成导热层时，将上述组合物施加到面向已经设置绝热层的表面的热扩散层的表面上，之后加热组合物以使有机聚合物固化。

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