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1. 发明授权

US5389497A Method for forming patterned solder mask 失效
标题翻译：形成图案化焊接掩模的方法
公开(公告)号：US5389497A
公开(公告)日：1995-02-14
申请号：US70791
申请日：1993-06-03
申请人： Mitsuo Yoshioka , Yoshikazu Yamagami , Akio Kashihara , Kiyomi Sakurai
发明人： Mitsuo Yoshioka , Yoshikazu Yamagami , Akio Kashihara , Kiyomi Sakurai
IPC分类号： G03F7/00 , H05K3/28 , G03F7/16 , G03F7/26
CPC分类号： H05K3/28 , G03F7/0035 , H05K2201/0166 , H05K2203/0582 , H05K2203/1105
摘要： The present invention provides an improved method for forming a patterned solder mask having preferred electric insulating property, heat resistance-and chemical resistance on a printed circuit board with high resolution.
摘要翻译：本发明提供一种用于形成具有高分辨率的印刷电路板上具有优选的电绝缘性，耐热性和耐化学性的图案化焊料掩模的改进方法。

2. 发明授权

US5368884A Method of forming solder mask 失效
标题翻译：形成焊接掩模的方法
公开(公告)号：US5368884A
公开(公告)日：1994-11-29
申请号：US118231
申请日：1993-09-09
申请人： Yoshikazu Yamagami , Akio Kashihara , Mamoru Seio , Hisaki Tanabe
发明人： Yoshikazu Yamagami , Akio Kashihara , Mamoru Seio , Hisaki Tanabe
IPC分类号： G03F7/16 , H05K3/00 , H05K3/28 , B05D1/00
CPC分类号： G03F7/164 , H05K3/28 , H05K2203/1105 , H05K2203/1355 , H05K3/0079
摘要： The present invention has as its object providing a solder mask which permits high density mounting, is suitable for protecting conductor circuits, particularly has mask thickness on the circuit parts and each edge part of the circuits which make almost no difference from those on other parts, and is excellent in electrical insulation, heat resistance and solvent resistance.This invention provides a method of forming a solder mask for printed circuit boards, using any powder paint which is curable by both irradiation of ultraviolet ray and heat, comprising:(1) a step of coating the powder paint on a printed circuit board, while holding it at a temperature higher than a softening point of the powder paint,(2) a step of irradiating ultraviolet rays thereon through a pattern mask,(3) a step of making development with a medium which dissolves the region not irradiated by ultraviolet rays and,(4) a step of completely curing the coating part developed on the printed circuit board at a temperature higher than the curing temperature of the powder paint.
摘要翻译：本发明的目的是提供一种允许高密度安装的焊接掩模，适用于保护导体电路，特别是在电路部件和电路的每个边缘部分具有掩模厚度，与其它部件几乎没有区别，电绝缘性，耐热性和耐溶剂性优异。本发明提供一种形成印刷电路板用焊料掩模的方法，使用可通过紫外线照射和热照射两者固化的任何粉末涂料，其包括：（1）在粉末涂料上涂布印刷电路板的步骤，同时将其保持在高于粉末涂料的软化点的温度下，（2）通过图案掩模在其上照射紫外线的步骤，（3）利用溶解未被紫外线照射的区域的介质进行显影的步骤和（4）在高于粉末涂料的固化温度的温度下完全固化在印刷电路板上显影的涂层部分的步骤。

3. 发明授权

US5681485A Method of producing multilayer circuit boards 失效
标题翻译：生产多层电路板的方法
公开(公告)号：US5681485A
公开(公告)日：1997-10-28
申请号：US565402
申请日：1995-11-30
申请人： Yoshikazu Yamagami , Shinji Seo , Akio Kashihara
发明人： Yoshikazu Yamagami , Shinji Seo , Akio Kashihara
IPC分类号： G03F7/038 , H05K1/03 , H05K3/00 , H05K3/06 , H05K3/18 , H05K3/46 , B44C1/22 , C23F1/00
CPC分类号： G03F7/038 , H05K3/0023 , H05K1/0373 , H05K2201/0209 , H05K3/0076 , H05K3/064 , H05K3/181 , H05K3/4644
摘要： A method of producing multilayer circuit boardschar comprising repeating a procedure comprising the steps of (1) laminating a photosensitive film composition shaped in a film form onto an insulating material carrying a conductor pattern formed thereon, (2) exposing the laminated photosensitive film composition to light through a negative type photomask, (3) dissolving the domains not irradiated in the above exposure step, (4) heat-curing the domains not dissolved in step (3), (5) forming a copper plating layer on the surface of the photosensitive film composition heat-cured in step (4) by electroless copper plating with or without further electroplating of copper, and (6) forming, on the plated copper layer formed in step (5), a photosensitive etch resist layer and subjecting said layer to light exposure through a photomask having a circuit pattern drawn thereon, developing and etching to thereby form a conductor pattern, said photosensitive film composition for lamination containing at least 50% by weight of a bisphenol-epichlorohydrin type resin containing photosensitive functional groups and heat-curable functional groups.
摘要翻译：一种制造多层电路板的方法，包括重复步骤，其包括以下步骤：（1）将形成为膜状的感光性膜组合物层叠在承载有形成在其上的导体图案的绝缘材料上，（2）将层叠的感光性膜组合物曝光通过负型光掩模，（3）溶解在上述曝光步骤中未照射的畴，（4）热处理步骤（3）中不溶解的畴，（5）在感光体表面上形成镀铜层在步骤（4）中通过化学镀铜进行或不进一步电镀铜的步骤（4）中热固化的薄膜组合物，和（6）在步骤（5）中形成的镀覆铜层上形成感光蚀刻抗蚀剂层，通过具有在其上绘制的电路图案的光掩模进行曝光，显影和蚀刻从而形成导体图案，所述层压用感光膜组合物含有至少50重量％的含有光敏官能团和可热固化官能团的双酚表氯醇型树脂。

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