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1. 发明申请

US20100085512A1 SURFACE LIGHT SOURCE DEVICE AND LIQUID CRYSTAL DISPLAY DEVICE ASSEMBLY 审中-公开
标题翻译：表面光源装置和液晶显示装置组件
公开(公告)号：US20100085512A1
公开(公告)日：2010-04-08
申请号：US12571810
申请日：2009-10-01
申请人： Mitsunori Ueda , Kanji Yokomizo , Mariko Obinata , Yuichi Miyagawa
发明人： Mitsunori Ueda , Kanji Yokomizo , Mariko Obinata , Yuichi Miyagawa
IPC分类号： G02F1/13357
CPC分类号： G02F1/133609 , G02F1/13318 , G02F1/133603 , G02F2001/133607 , G02F2201/58 , G09G3/3426 , G09G2300/023 , G09G2320/064 , G09G2320/0646 , G09G2360/145 , G09G2360/16
摘要： Disclosed herein is a surface light source device that illuminates a transmissive liquid crystal display device having a display area formed of pixels arranged in a two-dimensional matrix from a back side of the liquid crystal display device, the surface light source device comprising a plurality of light emitting element units, wherein each of the light emitting element units includes: at least one first light emitting element assembly; at least one second light emitting element assembly; and at least one third light emitting element assembly, and focal length and lateral magnification of each of the first lens, the second lens, and the third lens are adjusted based on emission intensity distribution of each of the first light emitting element, the second light emitting element, and the third light emitting element.
摘要翻译：本发明公开了一种表面光源装置，其从液晶显示装置的背面照射具有由排列成二维矩阵的像素构成的显示区域的透射式液晶显示装置，所述面光源装置包括多个发光元件单元，其中每个发光元件单元包括：至少一个第一发光元件组件; 至少一个第二发光元件组件; 和至少一个第三发光元件组件，并且基于第一发光元件，第二光源的发光强度分布来调整第一透镜，第二透镜和第三透镜中的每一个的焦距和横向放大率发光元件和第三发光元件。

2. 发明申请

US20050075982A1 Personal information protective method 审中-公开
标题翻译：个人信息保护方式
公开(公告)号：US20050075982A1
公开(公告)日：2005-04-07
申请号：US10363594
申请日：2001-08-24
申请人： Yuichi Miyagawa
发明人： Yuichi Miyagawa
IPC分类号： G06F12/14 , G06F17/30 , G06F21/31 , G06F21/62 , G06Q10/00 , G06Q20/00 , G06Q20/02 , G06Q20/40 , G06Q20/42 , G06Q30/06 , G06Q50/00 , H04L29/06 , H04L29/08 , G06F17/60
CPC分类号： H04L63/0428 , G06F21/6245 , G06F21/6254 , G06Q20/382 , G06Q30/06 , H04L67/306 , H04L2463/102
摘要： Personal information of members (10) of a provider (20) are protected when the members (10) have an access to the internet. A provider (20) issues an ID number to a member (10) at the time of making a contract, and issues an IDP which corresponds to the ID number to have an access to a virtual shop (30) on the internet and manages the IDP so as to manage personal information of the member (10), and the member (10) has an access to the virtual shop (30) on the internet using the IDP which is issued when the member (10) has an access to the provider (20) using the ID number. That is, since members (10) of a provider (20) use IDP owned by the provider (20) when the members (10) have an access to the internet, personal information of members (10) of the provider (20) can be protected. Furthermore, since the provider (20) ascertains the identity of the members (10) and guarantees solvency of charge of the members (10) when the members (10) purchase goods or information at the virtual shops (30) on the WEB site, the safety and certainty of commerce can be secured for the members (10) as well as for the virtual shops (30) on the WEB site.
摘要翻译：当成员（10）有访问互联网时，提供者（20）的成员（10）的个人信息被保护。提供者（20）在签订合同时向成员（10）发出身份证号码，并发布与ID号对应的IDP，以便访问互联网上的虚拟商店（30），并管理 IDP，以便管理成员（10）的个人信息，并且成员（10）可以使用当成员（10）具有访问权限的所述IDP被发布时的IDP访问因特网上的虚拟商店（30）提供者（20）使用ID号码。也就是说，由于当成员（10）具有访问互联网时，提供者（20）的成员（10）使用提供商（20）拥有的IDP，所以提供者（20）的成员（10）的个人信息可以被保护。此外，由于当成员（10）在WEB站点上的虚拟商店（30）购买商品或信息时，提供商（20）确定成员（10）的身份并保证成员（10）的费用偿付能力，成员（10）以及网站上的虚拟商店（30）都可以确保商业的安全性和确定性。

3. 发明授权

US4926867A Light-reflecting and heating type oximeter 失效
标题翻译：光反射和加热式血氧计
公开(公告)号：US4926867A
公开(公告)日：1990-05-22
申请号：US355842
申请日：1989-05-19
申请人： Masahiko Kanda , Yuichi Miyagawa
发明人： Masahiko Kanda , Yuichi Miyagawa
IPC分类号： A61B5/145 , A61B5/00 , A61B5/103 , A61B5/1455 , A61B5/1491
CPC分类号： A61B5/14552
摘要： A light-reflecting and heating type oximeter designed to measure non-invasively oxygen saturation in blood contained in a part of a living body by using an optical sensor. The optical sensor has a light-emitting section for emitting measuring light beams having at least two different wavelengths and a light-receiving section for receiving the measuring light beams activated by and reflected from the measuring part of the living body, and a heating means whose heating temperature is controllable is provided around the light-emitting and -receiving sections. The light receiving section and light emitting section are arranged in a particular positional relationship on a flat surface of the optical sensor housing to obtain accurate measurements. The arrangement enables measurement of oxygen saturation in any part of a living body including those in which blood vessels are distributed close to the body surface, such as finger tips, ears and the flat part of a newborn's foot.

4. 发明申请

US20100117244A1 Semiconductor device and manufacturing method therefor 审中-公开
标题翻译：半导体装置及其制造方法
公开(公告)号：US20100117244A1
公开(公告)日：2010-05-13
申请号：US12591041
申请日：2009-11-05
申请人： Yuichi Miyagawa , Takehiko Maeda
发明人： Yuichi Miyagawa , Takehiko Maeda
IPC分类号： H01L23/48 , H01L21/00
CPC分类号： H01L23/49811 , H01L21/563 , H01L23/3121 , H01L23/3135 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L25/0652 , H01L25/0657 , H01L25/50 , H01L2224/16225 , H01L2224/16227 , H01L2224/29034 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/49175 , H01L2224/73265 , H01L2224/83191 , H01L2224/8385 , H01L2224/92247 , H01L2225/0651 , H01L2225/06517 , H01L2225/06562 , H01L2225/06589 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01047 , H01L2924/0665 , H01L2924/07802 , H01L2924/181 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： The present invention can avoid spaces not filled with resin by using simplified procedures and configuration even when multiple semiconductor chips are stacked, creating an overhanging portion. A semiconductor device 100 includes a substrate 102; a first semiconductor chip 110 mounted on the substrate 102; a second semiconductor chip 120 stacked over the first semiconductor chip 110, being separated from the first semiconductor chip 110, and provided with a portion overhanging from the first semiconductor chip 110; and an insulating resin 132 which fills a space between the first semiconductor chip 110 and the second semiconductor chip 120 as well as a space between the overhanging portion of the second semiconductor 120 chip and the substrate 102.
摘要翻译：本发明即使在堆叠多个半导体芯片时也能够通过使用简化的程序和结构来避免没有填充树脂的空间，从而产生悬伸部分。半导体器件100包括衬底102; 安装在基板102上的第一半导体芯片110; 堆叠在第一半导体芯片110上的与第一半导体芯片110分离并且设置有从第一半导体芯片110伸出的部分的第二半导体芯片120; 以及绝缘树脂132，其填充第一半导体芯片110和第二半导体芯片120之间的空间以及第二半导体120芯片的突出部分和基板102之间的空间。

5. 发明授权

US06563196B2 Semiconductor wafer, semiconductor device and manufacturing method therefor 失效
公开(公告)号：US06563196B2
公开(公告)日：2003-05-13
申请号：US09916837
申请日：2001-07-26
申请人： Yuichi Miyagawa
发明人： Yuichi Miyagawa
IPC分类号： H01L23544
CPC分类号： H01L25/0657 , H01L21/78 , H01L23/3171 , H01L24/48 , H01L2224/05554 , H01L2224/05599 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/484 , H01L2224/4899 , H01L2224/73265 , H01L2224/85399 , H01L2225/0651 , H01L2225/06575 , H01L2225/06586 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/15311 , H01L2224/45099 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： The invention aims to easily suppress chipping on the reverse face of a semiconductor when a semiconductor wafer is cut, and to make it possible to easily prevent edge contact of bonding wires. A resin film (14) is formed at the periphery of boundary regions (corresponding to 6) provided for chip separation of semiconductor chips (8). Then, the semiconductor wafer (1) is diced by cutting along the central part (corresponding to 7) of the boundary region. Furthermore, in a semiconductor device having semiconductor elements formed on a semiconductor substrate, the resin film (14) is formed on a part of the boundary regions provided for chip separation, matching the bonding pads (3) of each chip. Alternatively, the resin film (14) is formed with a predetermined width on the periphery of the abovementioned boundary regions. Additionally, the arrangement is such that the semiconductor substrate (9) and the abovementioned wires do not touch when bonding wires (16) are connected at the time of mounting the semiconductor chips.

6. 发明申请

US20100117210A1 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US20100117210A1
公开(公告)日：2010-05-13
申请号：US12591148
申请日：2009-11-10
申请人： Yuichi Miyagawa
发明人： Yuichi Miyagawa
IPC分类号： H01L23/52
CPC分类号： H01L23/49833 , H01L23/3128 , H01L23/5385 , H01L24/16 , H01L24/48 , H01L24/49 , H01L25/0657 , H01L2224/16 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2225/0651 , H01L2225/06517 , H01L2225/06582 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012 , H01L2224/0401
摘要： A semiconductor device including: a substrate formed with a concave portion at one surface thereof; and a first semiconductor chip provided in the concave portion of the substrate and is adhered to the substrate by an underfill in the concave portion, wherein the concave portion includes a chip arrangement region in which the first semiconductor chip is arranged, and an adjustment region which protrudes from at least a portion of the periphery of the chip arrangement region when seen in a plan view at a height of at least a portion of a region where the first semiconductor chip is placed in a stacked direction of the substrate, and has different shapes from the chip arrangement region is provided.
摘要翻译：一种半导体器件，包括：在其一个表面上形成有凹部的基板; 以及第一半导体芯片，其设置在所述基板的所述凹部中，并且通过所述凹部中的底部填充剂粘附到所述基板，其中所述凹部包括其中布置有所述第一半导体芯片的芯片布置区域，以及调整区域在从第一半导体芯片配置在基板的堆叠方向的区域的至少一部分的高度的俯视图中看到时，从芯片布置区域的周边的至少一部分突出，并具有不同的形状提供从芯片布置区域。

7. 发明申请

US20100102461A1 Semiconductor device and method of manufacturing the same 失效
标题翻译：半导体装置及其制造方法
公开(公告)号：US20100102461A1
公开(公告)日：2010-04-29
申请号：US12588643
申请日：2009-10-22
申请人： Yuichi Miyagawa , Takamitsu Noda , Hiroyasu Miyamoto , Jun Tsukano
发明人： Yuichi Miyagawa , Takamitsu Noda , Hiroyasu Miyamoto , Jun Tsukano
IPC分类号： H01L23/28 , H01L21/56
CPC分类号： H01L23/3135 , H01L23/3121 , H01L23/562 , H01L25/0655 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor device including a substrate, a semiconductor chip mounted on the substrate, and an encapsulation resin encapsulating the semiconductor chip, wherein the encapsulation resin contains a first resin region composed of a first resin composition, a second resin region composed of a second resin composition, and a mixed layer formed between the first resin region and the second resin region so as to have the first resin composition and the second resin composition mixed therein is provided.
摘要翻译：一种半导体器件，包括衬底，安装在衬底上的半导体芯片和封装半导体芯片的封装树脂，其中封装树脂包含由第一树脂组合物构成的第一树脂区域，由第二树脂组合物构成的第二树脂区域并且设置在第一树脂区域和第二树脂区域之间形成的混合层以使第一树脂组合物和第二树脂组合物混合在一起。

8. 发明申请

US20090250802A1 Multilayer wiring substrate, semiconductor package, and methods of manufacturing semiconductor package 有权
标题翻译：多层布线基板，半导体封装以及制造半导体封装的方法
公开(公告)号：US20090250802A1
公开(公告)日：2009-10-08
申请号：US12382546
申请日：2009-03-18
申请人： Yuichi Miyagawa
发明人： Yuichi Miyagawa
IPC分类号： H01L23/02 , H05K1/02 , H01L21/50 , H01L23/48
CPC分类号： H01L23/49822 , H01L23/49894 , H01L24/48 , H01L24/73 , H01L25/105 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/3511 , H05K1/0271 , H05K3/4602 , H05K3/4688 , H05K2201/068 , H05K2201/09136 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A multilayer wiring substrate included in the semiconductor package includes: a first insulating layer and a second insulating layer, in which wiring layers are respectively provided on the upper and the lower surfaces; and; a core layer provided between the first insulating layer and the second insulating layer. The first insulating layer and the second insulating layer are constituted by different materials from each other.
摘要翻译：包括在半导体封装中的多层布线基板包括：第一绝缘层和第二绝缘层，其中布线层分别设置在上表面和下表面上; 和; 芯层，设置在第一绝缘层和第二绝缘层之间。第一绝缘层和第二绝缘层由彼此不同的材料构成。

9. 发明授权

US4854153A Automatic calibration apparatus for a partial gas pressure measuring sensor 失效
标题翻译：用于局部气体压力测量传感器的自动校准装置
公开(公告)号：US4854153A
公开(公告)日：1989-08-08
申请号：US128402
申请日：1987-12-02
申请人： Yuichi Miyagawa , Kiwamu Yoneda , Kazuhiro Kuwa , Katsuyuki Kogo
发明人： Yuichi Miyagawa , Kiwamu Yoneda , Kazuhiro Kuwa , Katsuyuki Kogo
IPC分类号： A61B5/00 , G01N33/00
CPC分类号： G01N33/0006 , A61B5/1495
摘要： An automatic calibration apparatus for a partial gas pressure measuring sensor supplies a gas having a high partial pressure (referred to as the high gas) and a gas having a low partial pressure (referred to as the low gas), to a gas selection device (103) from a gas supplier (101) through a detector device (102) which detects an abnormal gas supply condition outside given, satisfactory gas supply conditions. The selection device (103) selects the high gas or the low gas for supplying the selected gas to a sensor support (27 or 104). A partial gas pressure measuring sensor to be calibrated is placed on the sensor support and an automatic calibration controller (106) stores an output of the partial gas pressure measuring sensor (105) in an information storing memory. When the detector device, detects an abnormal gas supply of the high gas or the low gas, the automatic calibration controller stops the storing of the output of the partial gas pressure measuring sensor (105) in the storing means (107).

10. 发明申请

US20100176517A1 Electronic device 审中-公开
标题翻译：电子设备
公开(公告)号：US20100176517A1
公开(公告)日：2010-07-15
申请号：US12654834
申请日：2010-01-06
申请人： Yuichi Miyagawa , Jun Tsukano , Kenji Furuya , Takamitsu Noda , Hiroyasu Miyamoto
发明人： Yuichi Miyagawa , Jun Tsukano , Kenji Furuya , Takamitsu Noda , Hiroyasu Miyamoto
IPC分类号： H01L23/28
CPC分类号： H01L23/3121 , B29C45/02 , B29C45/1671 , H01L21/565 , H01L23/3185 , H01L24/48 , H01L24/49 , H01L25/0655 , H01L25/0657 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2225/0651 , H01L2924/00014 , H01L2924/181 , H01L2924/1815 , H05K3/284 , H05K2201/0187 , H05K2201/09972 , H05K2203/1316 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Differences in contraction forces of a sealing resin can be alleviated and strain on a package can be reduced even when electronic components are unevenly positioned on a substrate. An electronic device (100) includes a substrate 102, electronic components (104, 108) mounted on one face of the substrate 102, and a sealing resin 118 formed on the one face of the substrate 102 and which seals the electronic components. The sealing resin 118 includes a first resin region 120 made up of a first resin composition and a second resin region 122 made up of a second resin composition, and is formed so as to have, as seen in planar view, a region in which only the first resin region 120 exists and a region in which only the second resin region 122 exists.
摘要翻译：密封树脂的收缩力的差异可以减轻，即使当电子部件不均匀地定位在基板上时，也可以减小包装上的应变。电子设备（100）包括衬底102，安装在衬底102的一个面上的电子部件（104,108）以及形成在衬底102的一个面上并密封电子部件的密封树脂118。密封树脂118包括由第一树脂组合物构成的第一树脂区域120和由第二树脂组合物构成的第二树脂区域122，并且形成为具有如平面图所示的区域，其中仅仅存在第一树脂区域120和仅存在第二树脂区域122的区域。

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