会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 2. 发明授权
    • N-benzenesulfonyl L-proline compounds as bradykinin antagonists
    • N-苯磺酰基L-脯氨酸化合物作为缓激肽拮抗剂
    • US06734306B2
    • 2004-05-11
    • US10010863
    • 2001-12-05
    • Yasuhiro KatsuMakoto KawaiHiroki KoikeSeiji Nukui
    • Yasuhiro KatsuMakoto KawaiHiroki KoikeSeiji Nukui
    • C07D40114
    • C07D451/02C07D401/12C07D401/14C07D451/04C07D453/02C07D487/08
    • This invention provides a compound of the formula (I): or the pharmaceutically acceptable salts thereof wherein X1 and X2 are halo; R1 and R2 are independently hydrogen or C1-4 alkyl; R3 and R4 are each hydrogen or halo; and R5 is (a) —C3-9 diazacycloalkyl optionally substituted with C5-11 azabicycloalkyl; (b) —C3-9 azacycloalkyl-NH—(C5-11 azabicycloalkyl optionally substituted with C1-4 alkyl); (c) —NH—C1-3 alkyl-C(O)—C5-11 diazabicycloalkyl; (d) —NH—C1-3 alkyl-C(O)—NH—C5-11 azabicycloalkyl, the C5-11 azabicycloalkyl being optionally substituted with C1-4 alkyl; (e) —C3-9 azacycloalkyl optionally substituted with C3-9 azacycloalkyl; or (f) —NH—C1-5 alkyl-NH—C(O)—C4-9 cycloalkyl-NH2. These compounds are useful for the treatment of medical conditions mediated by bradykinin such as inflammation, allergic rhinitis, pain, etc. This invention also provides a pharmaceutical composition comprising the above compound.
    • 本发明提供式(I)化合物或其药学上可接受的盐,其中X 1和X 2为卤素; R 1和R 2独立地是氢或C 1-4烷基; R 3和R 4各自为氢或卤素; (b)-C3-9氮杂环烷基-NH-(任选被C 1-4烷基取代的C 5-10氮杂双环烷基);(c)-C(= NH-C 1-3烷基-C(O)-C 5-11二氮杂双环烷基;(d)-NH-C 1-3烷基-C(O)-NH-C 5-11氮杂双环烷基,C 5-11氮杂双环烷基任选被C 1 -4-烷基;(e)任选被C 3-9氮杂环烷基取代的-C3-9氮杂环烷基; 或(f)-NH-C 1-5烷基-NH-C(O)-C 4-9环烷基-NH 2。这些化合物可用于治疗由缓激肽介导的医学病症如炎症,过敏性鼻炎,疼痛等。 本发明还提供了包含上述化合物的药物组合物。
    • 5. 发明授权
    • Method for manufacturing SOI wafer
    • 制造SOI晶圆的方法
    • US08268700B2
    • 2012-09-18
    • US12153160
    • 2008-05-14
    • Shoji AkiyamaYoshihiro KubotaAtsuo ItoKoichi TanakaMakoto KawaiYuuji Tobisaka
    • Shoji AkiyamaYoshihiro KubotaAtsuo ItoKoichi TanakaMakoto KawaiYuuji Tobisaka
    • H01L21/30
    • H01L21/76254
    • There is disclosed a method for manufacturing an SOI wafer comprising at least: implanting a hydrogen ion, a rare gas ion, or both the ions into a donor wafer formed of a silicon wafer or a silicon wafer having an oxide film formed on a surface thereof from a surface of the donor wafer, thereby forming an ion implanted layer; performing a plasma activation treatment with respect to at least one of an ion implanted surface of the donor wafer and a surface of a handle wafer, the surface of the handle wafer is to be bonded to the ion implanted surface; closely bonding these surfaces to each other; mechanically delaminating the donor wafer at the ion implanted layer as a boundary and thereby reducing a film thickness thereof to provide an SOI layer, and performing a heat treatment at 600 to 1000° C.; and polishing a surface of the SOI layer for 10 to 50 nm based on chemical mechanical polishing.A method for manufacturing with excellent productivity an SOI wafer having an SOI layer with a mirror-finished surface and high film thickness uniformity can be provided.
    • 公开了一种制造SOI晶片的方法,该方法至少包括:将氢离子,稀有气体离子或两者离子注入到由硅晶片或具有在其表面上形成的氧化膜的硅晶片形成的施主晶片中 从施主晶片的表面,从而形成离子注入层; 对施主晶片的离子注入表面和处理晶片的表面中的至少一个进行等离子体激活处理,把手晶片的表面与离子注入表面结合; 将这些表面彼此紧密结合; 以离子注入层的施主晶片作为边界进行机械分层,由此降低其膜厚以提供SOI层,并在600〜1000℃下进行热处理。 并且基于化学机械抛光将SOI层的表面抛光10至50nm。 可以提供具有优异的生产率的具有SOI层的具有镜面精加工表面和高膜厚均匀性的SOI晶片的方法。
    • 9. 发明申请
    • METHOD FOR MANUFACTURING BONDED SUBSTRATE
    • 制造粘结基板的方法
    • US20110104871A1
    • 2011-05-05
    • US12934788
    • 2009-04-10
    • Yuji TobisakaYoshihiro KubotaAtsuo ItoKouichi TanakaMakoto KawaiShoji AkiyamaHiroshi Tamura
    • Yuji TobisakaYoshihiro KubotaAtsuo ItoKouichi TanakaMakoto KawaiShoji AkiyamaHiroshi Tamura
    • H01L21/762
    • H01L21/187H01L21/76254
    • Provided is a method for manufacturing a bonded wafer with a good thin film over the entire substrate surface, especially in the vicinity of the lamination terminal point. The method for manufacturing a bonded wafer comprises at least the following steps of: forming an ion-implanted region by implanting a hydrogen ion or a rare gas ion, or the both types of ions from a surface of a first substrate which is a semiconductor substrate; subjecting at least one of an ion-implanted surface of the first substrate and a surface of a second substrate to be attached to a surface activation treatment; laminating the ion-implanted surface of the first substrate and the surface of the second substrate in an atmosphere with a humidity of 30% or less and/or a moisture content of 6 g/m3 or less; and a splitting the first substrate at the ion-implanted region so as to reduce thickness of the first substrate, thereby manufacturing a bonded wafer with a thin film on the second substrate.
    • 提供一种在整个基板表面上,特别是在层叠终点附近制造具有良好薄膜的接合晶片的方法。 制造接合晶片的方法至少包括以下步骤:通过从作为半导体衬底的第一衬底的表面注入氢离子或稀有气体离子或两种离子形成离子注入区域 ; 对第一基板的离子注入表面和第二基板的表面中的至少一个进行表面活化处理; 将第一基板的离子注入表面和第二基板的表面在湿度为30%以下和/或6g / m 3以下的气氛中层压; 以及在离子注入区域处分裂第一衬底以便减小第一衬底的厚度,由此在第二衬底上制造具有薄膜的接合晶片。
    • 10. 发明授权
    • Method for manufacturing pyrolytic boron nitride composite substrate
    • 制造热解氮化硼复合基板的方法
    • US07879175B2
    • 2011-02-01
    • US12078276
    • 2008-03-28
    • Makoto KawaiYoshihiro KubotaAtsuo ItoKoichi TanakaYuuji TobisakaShoji Akiyama
    • Makoto KawaiYoshihiro KubotaAtsuo ItoKoichi TanakaYuuji TobisakaShoji Akiyama
    • B32B38/10
    • H01L21/76254C23C14/48
    • Wettability of a PBN material surface with respect to a metal is improved to expand use applications. Hydrogen ions are implanted into a surface of a silicon substrate 10 to form an ion implanted region 11 at a predetermined depth near a surface of the silicon substrate 10, and a plasma treatment or an ozone treatment is performed with respect to a main surface of the silicon substrate 10 for the purpose of surface cleaning or surface activation. The main surfaces of the silicon substrate 10 and a PBN substrate 20 subjected to the surface treatment are appressed against each other to be bonded at a room temperature, and an external impact shock is given to the bonded substrate to mechanically delaminate a silicon film 12 from a bulk 13 of the silicon substrate to be transferred. An obtained PBN composite substrate 30 is diced to form a chip having a desired size, and a refractory metal is metallized on the silicon film 12 side to be connected with a wiring material.
    • PBN材料表面相对于金属的润湿性得到改善以扩大使用应用。 将氢离子注入到硅衬底10的表面中以在硅衬底10的表面附近的预定深度处形成离子注入区11,并且相对于硅衬底10的主表面进行等离子体处理或臭氧处理 硅基板10,用于表面清洁或表面活化。 经过表面处理的硅衬底10和PBN衬底20的主表面在室温下相互粘合,并且对键合衬底施加外部冲击冲击,从而将硅膜12从 待转移的硅衬底的体积13。 将获得的PBN复合基板30切割成具有所需尺寸的芯片,并且将难熔金属在硅膜12侧金属化以与布线材料连接。