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    • 5. 发明授权
    • Polyoxymethylene resin composition
    • 聚甲醛树脂组合物
    • US06391956B1
    • 2002-05-21
    • US09508601
    • 2000-03-14
    • Mitsuhiro HorioYuuji Yoshinaga
    • Mitsuhiro HorioYuuji Yoshinaga
    • C08K511
    • C08L59/02C08L2666/06C08L2666/22
    • A polyoxymethylene resin composition comprising: (A) 50 to 99 parts by weight of a polyoxymethylene resin; (B) 1 to 50 parts by weight of a wollastonite having a volume-average particle diameter of 0.5 to 40 &mgr;m; (C) 0.1 to 10 parts by weight of at least one member selected from the group consisting of an ester of an alcohol and a fatty acid, an ester of an alcohol and a dicarboxylic acid, and a compound of a polyoxyalkylene glycol based on 100 parts by weight of the total amount of Component (A) and Component (B); and (D) 0.1 to 10 parts by weight of a polyolefin resin based on 100 parts by weight of the total amount of Component (A) and Component (B). The composition of the present invention provides a molded product which is excellent in resistance to friction and wearing, has high stiffness, repeated impact strength, and small molding strain, and is excellent in gear precision as compared with conventional compositions. Therefore, the polyoxymethylene resin composition of the present invention can be provided as a new material for the electrical and electronic parts, down-sizing of which has been progressing.
    • 一种聚甲醛树脂组合物,其包含:(A)50〜99重量份的聚甲醛树脂;(B)1〜50重量份的体积平均粒径为0.5〜40μm的硅灰石;(C)0.1〜 10重量份选自醇和脂肪酸的酯,醇和二羧酸的酯中的至少一种和聚氧亚烷基二醇的化合物,基于100重量份的 组分(A)和组分(B)的总量; 和(D)基于100重量份的组分(A)和组分(B)的总量为0.1至10重量份的聚烯烃树脂。本发明的组合物提供了耐电阻优异的模塑产品 摩擦和磨损,具有高刚度,反复冲击强度和小的成型应变,并且与传统组合物相比具有优异的齿轮精度。 因此,本发明的聚甲醛树脂组合物可以作为电子电子部件的新材料提供,其尺寸正在进行中。
    • 8. 发明申请
    • Resin moldings and conductive resin composition
    • 树脂模制品和导电树脂组合物
    • US20060199903A1
    • 2006-09-07
    • US10553209
    • 2004-04-16
    • Takaaki MiyoshiKazuya NodaMitsuhiro HorioYuuji Yoshinaga
    • Takaaki MiyoshiKazuya NodaMitsuhiro HorioYuuji Yoshinaga
    • C08L53/00C08L77/00
    • C08L77/00B82Y30/00C08L53/02C08L53/025C08L71/12C08L71/123C08L77/02C08L77/06C08L2666/02C08L2666/14C08L2666/20
    • A shaped resin article comprising a polyamide (A) (comprising at least two different polyamide components), a polyphenylene ether (B) and a partially hydrogenated block copolymer (C) (obtained by partially hydrogenating a block copolymer comprising an aromatic vinyl polymer block and a conjugated diene polymer block) including a block copolymer (C-1) having a number average molecular weight of from 200,000 to 300,000, wherein (A) is present as a continuous phase in which (B) is dispersed to form a dispersed phase, and (C) is present in the continuous phase of (A) and/or the dispersed phase of (B), wherein the surface area of the polyamide (A) exposed on the overall surface of the shaped resin article is at least 80%, based on the surface area of the shaped resin article. A conductive resin composition comprising a polyamide (A), a polyphenylene ether (B), a partially hydrogenated block copolymer (C) comprising an aromatic vinyl polymer block and a conjugated diene polymer block, a conductive carbonaceous material (D) and wollastonite particles (E).
    • 一种成型树脂制品,其包含聚酰胺(A)(包含至少两种不同的聚酰胺组分),聚苯醚(B)和部分氢化的嵌段共聚物(C)(通过部分氢化包含芳族乙烯基聚合物嵌段的嵌段共聚物和 共轭二烯聚合物嵌段),其包含数均分子量为200,000至300,000的嵌段共聚物(C-1),其中(A)作为其中(B)分散以形成分散相的连续相存在, 和(C)存在于(A)和/或(B)的分散相的连续相中,其中在成形树脂制品的整个表面上暴露的聚酰胺(A)的表面积为至少80% ,基于成型树脂制品的表面积。 包含聚酰胺(A),聚苯醚(B),包含芳族乙烯基聚合物嵌段和共轭二烯聚合物嵌段的部分氢化嵌段共聚物(C),导电性碳质材料(D)和硅灰石颗粒( E)。
    • 9. 发明授权
    • Resin moldings and conductive resin composition
    • 树脂模制品和导电树脂组合物
    • US07935275B2
    • 2011-05-03
    • US10553209
    • 2004-04-16
    • Takaaki MiyoshiKazuya NodaMitsuhiro HorioYuuji Yoshinaga
    • Takaaki MiyoshiKazuya NodaMitsuhiro HorioYuuji Yoshinaga
    • C08K3/34C08K7/04C08L79/00C08L71/12
    • C08L77/00B82Y30/00C08L53/02C08L53/025C08L71/12C08L71/123C08L77/02C08L77/06C08L2666/02C08L2666/14C08L2666/20
    • A shaped resin article comprising a polyamide (A) (comprising at least two different polyamide components), a polyphenylene ether (B) and a partially hydrogenated block copolymer (C) (obtained by partially hydrogenating a block copolymer comprising an aromatic vinyl polymer block and a conjugated diene polymer block) including a block copolymer (C-1) having a number average molecular weight of from 200,000 to 300,000, wherein (A) is present as a continuous phase in which (B) is dispersed to form a dispersed phase, and (C) is present in the continuous phase of (A) and/or the dispersed phase of (B), wherein the surface area of the polyamide (A) exposed on the overall surface of the shaped resin article is at least 80%, based on the surface area of the shaped resin article. A conductive resin composition comprising a polyamide (A), a polyphenylene ether (B), a partially hydrogenated block copolymer (C) comprising an aromatic vinyl polymer block and a conjugated diene polymer block, a conductive carbonaceous material (D) and wollastonite particles (E).
    • 一种成型树脂制品,其包含聚酰胺(A)(包含至少两种不同的聚酰胺组分),聚苯醚(B)和部分氢化的嵌段共聚物(C)(通过部分氢化包含芳族乙烯基聚合物嵌段的嵌段共聚物和 共轭二烯聚合物嵌段),其包含数均分子量为200,000至300,000的嵌段共聚物(C-1),其中(A)作为其中(B)分散以形成分散相的连续相存在, 和(C)存在于(A)和/或(B)的分散相的连续相中,其中在成形树脂制品的整个表面上暴露的聚酰胺(A)的表面积为至少80% ,基于成型树脂制品的表面积。 包含聚酰胺(A),聚苯醚(B),包含芳族乙烯基聚合物嵌段和共轭二烯聚合物嵌段的部分氢化嵌段共聚物(C),导电性碳质材料(D)和硅灰石颗粒( E)。