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    • 2. 发明授权
    • Polyoxymethylene resin composition
    • 聚甲醛树脂组合物
    • US06391956B1
    • 2002-05-21
    • US09508601
    • 2000-03-14
    • Mitsuhiro HorioYuuji Yoshinaga
    • Mitsuhiro HorioYuuji Yoshinaga
    • C08K511
    • C08L59/02C08L2666/06C08L2666/22
    • A polyoxymethylene resin composition comprising: (A) 50 to 99 parts by weight of a polyoxymethylene resin; (B) 1 to 50 parts by weight of a wollastonite having a volume-average particle diameter of 0.5 to 40 &mgr;m; (C) 0.1 to 10 parts by weight of at least one member selected from the group consisting of an ester of an alcohol and a fatty acid, an ester of an alcohol and a dicarboxylic acid, and a compound of a polyoxyalkylene glycol based on 100 parts by weight of the total amount of Component (A) and Component (B); and (D) 0.1 to 10 parts by weight of a polyolefin resin based on 100 parts by weight of the total amount of Component (A) and Component (B). The composition of the present invention provides a molded product which is excellent in resistance to friction and wearing, has high stiffness, repeated impact strength, and small molding strain, and is excellent in gear precision as compared with conventional compositions. Therefore, the polyoxymethylene resin composition of the present invention can be provided as a new material for the electrical and electronic parts, down-sizing of which has been progressing.
    • 一种聚甲醛树脂组合物,其包含:(A)50〜99重量份的聚甲醛树脂;(B)1〜50重量份的体积平均粒径为0.5〜40μm的硅灰石;(C)0.1〜 10重量份选自醇和脂肪酸的酯,醇和二羧酸的酯中的至少一种和聚氧亚烷基二醇的化合物,基于100重量份的 组分(A)和组分(B)的总量; 和(D)基于100重量份的组分(A)和组分(B)的总量为0.1至10重量份的聚烯烃树脂。本发明的组合物提供了耐电阻优异的模塑产品 摩擦和磨损,具有高刚度,反复冲击强度和小的成型应变,并且与传统组合物相比具有优异的齿轮精度。 因此,本发明的聚甲醛树脂组合物可以作为电子电子部件的新材料提供,其尺寸正在进行中。
    • 4. 发明授权
    • Polyamide resin composition
    • 聚酰胺树脂组合物
    • US5859176A
    • 1999-01-12
    • US793934
    • 1997-03-10
    • Jun-ichi NakahashiMitsuhiro HorioKazuo Yoshida
    • Jun-ichi NakahashiMitsuhiro HorioKazuo Yoshida
    • C08L71/12C08L77/00C08G69/08C08G73/10
    • C08L77/00C08L71/123Y10S525/905
    • Disclosed is a polyamide resin composition comprising a melt-kneaded product of (A) a polyamide; (B) a polyphenylene ether; (C) a styrene polymer; and (D) a compound having in a molecule thereof a carbon-to-carbon double bond and at least one functional group selected from a carboxylic acid group, an acid anhydride group, an epoxy group, an amino group and a hydroxyl group, wherein the polyamide (A) is present as a continuous phase in which the polyphenylene ether (B) and the styrene polymer (C) are dispersed individually, independently or in mixture thereof to form a dispersion phase having an average particle diameter of 5 .mu.m or less, and wherein the (B)/(C) weight ratio is from 20/80 to 70/30, and the styrene polymer (C) in the melt-kneaded product has a reduced viscosity of 0.70 dl/g or more. The polyamide resin composition has not only excellent mechanical properties, heat resistance, molding processability, light stability, weatherability and good appearance of a shaped resin article produced therefrom, but also high resistance to a dimensional change and to a lowering of stiffness when exposed to water, and high chemical resistance. The polyamide resin composition is useful for producing various shaped resin articles, such as exterior and interior parts of automobiles, electronic parts, electric parts, civil engineering materials and construction materials.
    • PCT No.PCT / JP94 / 01947 Sec。 371日期1997年3月10日 102(e)1997年3月10日PCT 1994年11月18日PCT PCT。 WO96 / 16123 PCT出版物 日期:1996年5月30日公开是一种聚酰胺树脂组合物,其包含(A)聚酰胺的熔融捏合产物; (B)聚苯醚; (C)苯乙烯聚合物; 和(D)分子中具有碳 - 碳双键和至少一个选自羧酸基,酸酐基,环氧基,氨基和羟基的官能团的化合物,其中 聚酰胺(A)作为连续相存在,其中聚苯醚(B)和苯乙烯聚合物(C)分别独立地或以其混合物分散形成平均粒径为5μm的分散相或 (B)/(C)重量比为20/80〜70/30,熔融混炼物中的苯乙烯系聚合物(C)的比浓粘度为0.70dl / g以上。 聚酰胺树脂组合物不仅具有优异的机械性能,耐热性,成型加工性,光稳定性,耐候性和由其制造的成型树脂制品的良好外观,而且具有高抗尺寸变化和暴露于水时的刚度降低 ,耐化学性高。 聚酰胺树脂组合物可用于制造各种成型树脂制品,例如汽车的外部和内部部件,电子部件,电气部件,土木工程材料和建筑材料。
    • 8. 发明授权
    • Resin moldings and conductive resin composition
    • 树脂模制品和导电树脂组合物
    • US07935275B2
    • 2011-05-03
    • US10553209
    • 2004-04-16
    • Takaaki MiyoshiKazuya NodaMitsuhiro HorioYuuji Yoshinaga
    • Takaaki MiyoshiKazuya NodaMitsuhiro HorioYuuji Yoshinaga
    • C08K3/34C08K7/04C08L79/00C08L71/12
    • C08L77/00B82Y30/00C08L53/02C08L53/025C08L71/12C08L71/123C08L77/02C08L77/06C08L2666/02C08L2666/14C08L2666/20
    • A shaped resin article comprising a polyamide (A) (comprising at least two different polyamide components), a polyphenylene ether (B) and a partially hydrogenated block copolymer (C) (obtained by partially hydrogenating a block copolymer comprising an aromatic vinyl polymer block and a conjugated diene polymer block) including a block copolymer (C-1) having a number average molecular weight of from 200,000 to 300,000, wherein (A) is present as a continuous phase in which (B) is dispersed to form a dispersed phase, and (C) is present in the continuous phase of (A) and/or the dispersed phase of (B), wherein the surface area of the polyamide (A) exposed on the overall surface of the shaped resin article is at least 80%, based on the surface area of the shaped resin article. A conductive resin composition comprising a polyamide (A), a polyphenylene ether (B), a partially hydrogenated block copolymer (C) comprising an aromatic vinyl polymer block and a conjugated diene polymer block, a conductive carbonaceous material (D) and wollastonite particles (E).
    • 一种成型树脂制品,其包含聚酰胺(A)(包含至少两种不同的聚酰胺组分),聚苯醚(B)和部分氢化的嵌段共聚物(C)(通过部分氢化包含芳族乙烯基聚合物嵌段的嵌段共聚物和 共轭二烯聚合物嵌段),其包含数均分子量为200,000至300,000的嵌段共聚物(C-1),其中(A)作为其中(B)分散以形成分散相的连续相存在, 和(C)存在于(A)和/或(B)的分散相的连续相中,其中在成形树脂制品的整个表面上暴露的聚酰胺(A)的表面积为至少80% ,基于成型树脂制品的表面积。 包含聚酰胺(A),聚苯醚(B),包含芳族乙烯基聚合物嵌段和共轭二烯聚合物嵌段的部分氢化嵌段共聚物(C),导电性碳质材料(D)和硅灰石颗粒( E)。