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    • 5. 发明授权
    • Plasma processing apparatus
    • 等离子体处理装置
    • US5709519A
    • 1998-01-20
    • US7522
    • 1993-01-22
    • Akira UeharaMitsuaki MinatoYoshitsugu Kawamura
    • Akira UeharaMitsuaki MinatoYoshitsugu Kawamura
    • B25J9/04B65G49/07C23C14/56C23F4/00C30B25/12H01L21/677B65G65/00
    • H01J37/32743H01L21/67775Y10S414/137Y10S414/14
    • A plasma processing apparatus for etching, ashing, or otherwise processing silicon wafers has a pair of spaced reaction chambers each for processing a silicon wafers in a plasma, a pair of spaced cassette table mechanisms each for supporting a wafer cassette which houses a plurality of wafers therein, and a transfer robot disposed between the pair of spaced reaction chambers and the pair of spaced cassette table mechanisms, for transferring the wafers, one at a time, between the wafer cassette supported by one of the workpiece table mechanisms and one of the reaction chambers. Each of the cassette table mechanisms has a turntable for placing the wafer thereon, the turntable being rotatable to orient the wafer cassette out of physical interference with the robot arm of the transfer robot.
    • 用于蚀刻,灰化或以其它方式处理硅晶片的等离子体处理装置具有一对间隔开的反应室,每个反应室用于处理等离子体中的硅晶片,一对隔开的盒式工作台机构,每个用于支撑容纳多个晶片的晶片盒 以及设置在一对间隔开的反应室和一对隔开的盒式工作台机构之间的传送机械装置,用于一次一个地将晶片转移到由一个工件台机构支撑的晶片盒和反应器之一 房间。 每个盒式台机构具有用于将晶片放置在其上的转台,转台可转动以使晶片盒与传送机器人的机器人手臂的物理干扰不一致。