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1. 发明授权

US5231291A Wafer table and exposure apparatus with the same 失效
标题翻译：晶圆台和曝光装置相同
公开(公告)号：US5231291A
公开(公告)日：1993-07-27
申请号：US821888
申请日：1992-01-17
申请人： Mitsuaki Amemiya , Eiji Sakamoto , Koji Uda , Kunitaka Ozawa , Kazunori Iwamoto , Shunichi Uzawa , Mitsuji Marumo
发明人： Mitsuaki Amemiya , Eiji Sakamoto , Koji Uda , Kunitaka Ozawa , Kazunori Iwamoto , Shunichi Uzawa , Mitsuji Marumo
IPC分类号： G03F7/20 , H01L21/00 , H01L21/687
CPC分类号： H01L21/67109 , G03F7/2041 , G03F7/707 , G03F7/70866 , G03F7/70875
摘要： A wafer table includes a wafer holding surface for holding a wafer by attraction; a flow passageway through which a temperature adjusting medium flows to remove any heat in the wafer table; a temperature measuring system for measuring the temperature of the wafer held by the wafer holding surface; a temperature adjusting system disposed between the wafer holding surface and the flow passageway; a temperature setting system for setting a temperature related to the wafer held by the wafer holding surface; a flow rate controlling system for controlling the flow rate of the temperature adjusting medium to be circulated through the flow passageway; and a temperature controlling system for controlling the operation of the temperature adjusting system related to heat, on the basis of a value set by the temperature setting system and a value measured by the temperature measuring system.
摘要翻译：晶片台包括用于通过吸引保持晶片的晶片保持表面; 流动通道，温度调节介质通过该通道流动以去除晶片台中的任何热量; 用于测量由晶片保持表面保持的晶片的温度的温度测量系统; 设置在晶片保持表面和流动通道之间的温度调节系统; 用于设定与晶片保持面保持的晶片有关的温度的温度设定系统; 流量控制系统，用于控制温度调节介质流过所述流动通道的流量; 以及温度控制系统，用于基于由温度设定系统设定的值和由温度测量系统测量的值来控制与热量相关的温度调节系统的操作。

2. 发明授权

US5524131A Alignment apparatus and SOR x-ray exposure apparatus having same 失效
标题翻译：对准装置和具有该对准装置的SOR x射线曝光装置
公开(公告)号：US5524131A
公开(公告)日：1996-06-04
申请号：US441641
申请日：1995-05-15
申请人： Shunichi Uzawa , Takao Kariya , Makoto Higomura , Nobutoshi Mizusawa , Ryuichi Ebinuma , Kohji Uda , Kunitaka Ozawa , Mitsuaki Amemiya , Eiji Sakamoto , Naoto Abe , Kenji Saitoh
发明人： Shunichi Uzawa , Takao Kariya , Makoto Higomura , Nobutoshi Mizusawa , Ryuichi Ebinuma , Kohji Uda , Kunitaka Ozawa , Mitsuaki Amemiya , Eiji Sakamoto , Naoto Abe , Kenji Saitoh
IPC分类号： G21K1/06 , G03F7/20 , G03F9/00 , G21K5/02 , G21K5/04 , G21K5/10 , H01L21/027 , H01L21/30 , H05H13/04 , G21K5/00
CPC分类号： G03F7/70008 , G03F7/702 , G03F7/70691 , G03F7/70741 , G03F7/70841 , G03F7/70866 , G03F7/70975 , G03F9/70 , G21K1/06
摘要： A semiconductor device manufacturing SOR X-ray exposure apparatus wherein, after a mask and a semiconductor wafer are aligned, and SOR X-ray is used to transfer a semiconductor device pattern on the mask onto a resist on the semiconductor wafer. The apparatus includes a mirror unit and an exposure unit for exposing the wafer through the mask to the X-ray from the mirror unit. The mirror unit includes an X-ray mirror for diverging the X-ray in a desired direction, a first chamber for providing a desired vacuum ambience around the X-ray mirror and a first supporting device for supplying the X-ray mirror. The exposure unit includes a shutter for controlling the exposure, a mask stage for holding the mask, a wafer stage for holding the wafer, a second chamber for providing a desired He ambience around the mask stage and the wafer stage, a frame structure for mounting the mask stage and the wafer stage and a second supporting device for supporting the frame structure. By this, a more highly integrated semiconductor device can be produced.
摘要翻译：一种制造SOR X射线曝光装置的半导体器件，其中在掩模和半导体晶片对准之后，使用SOR X射线将掩模上的半导体器件图案转印到半导体晶片上的抗蚀剂上。该装置包括反射镜单元和曝光单元，用于将晶片通过掩模曝光到来自反射镜单元的X射线。镜单元包括用于沿所需方向分散X射线的X射线镜，用于在X射线反射镜周围提供期望的真空环境的第一腔室和用于供给X射线镜的第一支撑装置。曝光单元包括用于控制曝光的快门，用于保持掩模的掩模台，用于保持晶片的晶片台，用于在掩模台和晶片台周围提供期望的He环境的第二室，用于安装的框架结构掩模台和晶片台以及用于支撑框架结构的第二支撑装置。由此，可以制造更高度集成的半导体器件。

3. 发明授权

US5822389A Alignment apparatus and SOR X-ray exposure apparatus having same 失效
标题翻译：对准装置和具有该对准装置的SOR X射线曝光装置
公开(公告)号：US5822389A
公开(公告)日：1998-10-13
申请号：US464038
申请日：1995-06-05
申请人： Shunichi Uzawa , Takao Kariya , Makoto Higomura , Nobutoshi Mizusawa , Ryuichi Ebinuma , Kohji Uda , Kunitaka Ozawa , Mitsuaki Amemiya , Eiji Sakamoto , Naoto Abe , Kenji Saitoh
发明人： Shunichi Uzawa , Takao Kariya , Makoto Higomura , Nobutoshi Mizusawa , Ryuichi Ebinuma , Kohji Uda , Kunitaka Ozawa , Mitsuaki Amemiya , Eiji Sakamoto , Naoto Abe , Kenji Saitoh
IPC分类号： G21K1/06 , G03F7/20 , G03F9/00 , G21K5/02 , G21K5/04 , G21K5/10 , H01L21/027 , H01L21/30 , H05H13/04 , G21K5/00
CPC分类号： G03F7/70008 , G03F7/702 , G03F7/70691 , G03F7/70741 , G03F7/70841 , G03F7/70866 , G03F7/70975 , G03F9/70 , G21K1/06
摘要： A synchrotron exposure includes a synchrotron radiation source for generating a synchrotron radiation beam, and exposure unit having a mask stage for holding a mask and a wafer stage for holding a waver, a beam port for directing the radiation beam to the exposure unit, a mirror unit having a mirror for reflecting the radiation beam, a pre-alignment system for aligning the wafer relative to the wafer stage, a fine-alignment system for aligning the wafer held by the wafer stage relative to the mask held by the mask stage, a mask storage apparatus for storing the mask, a wafer storage apparatus for storing the wafer, a mask conveying apparatus for conveying the mask between the mask storage apparatus and the mask stage and a wafer conveying apparatus for conveying a wafer between the wafer storage apparatus and the wafer stage.
摘要翻译：同步加速器曝光包括用于产生同步加速器辐射束的同步加速器辐射源，以及具有用于保持掩模的掩模台和用于保持摇摆的晶片台的曝光单元，用于将辐射束引导到曝光单元的光束端口具有用于反射辐射束的反射镜的单元，用于使晶片相对于晶片台对准的预对准系统，用于使由晶片台保持的晶片相对于由掩模台保持的掩模对准的精细对准系统，用于存储掩模的掩模存储装置，用于存储晶片的晶片存储装置，用于在掩模存储装置和掩模台之间传送掩模的掩模传送装置和用于在晶片存储装置和掩模载台之间传送晶片的晶片传送装置晶圆台。

4. 发明授权

US5138643A Exposure apparatus 失效
公开(公告)号：US5138643A
公开(公告)日：1992-08-11
申请号：US591252
申请日：1990-10-01
申请人： Eiji Sakamoto , Ryuichi Ebinuma , Mitsuaki Amemiya , Shunichi Uzawa , Koji Uda
发明人： Eiji Sakamoto , Ryuichi Ebinuma , Mitsuaki Amemiya , Shunichi Uzawa , Koji Uda
IPC分类号： G03F7/20
CPC分类号： G03F7/70875 , G03F7/70008 , G03F7/70691 , G03F7/70858 , G03F7/70866
摘要： An exposure apparatus includes a chamber for placing an article in a predetermined ambience; a holding device for holding the article in the chamber; a fluid supplying device for supplying a temperature adjusting fluid into the holding device through a flow passageway; a detecting device for detecting leakage of the fluid from the flow passageway; and a flow rate controlling device for controlling the flow rate of the fluid to be supplied to the holding device on the basis of the detection by the detecting device.

5. 发明授权

US5063582A Liquid cooled X-ray lithographic exposure apparatus 失效
标题翻译：液体冷却X射线光刻曝光装置
公开(公告)号：US5063582A
公开(公告)日：1991-11-05
申请号：US658434
申请日：1991-02-20
申请人： Tetsuzo Mori , Eiji Sakamoto , Shinichi Hara , Koji Uda , Isamu Shimoda , Shunichi Uzawa , Kunitaka Ozawa
发明人： Tetsuzo Mori , Eiji Sakamoto , Shinichi Hara , Koji Uda , Isamu Shimoda , Shunichi Uzawa , Kunitaka Ozawa
IPC分类号： G03F7/20
CPC分类号： G03F7/709 , G03F7/707 , G03F7/70716 , G03F7/70866 , G03F7/70875
摘要： The present invention relates to a temperature control system for a lithographic exposure apparatus wherein a mask and wafer are closely disposed, and predetermined exposure energy is applied to respective shot areas of the wafer through the mask. The exposure energy is a soft-X-ray source, for example. The pattern of the mask is transferred onto the respective shot areas in a step-and-repeat manner. In the apparatus, a temperature control medium liquid is supplied into the wafer chuck which supports the wafer at the exposure position. The flow rate of the temperature control liquid is different during an exposure operation than during a non-exposure-operation. The flow control is determined in consideration of the wafer chuck vibration attributable to the supply of the liquid medium and also, of the heat generation in the wafer by the exposure energy, so that the vibration of the wafer chuck during the exposure operation is suppressed. Simultaneously the temperature rise of the wafer can also be suppressed. The pattern transfer from the mask to the wafer thus be precisely performed.

6. 发明授权

US5610965A Exposure method 失效
标题翻译：曝光方法
公开(公告)号：US5610965A
公开(公告)日：1997-03-11
申请号：US197569
申请日：1994-02-17
申请人： Makiko Mori , Kunitaka Ozawa , Koji Uda , Isamu Shimoda , Shunichi Uzawa , Eiji Sakamoto
发明人： Makiko Mori , Kunitaka Ozawa , Koji Uda , Isamu Shimoda , Shunichi Uzawa , Eiji Sakamoto
IPC分类号： G03F1/76 , G03F7/20 , H01L21/027 , G21K5/00
CPC分类号： G03F7/70866 , G03F7/70875
摘要： A method of exposing a wafer to exposure energy such as ultraviolet rays or X-rays through a mask to transfer a pattern of the mask onto the wafer, for example. The temperature of the mask and/or the wafer increases during the exposure operation by absorption of the exposure energy. While the wafer is being exposed, the temperature of the mask and/or the wafer is detected. If the temperature is going to exceed an exposable temperature range determined on the basis of the line width of the pattern to be transferred, the exposure operation is interrupted. Then, the heat accumulated in the mask and/or the wafer is removed. Thereafter, the exposure operation is resumed. This is repeated until the predetermined or required amount of exposure is reached, for one shot. By this, thermal expansion of the mask and the wafer during the exposure operation is prevented to assure the precision of the pattern transfer.
摘要翻译：例如，通过掩模将晶片暴露于诸如紫外线或X射线的曝光能量以将掩模的图案转印到晶片上的方法。掩模和/或晶片的温度在曝光操作期间通过吸收曝光能量而增加。当晶片被暴露时，检测掩模和/或晶片的温度。如果温度超过基于要传送的图案的线宽确定的可曝光温度范围，则曝光操作被中断。然后，除去积存在掩模和/或晶片中的热量。此后，恢复曝光操作。一直重复直到达到预定或所需的曝光量。由此，防止曝光操作期间的掩模和晶片的热膨胀，从而确保图案转印的精度。

7. 发明授权

US5577552A Temperature controlling device for mask and wafer holders 失效
标题翻译：面罩和晶圆座的温度控制装置
公开(公告)号：US5577552A
公开(公告)日：1996-11-26
申请号：US412101
申请日：1995-03-28
申请人： Ryuichi Ebinuma , Takao Kariya , Nobutoshi Mizusawa , Koji Uda , Eiji Sakamoto , Shunichi Uzawa
发明人： Ryuichi Ebinuma , Takao Kariya , Nobutoshi Mizusawa , Koji Uda , Eiji Sakamoto , Shunichi Uzawa
IPC分类号： G03F7/20 , G05D23/19 , H05K7/20 , F28D15/00
CPC分类号： H05K7/20281 , G03F7/707 , G03F7/70875 , G05D23/1919
摘要： A temperature controlling device suitably usable in a semiconductor microcircuit manufacturing exposure apparatus exposes a semiconductor wafer to a mask to print a pattern of the mask on the wafer. The device includes a constant-temperature liquid medium supplying system for controlling temperature of a liquid at high precision, a distributing system for distributing the supplied liquid medium into plural flow passages, to supply the liquid medium to plural subjects of control such as, for example, a mask stage, a wafer stage and the like. The device further includes a plurality of temperature controls each being provided in corresponding one of the flow passages, for correction of any variance in temperature of the distributed liquid medium, resulting from pressure loss energies in the respective flow passages. Thus, temperatures of plural subjects of control can be controlled efficiently and with a simple structure.
摘要翻译：可适用于半导体微电路制造曝光装置的温度控制装置将半导体晶片暴露于掩模，以将掩模的图案印刷在晶片上。该装置包括用于高精度地控制液体的温度的恒温液体介质供给系统，用于将供应的液体介质分配到多个流动通道中的分配系统，以将液体介质供应到多个控制对象，例如，掩模台，晶片台等。该装置还包括多个温度控制装置，每个温度控制装置设置在对应的一个流动通道中，用于校正由相应流动通道中的压力损失能量产生的分配液体介质的温度变化。因此，能够以简单的结构有效地控制多个控制对象的温度。

8. 发明授权

US5374829A Vacuum chuck 失效
标题翻译：真空吸盘
公开(公告)号：US5374829A
公开(公告)日：1994-12-20
申请号：US231785
申请日：1994-04-25
申请人： Eiji Sakamoto , Ryuichi Ebinuma , Shinichi Hara , Mitsuji Marumo
发明人： Eiji Sakamoto , Ryuichi Ebinuma , Shinichi Hara , Mitsuji Marumo
IPC分类号： C30B25/12 , C30B31/14 , H01L21/683 , H01J37/20
CPC分类号： C30B31/14 , C30B25/12 , H01L21/6838 , Y10T279/11
摘要： A wafer holding device of the vacuum attraction type includes a structural member having a protrusion for supporting a wafer and elastic members made of a material having an elasticity modulus smaller than that of the wafer and that of the structural member. The elastic members are distributed on a wafer attraction plane of the structural member.
摘要翻译：真空吸引型的晶片保持装置包括具有用于支撑晶片的突起的结构构件和由具有比晶片的弹性模量小的结构构件的弹性模量的材料制成的弹性构件。弹性构件分布在结构构件的晶片吸引面上。

9. 发明授权

US4969168A Wafer supporting apparatus 失效
标题翻译：晶圆支撑装置
公开(公告)号：US4969168A
公开(公告)日：1990-11-06
申请号：US401654
申请日：1989-08-31
申请人： Eiji Sakamoto , Shinichi Hara , Isamu Shimoda , Shunichi Uzawa
发明人： Eiji Sakamoto , Shinichi Hara , Isamu Shimoda , Shunichi Uzawa
IPC分类号： G03F7/20 , H01L21/027 , H01L21/30 , H01L21/683
CPC分类号： G03F7/707 , G03F7/70866 , G03F7/70875 , H01L21/6833 , H01L21/6838
摘要： A wafer chuck usable with a semiconductor exposure apparatus wherein a mask and a semiconductor wafer are placed in a vacuum ambience or a pressure-reduced gas ambience, and wherein the wafer is exposed through the mask to radiation energy such as X-rays contained in a synchrotron radiation beam, by which the pattern of the mask is transferred onto the wafer. The wafer is first attracted on the wafer supporting surface of the chuck by vacuum attraction, and thereafter, the wafer is attracted by the electrostatic attraction force. Thereafter, the vacuum attraction is broken by supplying a gas. When the pattern of the mask is transferred onto the wafer, the wafer is retained on the wafer supporting surface by the electrostatic attraction force only. By this, the sheet-like member (wafer) supporting apparatus can correctly contact the wafer supporting surface to the wafer without being influenced by the undulation of the wafer. In addition, the heat produced in the wafer during exposure can be removed efficiently by temperature controlled water supplied to the wafer supporting apparatus.

10. 发明授权

US5093579A Exposure apparatus with a substrate holding mechanism 失效
标题翻译：具有基板保持机构的曝光装置
公开(公告)号：US5093579A
公开(公告)日：1992-03-03
申请号：US550989
申请日：1990-07-11
申请人： Mitsuaki Amemiya , Shinichi Hara , Eiji Sakamoto
发明人： Mitsuaki Amemiya , Shinichi Hara , Eiji Sakamoto
IPC分类号： H01L21/30 , G03F7/20 , H01L21/027 , H01L21/683
CPC分类号： H01L21/6838 , G03F7/707 , G03F7/70866 , G03F7/70875
摘要： A substrate holding device includes a holding table having a reduced pressure passageway; a pressure gauge for measuring a value related to the pressure in the reduced pressure passageway; a pump for producing a pressure difference between a first surface of the substrate to be attracted to the holding table and a second surface of the substrate not to be attracted to the holding table; a valve which can be opened/closed for control of the pressure in the reduced pressure passageway; a pressure control system for controlling the opening/closing of the valve on the basis of an output corresponding to the value measured by the pressure gauge; and a temperature control system for controlling the temperature of the holding table.

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