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    • 3. 发明授权
    • Method for manufacturing a semiconductor device
    • 半导体器件的制造方法
    • US07947547B2
    • 2011-05-24
    • US12137807
    • 2008-06-12
    • Teruo KurahashiManabu SakamotoYasuyoshi Mishima
    • Teruo KurahashiManabu SakamotoYasuyoshi Mishima
    • H01L21/8238
    • H01L21/823842
    • A semiconductor device fabrication method by which CMOS transistors with low-resistance metal gate electrodes each having a proper work function can be fabricated. A HfN layer in which nitrogen concentration in an nMOS transistor formation region differs from nitrogen concentration in a pMOS transistor formation region is formed. A MoN layer is formed over the HfN layer and heat treatment is performed. Nitrogen diffuses from the MoN layer into the HfN layer in which nitrogen concentration is low and a work function is set by the HfN layer according to nitrogen concentration which depends on the nitrogen content of the HfN layer before the heat treatment and the amount of nitrogen that diffuses into the HfN layer. On the other hand, nitrogen hardly diffuses from the MoN layer into the HfN layer which originally has a certain nitrogen content, and a work function is set by the HfN layer according to nitrogen concentration in the HfN layer before the heat treatment. By controlling the nitrogen content of each layer and the amount of nitrogen that diffuses, a low-resistance metal gate electrode having a predetermined work function can be formed in each of the nMOS transistor formation region and the pMOS transistor formation region.
    • 可以制造具有各自具有适当功函数的具有低电阻金属栅电极的CMOS晶体管的半导体器件制造方法。 形成其中nMOS晶体管形成区域中的氮浓度与pMOS晶体管形成区域中的氮浓度不同的HfN层。 在HfN层上形成MoN层,进行热处理。 氮从MoN层扩散到HfN层,其中氮浓度低,并且通过HfN层根据氮浓度设定功函数,氮浓度取决于热处理前的HfN层的氮含量和氮的量 扩散到HfN层。 另一方面,氮几乎从MoN层扩散到原来具有一定氮含量的HfN层中,并且通过HfN层根据HfN层中的氮浓度在热处理之前设定功函数。 通过控制各层的氮含量和扩散的氮的量,可以在nMOS晶体管形成区域和pMOS晶体管形成区域中的每一个中形成具有预定功函数的低电阻金属栅电极。