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1. 发明申请

US20120329408A1 ELECTRONIC DEVICE AND FIXING STRUCTURE THEREOF 失效
标题翻译：电子设备及其固定结构
公开(公告)号：US20120329408A1
公开(公告)日：2012-12-27
申请号：US13239975
申请日：2011-09-22
申请人： Ming-Hui Chen , Chia-Chen Chen , Shih-Hsun Yang , Pin-Chang Chu , Chih-Chia Chang , Cheng-Tai Ho
发明人： Ming-Hui Chen , Chia-Chen Chen , Shih-Hsun Yang , Pin-Chang Chu , Chih-Chia Chang , Cheng-Tai Ho
IPC分类号： H04B15/00
CPC分类号： H01Q1/243 , H01Q1/12 , H04W84/18
摘要： A fixing structure including a metal housing and a fixing base is disclosed. The housing has a carrying plane and the fixing base having a first contact end and, opposite, a second contact end is disposed on the housing. The perpendicular distance from the first contact end to the carrying plane is greater than that from the second contact end to the carrying plane. A wireless transmission device is disposed on the fixing base and in contact with the first contact end and the second contact end, so that a perpendicular distance from an antenna end of the wireless transmission device to the carrying plane is greater than a perpendicular distance from a fixed end of the wireless transmission device to the carrying plane. Therefore, a relatively great distance is kept between the antenna end and the housing for preventing the antenna end from being interfered by the metal housing.
摘要翻译：公开了一种包括金属外壳和固定底座的固定结构。壳体具有承载平面，并且固定底座具有第一接触端，并且相对于第二接触端设置在壳体上。从第一接触端到承载平面的垂直距离大于从第二接触端到承载平面的垂直距离。无线传输装置设置在固定基座上并与第一接触端和第二接触端接触，使得从无线传输装置的天线端到承载平面的垂直距离大于从一个无线传输设备的固定端到承载平面。因此，天线端和壳体之间保持相对较大的距离，以防止天线端被金属壳体干扰。

2. 发明授权

US08538497B2 Electronic device and fixing structure thereof 失效
标题翻译：电子设备及其固定结构
公开(公告)号：US08538497B2
公开(公告)日：2013-09-17
申请号：US13239975
申请日：2011-09-22
申请人： Ming-Hui Chen , Chia-Chen Chen , Shih-Hsun Yang , Pin-Chang Chu , Chih-Chia Chang , Cheng-Tai Ho
发明人： Ming-Hui Chen , Chia-Chen Chen , Shih-Hsun Yang , Pin-Chang Chu , Chih-Chia Chang , Cheng-Tai Ho
IPC分类号： H04M1/00 , H04B7/00 , H01Q1/24 , H04W84/18
CPC分类号： H01Q1/243 , H01Q1/12 , H04W84/18
摘要： A fixing structure including a metal housing and a fixing base is disclosed. The housing has a carrying plane and the fixing base having a first contact end and, opposite, a second contact end is disposed on the housing. The perpendicular distance from the first contact end to the carrying plane is greater than that from the second contact end to the carrying plane. A wireless transmission device is disposed on the fixing base and in contact with the first contact end and the second contact end, so that a perpendicular distance from an antenna end of the wireless transmission device to the carrying plane is greater than a perpendicular distance from a fixed end of the wireless transmission device to the carrying plane. Therefore, a relatively great distance is kept between the antenna end and the housing for preventing the antenna end from being interfered by the metal housing.
摘要翻译：公开了一种包括金属外壳和固定底座的固定结构。壳体具有承载平面，并且固定底座具有第一接触端，并且相对于第二接触端设置在壳体上。从第一接触端到承载平面的垂直距离大于从第二接触端到承载平面的垂直距离。无线传输装置设置在固定基座上并与第一接触端和第二接触端接触，使得从无线传输装置的天线端到承载平面的垂直距离大于从一个无线传输设备的固定端到承载平面。因此，天线端和壳体之间保持相对较大的距离，以防止天线端被金属壳体干扰。

3. 发明申请

US20110291215A1 WAFER LEVEL IMAGE SENSOR PACKAGING STRUCTURE AND MANUFACTURING METHOD FOR THE SAME 有权
标题翻译：滤波器水平图像传感器包装结构及其制造方法
公开(公告)号：US20110291215A1
公开(公告)日：2011-12-01
申请号：US12947316
申请日：2010-11-16
申请人： Hsiu-Wen Tu , Han-Hsing Chen , Chung-Hsien Hsin , Ming-Hui Chen
发明人： Hsiu-Wen Tu , Han-Hsing Chen , Chung-Hsien Hsin , Ming-Hui Chen
IPC分类号： H01L31/0203 , H01L31/18
CPC分类号： H01L27/14618 , H01L27/14623 , H01L27/14625 , H01L27/14634 , H01L27/14636 , H01L27/14685 , H01L27/1469 , H01L31/0203 , H01L31/0232 , H01L2224/13
摘要： The present invention discloses a wafer level image sensor packaging structure and a manufacturing method for the same. The manufacturing method includes the following steps: providing a silicon wafer with image sensor chips, providing a plurality of transparent lids, allotting one said transparent lid on top of the corresponding image sensor chip, and carrying out a packaging process. The manufacturing method of the invention has the advantage of having a simpler process, lower cost, and higher production yield rate. The encapsulation compound arranges on the first surface of the image sensor chip and covers the circumference of the transparent lid to avoid the side light leakage as traditional chip scale package (CSP). Thus, the sensing performance of the wafer level image sensor packaging structure can be enhanced.
摘要翻译：本发明公开了一种晶片级图像传感器封装结构及其制造方法。该制造方法包括以下步骤：向硅晶片提供图像传感器芯片，提供多个透明盖，在相应的图像传感器芯片的顶部上分配一个所述透明盖，并执行封装处理。本发明的制造方法具有工艺简单，成本低，生产率高的优点。封装化合物布置在图像传感器芯片的第一表面上，并覆盖透明盖的周边，以避免像传统芯片级封装（CSP）那样的侧面漏光。因此，可以提高晶片级图像传感器封装结构的感测性能。

4. 发明申请

US20100134970A1 PORTABLE COMPUTER AND HINGE MECHANISM THEREOF 有权
标题翻译：便携式计算机及其机械机构
公开(公告)号：US20100134970A1
公开(公告)日：2010-06-03
申请号：US12480462
申请日：2009-06-08
申请人： Ming-Feng Chen , Chien-Chung Chien , Ming-Hui Chen , Shu-Hua Yeh , Chien-Heng Kuo , Yen-Chang Lai
发明人： Ming-Feng Chen , Chien-Chung Chien , Ming-Hui Chen , Shu-Hua Yeh , Chien-Heng Kuo , Yen-Chang Lai
IPC分类号： G06F1/16 , E05D5/10
CPC分类号： G06F1/1681 , G06F1/1616 , G06F1/1656 , Y10T16/551 , Y10T16/557
摘要： A portable computer and a hinge mechanism thereof are provided. The portable computer includes a display screen, a host and a hinge mechanism. The hinge mechanism is connected with the display screen and the host. The hinge mechanism is used for rotating the display screen around the host. The hinge mechanism includes a bottom board, a pivot, a network connecter and a slanting board. The pivot is disposed on the bottom board, wherein one end of the pivot is connected with the host and the other end of the pivot is connected with the display screen. The network connecter is disposed on the bottom board. The slanting board is disposed on the bottom board and slants to the pivot. The slanting board has an opening which exposes the network connecter.
摘要翻译：提供便携式计算机及其铰链机构。便携式计算机包括显示屏，主机和铰链机构。铰链机构与显示屏和主机连接。铰链机构用于围绕主机旋转显示屏。铰链机构包括底板，枢轴，网络连接器和倾斜板。枢轴设置在底板上，其中枢轴的一端与主机连接，枢轴的另一端与显示屏连接。网络连接器设置在底板上。倾斜板设置在底板上并倾斜到枢轴。倾斜板具有露出网络连接器的开口。

5. 发明授权

US08440488B2 Manufacturing method and structure for wafer level image sensor module with fixed focal length 有权
标题翻译：具有固定焦距的晶片级图像传感器模块的制造方法和结构
公开(公告)号：US08440488B2
公开(公告)日：2013-05-14
申请号：US12948020
申请日：2010-11-17
申请人： Hsiu-Wen Tu , Han-Hsing Chen , Chung-Hsien Hsin , Ming-Hui Chen
发明人： Hsiu-Wen Tu , Han-Hsing Chen , Chung-Hsien Hsin , Ming-Hui Chen
IPC分类号： H01L21/00
CPC分类号： H01L27/14618 , H01L27/14625 , H01L27/14634 , H01L27/14685 , H01L27/1469 , H01L31/0203 , H01L31/0232 , H01L2924/0002 , H01L2924/00
摘要： This present invention discloses a manufacturing method and structure for a wafer level image sensor module with fixed focal length. The method includes the following steps. First, a silicon wafer comprising several image sensor chips having a photosensitive area and a lens module array wafer comprising several wafer level lens modules with fixed focal length are provided. Next, the image sensor chips and the wafer level lens modules are sorted in grades according to the different quality grades. According to the sorting results, each of the wafer level lens modules is assigned to be situated above the image sensor chip that has the same grade. At the same time, each of the wafer level lens modules is directed to face the photosensitive area of each image sensor chip. Finally, in the packaging process, the wafer level lens module is surrounded by an encapsulation material.
摘要翻译：本发明公开了一种具有固定焦距的晶片级图像传感器模块的制造方法和结构。该方法包括以下步骤。首先，提供包括具有感光区域的多个图像传感器芯片和包括具有固定焦距的多个晶片级透镜模块的透镜模块阵列晶片的硅晶片。接下来，图像传感器芯片和晶片级透镜模块根据不同的质量等级被分级。根据分选结果，将每个晶片级透镜模块分配为位于具有相同等级的图像传感器芯片上方。同时，每个晶片级透镜模块被指向面对每个图像传感器芯片的光敏区域。最后，在封装过程中，晶片级透镜模块被封装材料包围。

6. 发明申请

US20130068212A1 Pocket warmer able to give out odors 审中-公开
标题翻译：口袋温暖者能够发出气味
公开(公告)号：US20130068212A1
公开(公告)日：2013-03-21
申请号：US13200172
申请日：2011-09-21
申请人： Ming-Hui Chen , Ling-Ling Huang
发明人： Ming-Hui Chen , Ling-Ling Huang
IPC分类号： A61F7/08 , A61L9/03
CPC分类号： A01M1/2088 , A61F7/032 , A61F2007/0238 , A61F2007/0261 , A61L9/03 , A61L2209/133
摘要： A pocket warmer able to give out odors is provided with a combustion unit and a placing stand assembled over the combustion unit for receiving aromatic substance or essential oil with an odor a user wants. Thus, when the combustion unit of the pocket warmer is heated, hot air produced will rise and carry out heating to the aromatic substance or the essential oil of the placing stand over the combustion unit, able to attain effects of keeping warm and giving out odors, and safe and practical in use.
摘要翻译：提供能够发出气味的口袋保温器设置有燃烧单元和组装在燃烧单元上的放置台，用于接收具有用户想要的气味的芳香物质或精油。因此，当加热口袋保温器的燃烧单元时，产生的热空气将升高并且对燃烧单元上的放置台的芳香物质或精油进行加热，能够获得保暖和发出气味的效果，安全实用。

7. 发明授权

US08378441B2 Manufacturing method and structure of a wafer level image sensor module with package structure 失效
标题翻译：具有封装结构的晶片级图像传感器模块的制造方法和结构
公开(公告)号：US08378441B2
公开(公告)日：2013-02-19
申请号：US13010880
申请日：2011-01-21
申请人： Hsiu-Wen Tu , Chung-Hsien Hsin , Han-Hsing Chen , Ming-Hui Chen , Ren-Long Kuo , Chih-Cheng Hsu , Young-Houng Shiao , Tsao-Pin Chen
发明人： Hsiu-Wen Tu , Chung-Hsien Hsin , Han-Hsing Chen , Ming-Hui Chen , Ren-Long Kuo , Chih-Cheng Hsu , Young-Houng Shiao , Tsao-Pin Chen
IPC分类号： H01L33/0232 , H01L21/00
CPC分类号： H01L27/14618 , H01L24/97 , H01L27/14683 , H01L27/14687 , H01L2224/13 , H01L2924/181 , H01L2924/00
摘要： The present invention discloses a manufacturing method and structure of a wafer level image sensor module with package structure. The structure of the wafer level image sensor module with package structure includes a semi-finished product, a plurality of solder balls, and an encapsulant. The semi-finished product includes an image sensing chip and a wafer level lens assembly. The encapsulant is disposed on lateral sides of the image sensing chip and the wafer level lens assembly. Also, the manufacturing method includes the steps of: providing a silicon wafer, dicing the silicon wafer, providing a lens assembly wafer, fabricating a plurality of semi-finished products, performing a packaging process, mounting the solder balls, and cutting the encapsulant. Accordingly, the encapsulant encapsulates each of the semi-finished products by being disposed on the lateral sides thereof.
摘要翻译：本发明公开了一种具有封装结构的晶片级图像传感器模块的制造方法和结构。具有封装结构的晶片级图像传感器模块的结构包括半成品，多个焊球和密封剂。半成品包括图像感测芯片和晶片级透镜组件。密封剂设置在图像感测芯片和晶片级透镜组件的侧面上。此外，制造方法包括以下步骤：提供硅晶片，切割硅晶片，提供透镜组件晶片，制造多个半成品，执行封装工艺，安装焊球以及切割密封剂。因此，密封剂通过设置在其两侧而封装每个半成品。

8. 发明授权

US06816070B1 Method of generating an alert for walkie-talkie when out of communicatable distance 失效
标题翻译：在远离通信距离的情况下，生成对讲机警报的方法
公开(公告)号：US06816070B1
公开(公告)日：2004-11-09
申请号：US10249587
申请日：2003-04-22
申请人： Jany-Yee Hsu , Ming-Hui Chen
发明人： Jany-Yee Hsu , Ming-Hui Chen
IPC分类号： G08B108
CPC分类号： H04B1/46 , H04B1/1027
摘要： A method of generating a warning signal for a walkie-talkie includes: providing a detector and a timer; using the timer to count time; using the detector to determine whether the strength of a radio frequency (RF) signal which includes a standard CTCSS tone received by the walkie-talkie is larger than a predetermined value; using the detector to determine whether the strength of a RF signal which includes a non-standard CTCSS tone received by the walkie-talkie is larger than the predetermined value; if so, resetting the timer; and issuing a warning signal when the time counted by timer reaches a predetermined time.
摘要翻译：产生对讲机的警告信号的方法包括：提供检测器和定时器; 使用计时器计时; 使用检测器来确定由对讲机接收的包括标准CTCSS音的射频（RF）信号的强度是否大于预定值; 使用所述检测器来确定由所述对讲机接收的包括非标准CTCSS音调的RF信号的强度是否大于所述预定值; 如果是，重置定时器; 并且当由计时器计时的时间达到预定时间时发出警告信号。

9. 发明授权

US06622338B1 Automatic device for retractably moving a windshield wiper arm away from a windshield 失效
标题翻译：用于将挡风玻璃刮水器臂可伸缩地移离挡风玻璃的自动装置
公开(公告)号：US06622338B1
公开(公告)日：2003-09-23
申请号：US10039107
申请日：2002-01-08
申请人： Ming-Hui Chen , Hsiang-Jung Chang
发明人： Ming-Hui Chen , Hsiang-Jung Chang
IPC分类号： B60S132
CPC分类号： B60S1/0455 , B60S1/3413
摘要： A windshield wiper arm of the motor vehicle is provided with a device including a first power interruption switch, a second power interruption switch, a relay, a motor, a gear set, a push red, and a protruded rod. When the push rod is driven to move in a vertical direction, the windshield wiper arm is pushed to move away from the windshield of the motor vehicle which is not in operation. As the motor vehicle is activated, the push rod is driven to return to a horizontal position thereof, thereby causing the windshield wiper arm to be retracted in place.
摘要翻译：机动车辆的挡风玻璃刮水器臂设置有包括第一电力中断开关，第二电力中断开关，继电器，电动机，齿轮组，推动红色和突出杆的装置。当推杆被驱动以沿垂直方向移动时，挡风玻璃刮水器臂被推动以远离未运行的机动车辆的挡风玻璃。当机动车被启动时，推动杆被驱动回到其水平位置，从而使挡风玻璃刮水器臂缩回就位。

10. 发明授权

US08563350B2 Wafer level image sensor packaging structure and manufacturing method for the same 有权
标题翻译：晶圆级图像传感器封装结构及制造方法相同
公开(公告)号：US08563350B2
公开(公告)日：2013-10-22
申请号：US12947316
申请日：2010-11-16
申请人： Hsiu-Wen Tu , Han-Hsing Chen , Chung-Hsien Hsin , Ming-Hui Chen
发明人： Hsiu-Wen Tu , Han-Hsing Chen , Chung-Hsien Hsin , Ming-Hui Chen
IPC分类号： H01L31/0203 , H01L21/00
CPC分类号： H01L27/14618 , H01L27/14623 , H01L27/14625 , H01L27/14634 , H01L27/14636 , H01L27/14685 , H01L27/1469 , H01L31/0203 , H01L31/0232 , H01L2224/13
摘要： The present invention discloses a wafer level image sensor packaging structure and a manufacturing method for the same. The manufacturing method includes the following steps: providing a silicon wafer with image sensor chips, providing a plurality of transparent lids, allotting one said transparent lid on top of the corresponding image sensor chip, and carrying out a packaging process. The manufacturing method of the invention has the advantage of having a simpler process, lower cost, and higher production yield rate. The encapsulation compound arranges on the first surface of the image sensor chip and covers the circumference of the transparent lid to avoid the side light leakage as traditional chip scale package (CSP). Thus, the sensing performance of the wafer level image sensor packaging structure can be enhanced.
摘要翻译：本发明公开了一种晶片级图像传感器封装结构及其制造方法。该制造方法包括以下步骤：向硅晶片提供图像传感器芯片，提供多个透明盖，在相应的图像传感器芯片的顶部上分配一个所述透明盖，并执行封装处理。本发明的制造方法具有工艺简单，成本低，生产率高的优点。封装化合物布置在图像传感器芯片的第一表面上，并覆盖透明盖的周边，以避免像传统芯片级封装（CSP）那样的侧面漏光。因此，可以提高晶片级图像传感器封装结构的感测性能。

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