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    • 1. 发明授权
    • Apparatus and method for transferring wafers by robot
    • 机器人传送晶片的装置及方法
    • US06206441B1
    • 2001-03-27
    • US09366226
    • 1999-08-03
    • Ming-Chien WenChuan-Yuan LuChi-Yun TsengSu-Yi Doung
    • Ming-Chien WenChuan-Yuan LuChi-Yun TsengSu-Yi Doung
    • B25J1506
    • H01L21/67259Y10S294/907Y10S414/141
    • An apparatus for transferring wafers by a robot blade and a method for using the apparatus are disclosed. In the apparatus, a robot blade that is equipped with distance sensors mounted in a bottom surface of the blade is provided which senses the distance between the bottom surface of the robot blade and an adjacent surface below the robot blade such that any possible scratching of the adjacent surface is eliminated. The adjacent surface below the robot blade may be a wafer surface in a wafer cassette, or a wafer pedestal surface in a process machine. The distance sensors are mounted in recesses in the bottom surface of the blade which may be suitably capacitance sensors, ultrasonic sensors or optical sensors. The distance sensed by the distance sensors is analyzed by a controller and compared to a predetermined value of a minimum allowable distance such that any danger of scratching the adjacent surface is eliminated.
    • 公开了一种通过机器人刀片传送晶片的装置和使用该装置的方法。 在该装置中,设置有安装在叶片的底表面中的距离传感器的机器人叶片,其感测机器人叶片的底表面和机器人叶片下方的相邻表面之间的距离,使得可能划伤 相邻表面被消除。 机器人刀片下面的相邻表面可以是晶片盒中的晶片表面,或处理机器中的晶片基座表面。 距离传感器安装在叶片底面的凹槽中,其可以是适当的电容传感器,超声波传感器或光学传感器。 由距离传感器感测的距离由控制器分析,并与最小可允许距离的预定值进行比较,从而消除了刮擦相邻表面的任何危险。