会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明授权
    • Plasma-activated deposition of conformal films
    • 等离子体活化沉积的保形膜
    • US08101531B1
    • 2012-01-24
    • US12889132
    • 2010-09-23
    • Ming LiHu KangMandyam SriramAdrien LaVoie
    • Ming LiHu KangMandyam SriramAdrien LaVoie
    • H01L21/469
    • H01L21/02164C23C16/045C23C16/402C23C16/45538H01L21/02274
    • Methods and hardware for depositing thin conformal films using plasma-activated conformal film deposition (CFD) processes are described herein. In one example, a method for forming a thin conformal film comprises, in a first phase, generating precursor radicals off of a surface of the substrate and adsorbing the precursor radicals to the surface to form surface active species; in a first purge phase, purging residual precursor from the process station; in a second phase, supplying a reactive plasma to the surface, the reactive plasma configured to react with the surface active species and generate the thin conformal film; and in a second purge phase, purging residual reactant from the process station.
    • 本文描述了使用等离子体激活的保形膜沉积(CFD)工艺沉积薄保形膜的方法和硬件。 在一个实例中,形成薄保形膜的方法包括在第一阶段中从衬底的表面产生前体自由基并将前体基团吸附到表面以形成表面活性物质; 在第一清洗阶段,从处理站清除残余前体; 在第二阶段中,将反应性等离子体供应到所述表面,所述反应性等离子体被配置成与所述表面活性物质反应并产生所述薄的保形膜; 并且在第二吹扫阶段,从处理站清除残留的反应物。
    • 3. 发明授权
    • Plasma-activated deposition of conformal films
    • 等离子体活化沉积的保形膜
    • US08524612B2
    • 2013-09-03
    • US13011569
    • 2011-01-21
    • Ming LiHu KangMandyam SriramAdrien LaVoie
    • Ming LiHu KangMandyam SriramAdrien LaVoie
    • H01L21/31H01L21/469H01L21/44
    • H01L21/02104C23C16/401C23C16/45531C23C16/45534C23C16/45542H01L21/02164H01L21/02274H01L21/0228H01L21/76898
    • Embodiments related to depositing thin conformal films using plasma-activated conformal film deposition (CFD) processes are described herein. In one example, a method of processing a substrate includes, applying photoresist to the substrate, exposing the photoresist to light via a stepper, patterning the resist with a pattern and transferring the pattern to the substrate, selectively removing photoresist from the substrate, placing the substrate into a process station, and, in the process station, in a first phase, generating radicals off of the substrate and adsorbing the radicals to the substrate to form active species, in a first purge phase, purging the process station, in a second phase, supplying a reactive plasma to the surface, the reactive plasma configured to react with the active species and generate the film, and in a second purge phase, purging the process station.
    • 本文描述了使用等离子体激活的保形膜沉积(CFD)工艺沉积薄保形膜的实施例。 在一个实例中,处理衬底的方法包括:将光致抗蚀剂施加到衬底,通过步进器将光致抗蚀剂曝光,将图案图案化并将图案转移到衬底,从衬底选择性地去除光致抗蚀剂, 底物进入处理站,并且在处理站中,在第一阶段中,在第一阶段中产生自由基,并且将基团吸附到基底上以形成活性物质,在第一清洗阶段中,在第二阶段中以第二阶段净化处理站 将反应性等离子体供应到所述表面,所述反应性等离子体被配置为与所述活性物质反应并产生所述膜,并且在第二清除阶段中清除所述处理站。
    • 4. 发明申请
    • PLASMA-ACTIVATED DEPOSITION OF CONFORMAL FILMS
    • 等离子体活化沉积膜
    • US20120077349A1
    • 2012-03-29
    • US13011569
    • 2011-01-21
    • Ming LiHu KangMandyam SriramAdrien LaVoie
    • Ming LiHu KangMandyam SriramAdrien LaVoie
    • H01L21/383
    • H01L21/02104C23C16/401C23C16/45531C23C16/45534C23C16/45542H01L21/02164H01L21/02274H01L21/0228H01L21/76898
    • Embodiments related to depositing thin conformal films using plasma-activated conformal film deposition (CFD) processes are described herein. In one example, a method of processing a substrate includes, applying photoresist to the substrate, exposing the photoresist to light via a stepper, patterning the resist with a pattern and transferring the pattern to the substrate, selectively removing photoresist from the substrate, placing the substrate into a process station, and, in the process station, in a first phase, generating radicals off of the substrate and adsorbing the radicals to the substrate to form active species, in a first purge phase, purging the process station, in a second phase, supplying a reactive plasma to the surface, the reactive plasma configured to react with the active species and generate the film, and in a second purge phase, purging the process station.
    • 本文描述了使用等离子体激活的保形膜沉积(CFD)工艺沉积薄保形膜的实施例。 在一个实例中,处理衬底的方法包括:将光致抗蚀剂施加到衬底,通过步进器将光致抗蚀剂曝光,将图案图案化并将图案转移到衬底,从衬底选择性地去除光致抗蚀剂, 底物进入处理站,并且在处理站中,在第一阶段中,在第一阶段中产生自由基,并且将基团吸附到基底上以形成活性物质,在第一清洗阶段中,在第二阶段中以第二阶段净化处理站 将反应性等离子体供应到所述表面,所述反应性等离子体被配置为与所述活性物质反应并产生所述膜,并且在第二清除阶段中清除所述处理站。