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1. 发明申请

US20100200200A1 HEAT-TRANSPORT DEVICE, METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC DEVICE 审中-公开
标题翻译：热交换装置，其制造方法和电子装置
公开(公告)号：US20100200200A1
公开(公告)日：2010-08-12
申请号：US12765694
申请日：2010-04-22
申请人： Minehiro TONOSAKI , Motosuke Ohmi , Eisaku Kato , Masakazu Yajima , Takashi Yajima
发明人： Minehiro TONOSAKI , Motosuke Ohmi , Eisaku Kato , Masakazu Yajima , Takashi Yajima
IPC分类号： F28D15/04
CPC分类号： F28D15/043 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat-transport device, which is suitable for reduction in volume and thickness, includes a wick that generates capillary action to reflux working fluid and a line in which a liquid- or vapor-phase working fluid flows, wherein the surface of at least one of the wick and the line are subjected to coating treatment by ion implantation, thermal oxidation, or steam oxidation to prevent the generation of gas, particularly hydrogen.
摘要翻译：一种适于减小体积和厚度的热传输装置包括对回流工作流体产生毛细作用的芯和流过液相或气相工作流体的管线，其中至少一个通过离子注入，热氧化或蒸汽氧化对芯和线进行涂覆处理，以防止产生气体，特别是氢气。

2. 发明申请

US20050092466A1 Heat-transport device, method for manufacturing the same, and electronic device 审中-公开
标题翻译：热输送装置及其制造方法以及电子装置
公开(公告)号：US20050092466A1
公开(公告)日：2005-05-05
申请号：US10728916
申请日：2003-12-08
申请人： Minehiro Tonosaki , Motosuke Ohmi , Eisaku Kato , Masakazu Yajima , Takashi Yajima
发明人： Minehiro Tonosaki , Motosuke Ohmi , Eisaku Kato , Masakazu Yajima , Takashi Yajima
IPC分类号： F28D15/02 , F28D15/04 , H01L23/427 , H05K7/20 , F28D15/00
CPC分类号： F28D15/043 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat-transport device, which is suitable for reduction in volume and thickness, includes a wick that generates capillary action to reflux working fluid and a line in which a liquid- or vapor-phase working fluid flows, wherein the surface of at least one of the wick and the line are subjected to coating treatment by ion implantation, thermal oxidation, or steam oxidation to prevent the generation of gas, particularly hydrogen.
摘要翻译：一种适于减小体积和厚度的热传输装置包括对回流工作流体产生毛细作用的芯和流过液相或气相工作流体的管线，其中至少一个通过离子注入，热氧化或蒸汽氧化对芯和线进行涂覆处理，以防止产生气体，特别是氢气。

3. 发明授权

US06840310B2 Cooling device, electronic apparatus and acoustic apparatus, and method for producing the cooling device 失效
标题翻译：冷却装置，电子设备和声学装置以及冷却装置的制造方法
公开(公告)号：US06840310B2
公开(公告)日：2005-01-11
申请号：US10608367
申请日：2003-06-30
申请人： Minehiro Tonosaki , Eisaku Kato , Motosuke Ohmi , Takashi Yajima
发明人： Minehiro Tonosaki , Eisaku Kato , Motosuke Ohmi , Takashi Yajima
IPC分类号： F28D15/02 , F28D15/04 , F28F13/18 , G06F1/20 , H01L23/427 , H05K7/20 , F28D15/00
CPC分类号： F28F13/187 , F28D15/0266 , F28D15/046 , F28F2245/02 , G06F1/203 , G06F2200/201 , G06F2200/203 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： The present invention provides a cooling device having improved cooling performance and providing higher flexibility, an electronic apparatus and an acoustic apparatus employing the cooling device, and a method for producing the cooling device. The cooling device is provided with an evaporator that is capable of cooling an object to be cooled, and a condenser that is capable of releasing to the outside heat that has been absorbed during the cooling by the evaporator. A vapor-phase conduit and a liquid-phase conduit, both of which are made of fluorocarbon resin and through which an operating medium flows, are disposed between and coupled to the evaporator and the condenser, thereby circulating the operating medium.
摘要翻译：本发明提供一种具有改善的冷却性能和提供更高灵活性的冷却装置，一种采用该冷却装置的电子装置和一种声学装置，以及一种用于制造冷却装置的方法。冷却装置设置有能够冷却待冷却物体的蒸发器，以及能够释放被蒸发器冷却期间吸收的外部热量的冷凝器。两者均由氟碳树脂制成并且操作介质流过的气相导管和液相导管设置在蒸发器和冷凝器之间并耦合到蒸发器和冷凝器，从而循环操作介质。

4. 发明授权

US08136581B2 Heat transport apparatus and heat transport apparatus manufacturing method 失效
标题翻译：热输送装置和热输送装置的制造方法
公开(公告)号：US08136581B2
公开(公告)日：2012-03-20
申请号：US10538296
申请日：2003-12-04
申请人： Minehiro Tonosaki , Eisaku Kato , Masakazu Yajima , Takashi Yajima
发明人： Minehiro Tonosaki , Eisaku Kato , Masakazu Yajima , Takashi Yajima
IPC分类号： F28D15/00 , H05K7/20
CPC分类号： F28D15/0266 , F28D15/043 , Y10T29/49353
摘要： A heat transport device having a composite structure that is readily manufactured and a method for manufacturing such a heat transport device are provided. The heat transport device includes a first base plate having a liquid suction and retention unit for sucking and retaining a liquid-phase working fluid by capillary force; a second base plate having a face provided with a first concavity functioning as a vaporization chamber for vaporizing the working fluid, a second concavity functioning as a liquefaction chamber for liquefying the working fluid, a first ditch for transporting the vaporized working fluid, a second ditch for transporting the liquefied working fluid, the second base plate comprising a material having a thermal conductivity lower than that of silicon; and a thermoplastic or thermosetting resin material for bonding the first and second base plates. The heat transport device can be readily manufactured by heating the first and second base plates sandwiching a thermoplastic or thermosetting resin material therebetween.
摘要翻译：提供了具有容易制造的复合结构的热输送装置及其制造方法。热传输装置包括具有用于通过毛细管力吸附和保持液相工作流体的液体吸入和保持单元的第一基板; 第二基板，其具有设置有用作蒸发工作流体的蒸发室的第一凹部的表面，用作液化工作流体的液化室的第二凹部，用于输送蒸发的工作流体的第一沟槽，第二沟槽用于运输液化的工作流体，第二基板包括热导率低于硅的材料; 以及用于粘合第一和第二基板的热塑性或热固性树脂材料。热传输装置可以容易地通过加热夹在其间的热塑性或热固性树脂材料的第一和第二基板来制造。

5. 发明申请

US20060065385A1 Heat transport apparatus and heat transport apparatus manufacturing method 失效
标题翻译：热输送装置和热输送装置的制造方法
公开(公告)号：US20060065385A1
公开(公告)日：2006-03-30
申请号：US10538296
申请日：2003-12-04
申请人： Minehiro Tonosaki , Eisaku Kato , Masakazu yajima , Takashi Yajima
发明人： Minehiro Tonosaki , Eisaku Kato , Masakazu yajima , Takashi Yajima
IPC分类号： F28D15/00 , H05K7/20
CPC分类号： F28D15/0266 , F28D15/043 , Y10T29/49353
摘要： A heat transport device having a composite structure that is readily manufactured and a method for manufacturing such a heat transport device are provided. The heat transport device includes a first base plate having a liquid suction and retention unit for sucking and retaining a liquid-phase working fluid by capillary force; a second base plate having a face provided with a first concavity functioning as a vaporization chamber for vaporizing the working fluid, a second concavity functioning as a liquefaction chamber for liquefying the working fluid, a first ditch for transporting the vaporized working fluid, a second ditch for transporting the liquefied working fluid, the second base plate comprising a material having a thermal conductivity lower than that of silicon; and a thermoplastic or thermosetting resin material for bonding the first and second base plates. The heat transport device can be readily manufactured by heating the first and second base plates sandwiching a thermoplastic or thermosetting resin material therebetween.
摘要翻译：提供了具有容易制造的复合结构的热输送装置及其制造方法。热传输装置包括具有用于通过毛细管力吸附和保持液相工作流体的液体吸入和保持单元的第一基板; 第二基板，其具有设置有用作蒸发工作流体的蒸发室的第一凹部的表面，用作液化工作流体的液化室的第二凹部，用于输送蒸发的工作流体的第一沟槽，第二沟槽用于运输液化的工作流体，第二基板包括热导率低于硅的材料; 以及用于粘合第一和第二基板的热塑性或热固性树脂材料。热传输装置可以容易地通过加热夹在其间的热塑性或热固性树脂材料的第一和第二基板来制造。

6. 发明授权

US07002802B2 Cooling device, electronic apparatus, display unit, and method of producing cooling device 失效
标题翻译：冷却装置，电子设备，显示单元以及冷却装置的制造方法
公开(公告)号：US07002802B2
公开(公告)日：2006-02-21
申请号：US11073627
申请日：2005-03-08
申请人： Motosuke Ohmi , Eisaku Kato , Minehiro Tonosaki
发明人： Motosuke Ohmi , Eisaku Kato , Minehiro Tonosaki
IPC分类号： H05K7/20
CPC分类号： H05K7/20336 , F28D15/0233
摘要： A cooling device includes a flow-path substrate, an intermediate substrate, and a lid-substrate each made of a polyimide resin, and a condenser substrate incorporated into holes of the intermediate substrate and an evaporator substrate which are made of a metal having a high thermal conductivity, whereby heat from a heat source can be enclosed into the evaporator substrate and the condenser substrate, so that the quantity of the latent heat can be substantially increased.
摘要翻译：冷却装置包括由聚酰亚胺树脂制成的流路基板，中间基板和盖基板，以及并入由中间基板和蒸发器基板的孔的冷凝器基板，所述中空基板和蒸发器基板由具有高导热性，由此能够将来自热源的热量封入蒸发器基板和冷凝器基板，从而可以显着提高潜热量。

7. 发明授权

US06785135B2 Cooling device, electronic apparatus, display unit, and method of producing cooling device 失效
标题翻译：冷却装置，电子设备，显示单元以及冷却装置的制造方法
公开(公告)号：US06785135B2
公开(公告)日：2004-08-31
申请号：US10608153
申请日：2003-06-30
申请人： Motosuke Ohmi , Eisaku Kato , Minehiro Tonosaki
发明人： Motosuke Ohmi , Eisaku Kato , Minehiro Tonosaki
IPC分类号： H05K720
CPC分类号： H05K7/20336 , F28D15/0233
摘要： A cooling device includes a flow-path substrate, an intermediate substrate, and a lid-substrate each made of a polyimide resin, and a condenser substrate incorporated into holes of the intermediate substrate and an evaporator substrate which are made of a metal having a high thermal conductivity, whereby heat from a heat source can be enclosed into the evaporator substrate and the condenser substrate, so that the quantity of the latent heat can be substantially increased.
摘要翻译：冷却装置包括由聚酰亚胺树脂制成的流路基板，中间基板和盖基板，以及并入由中间基板和蒸发器基板的孔的冷凝器基板，所述中空基板和蒸发器基板由具有高导热性，由此能够将来自热源的热量封入蒸发器基板和冷凝器基板，从而可以显着提高潜热量。

8. 发明授权

US06954359B2 Cooling device, electronic apparatus, display unit, and method of producing cooling device 失效
标题翻译：冷却装置，电子设备，显示单元以及冷却装置的制造方法
公开(公告)号：US06954359B2
公开(公告)日：2005-10-11
申请号：US10895070
申请日：2004-07-21
申请人： Motosuke Ohmi , Eisaku Kato , Minehiro Tonosaki
发明人： Motosuke Ohmi , Eisaku Kato , Minehiro Tonosaki
IPC分类号： F25D9/00 , F28D15/02 , H01L23/427 , H05K7/20
CPC分类号： H05K7/20336 , F28D15/0233
摘要： A cooling device includes a flow-path substrate, an intermediate substrate, and a lid-substrate each made of a polyimide resin, and a condenser substrate incorporated into holes of the intermediate substrate and an evaporator substrate which are made of a metal having a high thermal conductivity, whereby heat from a heat source can be enclosed into the evaporator substrate and the condenser substrate, so that the quantity of the latent heat can be substantially increased.
摘要翻译：冷却装置包括由聚酰亚胺树脂制成的流路基板，中间基板和盖基板，以及并入由中间基板和蒸发器基板的孔的冷凝器基板，所述中空基板和蒸发器基板由具有高导热性，由此能够将来自热源的热量封入蒸发器基板和冷凝器基板，从而可以显着提高潜热量。

9. 发明申请

US20050157452A1 Cooling device, electronic apparatus, display unit, and method of producing cooling device 失效
公开(公告)号：US20050157452A1
公开(公告)日：2005-07-21
申请号：US11073627
申请日：2005-03-08
申请人： Motosuke Ohmi , Eisaku Kato , Minehiro Tonosaki
发明人： Motosuke Ohmi , Eisaku Kato , Minehiro Tonosaki
IPC分类号： F25D9/00 , F28D15/02 , H01L23/427 , H05K7/20 , F16B4/00
CPC分类号： H05K7/20336 , F28D15/0233
摘要： A cooling device includes a flow-path substrate, an intermediate substrate, and a lid-substrate each made of a polyimide resin, and a condenser substrate incorporated into holes of the intermediate substrate and an evaporator substrate which are made of a metal having a high thermal conductivity, whereby heat from a heat source can be enclosed into the evaporator substrate and the condenser substrate, so that the quantity of the latent heat can be substantially increased.

10. 发明授权

US07190582B2 Cooling device, electronic equipment device, and method of manufacturing cooling device 失效
标题翻译：冷却装置，电子设备装置及制冷装置的制造方法
公开(公告)号：US07190582B2
公开(公告)日：2007-03-13
申请号：US10498335
申请日：2002-11-26
申请人： Minehiro Tonosaki , Eisaku Kato , Naoki Sano , Koji Kitagawa
发明人： Minehiro Tonosaki , Eisaku Kato , Naoki Sano , Koji Kitagawa
IPC分类号： H05K7/20
CPC分类号： G06F1/203 , F28D15/0266 , G06F2200/201 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A compact, thin type and high cooling performance cooling device, an electronic apparatus and a method of manufacturing the same are provided. The cooling device (1) has a pair of a first substrate (2) and a second substrate (3) which are made of such a material having a low thermal diffusibility as glass, formed rectangular and bonded together via a silicon member (4). On bonding surfaces of these substrates (2) and (3), grooves (5) and (6) are formed. These grooves (5) and (6) are formed so as to function as a heat pipe of a loop type when these substrates (2) and (3) are bonded.
摘要翻译：提供了一种紧凑型，薄型和高冷却性能的冷却装置，电子设备及其制造方法。冷却装置（1）具有一对第一基板（2）和第二基板（3），该第一基板（2）和第二基板（3）由玻璃制成的具有低热扩散性的材料制成，形成为矩形并通过硅部件（4）。在这些基板（2）和（3）的接合表面上形成有槽（5）和（6）。这些槽（5）和（6）形成为当这些基板（2）和（3）接合时用作环型热管。

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