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    • 6. 发明申请
    • Cooler, electronic apparatus, and method for fabricating cooler
    • 冷却器,电子设备和制造冷却器的方法
    • US20050213303A1
    • 2005-09-29
    • US11133743
    • 2005-05-20
    • Minehiro TonosakiNaoki SanoTakuya Makino
    • Minehiro TonosakiNaoki SanoTakuya Makino
    • F28D15/02G06F1/20H01L23/427H01L23/473H05K7/20
    • H01L23/473F28D15/0266G06F1/203H01L23/427H01L2924/0002Y10T29/4935Y10T29/49353Y10T29/49359H01L2924/00
    • This invention provides a cooler having an excellent cooling performance, which is capable of being downsized and low-profiled, an electronic apparatus and a method for fabricating the cooler. The cooler (1) comprises lower board member (10) and upper complex board members. The lower board member (10) is made from plastic material and has a cavity portion (11) for allowing water or vapor to be circulated therein. The upper complex board members comprise board member (20) for a condenser part, upper board member (30), and board member (40) for a wick part. The board members (20) and (40) for the condenser part and the wick part, respectively, are made from metallic material having higher thermal conductivity such as copper and nickel. Each of the members has a groove for allowing them to be served as the condenser and the wick. The upper board member (30) includes an opening (32) or (34) for allowing the board member (20) or (40) for the condenser part or the wick part to be incorporated, and a hollow (31) for heat insulation.
    • 本发明提供一种具有优异的冷却性能的冷却器,其能够被小型化和低成形化,电子设备和制造冷却器的方法。 冷却器(1)包括下板构件(10)和上复合板构件。 下板构件(10)由塑料制成,并具有用于使水或蒸汽在其中循环的空腔部分(11)。 上复合板构件包括用于冷凝器部分的板构件(20),上板构件(30)和用于芯部的板构件(40)。 用于冷凝器部分和芯部分别的板件(20)和(40)分别由具有较高导热率的金属材料制成,例如铜和镍。 每个构件具有用于允许它们作为冷凝器和灯芯的凹槽。 上板构件(30)包括用于容纳用于冷凝器部分或芯部的板构件(20)或(40)的开口(32)或(34),以及用于隔热的中空部(31) 。