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1. 发明授权

US06770733B2 Polyimide copolymer 失效
标题翻译：聚酰亚胺共聚物
公开(公告)号：US06770733B2
公开(公告)日：2004-08-03
申请号：US10336343
申请日：2003-01-03
申请人： Min Zuo , Jenq-Tain Lin
发明人： Min Zuo , Jenq-Tain Lin
IPC分类号： C08G7310
CPC分类号： C08G73/1085 , C08G73/1042 , C08G73/1082 , Y10T428/31678 , Y10T428/31681 , Y10T428/31721
摘要： A film-formable polyimide copolymer, which comprises two kinds of tetracarboxylic acid dianhydride consisting of (A) pyromellitic acid dianhydride and (B) 3,3′,4,4′-benzophenonetetracarboxylic acid dianhydride, and (C) 6-amino-2-(p-aminophenyl)benzimidazole has a heat-resistant dimensional stability without any deterioration of mechanical properties inherent in the polyimide resin when used as a film.
摘要翻译：一种可成膜聚酰亚胺共聚物，其包含由（A）均苯四酸二酐和（B）3,3'，4,4'-二苯甲酮四羧酸二酐组成的两种四羧酸二酐和（C）6-氨基-2 - （对 - 氨基苯基）苯并咪唑具有耐热尺寸稳定性，而在用作膜时聚酰亚胺树脂固有的机械性能没有任何劣化。

2. 发明申请

US20090136671A1 Novel polyimide copolymer and metal laminate using the same 有权
标题翻译：新型聚酰亚胺共聚物和使用其的金属层压体
公开(公告)号：US20090136671A1
公开(公告)日：2009-05-28
申请号：US12290518
申请日：2008-10-31
申请人： Min Zuo , Jenq-Tain Lin
发明人： Min Zuo , Jenq-Tain Lin
IPC分类号： B05D3/00
CPC分类号： C08G73/1042 , B32B15/08 , B32B27/34 , C08G73/1085 , H05K1/0346 , Y10T428/31681 , Y10T428/31692 , Y10T428/31721
摘要： A novel polyimide copolymer, which is a copolymer comprising two kinds of tetracarboxylic acid dianhydrides consisting of (A) isopropylidene-bis(4-phenyleneoxy-4-phthalic acid) dianhydride and (B) 3,3′,4,4′-biphenyltetracarboxylic acid dianhydride, and one kind of a diamine consisting of (C) 6-amino-2-(p-aminophenyl)benzimidazole, or two or three kinds of diamines consisting of component (C) and (D) at least one kind of diamines consisting of bis(4-amino-phenyl)ether (D1) and phenylenediamine (D2), and a metal laminate manufactured by laminating said polyimide copolymer to a metallic foil. The metal laminate comprising the novel polyimide copolymer as a layer on the metallic foil has a low curling susceptibility to cause curling, twisting, warping, etc. against temperature changes due to a low coefficient of linear thermal expansion of the polyimide copolymer, and also has satisfactory adhesiveness and thermal dimensional stability and a low water absorbability, and thus can be used as a suitable for a flexible, finely printed circuit board requiring a high dimensional stability.
摘要翻译：一种新型的聚酰亚胺共聚物，它是包含由（A）异亚丙基 - 双（4-亚苯基氧基-4-邻苯二甲酸）二酐组成的两种四羧酸二酐和（B）3,3'，4,4'-联苯四羧酸（C）6-氨基-2-（对氨基苯基）苯并咪唑组成的一种二胺或由组分（C）和（D）组成的二种或三种二胺，至少一种二胺由双（4-氨基 - 苯基）醚（D1）和苯二胺（D2）组成的金属层压体，以及通过将所述聚酰亚胺共聚物层压到金属箔上制成的金属层压板。由于聚酰亚胺共聚物的线性热膨胀系数低，所以包含作为金属箔上的层的新型聚酰亚胺共聚物的金属层叠体具有低卷曲敏感性，导致卷曲，扭曲，翘曲等导致温度变化，并且还具有令人满意的粘合性和热尺寸稳定性和低吸水性，因此可以用作适合于需要高尺寸稳定性的柔性精细印刷电路板。

3. 发明授权

US07459216B2 Polyimide copolymer and metal laminate using the same 有权
标题翻译：聚酰亚胺共聚物和使用其的金属层压体
公开(公告)号：US07459216B2
公开(公告)日：2008-12-02
申请号：US10815164
申请日：2004-03-31
申请人： Min Zuo , Jenq-Tain Lin
发明人： Min Zuo , Jenq-Tain Lin
IPC分类号： B32B15/08 , C08G69/26
CPC分类号： C08G73/1042 , B32B15/08 , B32B27/34 , C08G73/1085 , H05K1/0346 , Y10T428/31681 , Y10T428/31692 , Y10T428/31721
摘要： A novel polyimide copolymer, which is a copolymer comprising two kinds of tetracarboxylic acid dianhydrides consisting of (A) isopropylidene-bis(4-phenyleneoxy-4-phthalic acid) dianhydride and (B) 3,3′,4,4′-biphenyltetracarboxylic acid dianhydride, and one kind of a diamine consisting of (C) 6-amino-2-(p-aminophenyl)benzimidazole, or two or three kinds of diamines consisting of component (C) and (D) at least one kind of diamines consisting of bis(4-amino-phenyl)ether (D1) and phenylenediamine (D2), and a metal laminate manufactured by laminating said polyimide copolymer to a metallic foil. The metal laminate comprising the novel polyimide copolymer as a layer on the metallic foil has a low curling susceptibility to cause curling, twisting, warping, etc. against temperature changes due to a low coefficient of linear thermal expansion of the polyimide copolymer, and also has satisfactory adhesiveness and thermal dimensional stability and a low water absorbability, and thus can be used as a suitable for a flexible, finely printed circuit board requiring a high dimensional stability.
摘要翻译：一种新型的聚酰亚胺共聚物，它是包含由（A）异亚丙基 - 双（4-亚苯基氧基-4-邻苯二甲酸）二酐组成的两种四羧酸二酐和（B）3,3'，4,4'-联苯四羧酸（C）6-氨基-2-（对氨基苯基）苯并咪唑组成的一种二胺或由组分（C）和（D）组成的二种或三种二胺，至少一种二胺由双（4-氨基 - 苯基）醚（D1）和苯二胺（D2）组成的金属层压体，以及通过将所述聚酰亚胺共聚物层压到金属箔上制成的金属层压板。由于聚酰亚胺共聚物的线性热膨胀系数低，所以包含作为金属箔上的层的新型聚酰亚胺共聚物的金属层叠体具有低卷曲敏感性，导致卷曲，扭曲，翘曲等导致温度变化，并且还具有令人满意的粘合性和热尺寸稳定性和低吸水性，因此可以用作适合于需要高尺寸稳定性的柔性精细印刷电路板。

4. 发明授权

US07763321B2 Polyimide copolymer and metal laminate using the same 有权
标题翻译：聚酰亚胺共聚物和使用其的金属层压体
公开(公告)号：US07763321B2
公开(公告)日：2010-07-27
申请号：US12290518
申请日：2008-10-31
申请人： Min Zuo , Jenq-Tain Lin
发明人： Min Zuo , Jenq-Tain Lin
IPC分类号： B05D3/02
CPC分类号： C08G73/1042 , B32B15/08 , B32B27/34 , C08G73/1085 , H05K1/0346 , Y10T428/31681 , Y10T428/31692 , Y10T428/31721
摘要： A novel polyimide copolymer, which is a copolymer comprising two kinds of tetracarboxylic acid dianhydrides consisting of (A) isopropylidene-bis(4-phenyleneoxy-4-phthalic acid) dianhydride and (B) 3,3′,4,4′-biphenyltetracarboxylic acid dianhydride, and one kind of a diamine consisting of (C) 6-amino-2-(p-aminophenyl)benzimidazole, or two or three kinds of diamines consisting of component (C) and (D) at least one kind of diamines consisting of bis(4-amino-phenyl)ether (D1) and phenylenediamine (D2), and a metal laminate manufactured by laminating said polyimide copolymer to a metallic foil. The metal laminate comprising the novel polyimide copolymer as a layer on the metallic foil has a low curling susceptibility to cause curling, twisting, warping, etc. against temperature changes due to a low coefficient of linear thermal expansion of the polyimide copolymer, and also has satisfactory adhesiveness and thermal dimensional stability and a low water absorbability, and thus can be used as a suitable for a flexible, finely printed circuit board requiring a high dimensional stability.
摘要翻译：一种新型的聚酰亚胺共聚物，它是包含由（A）异亚丙基 - 双（4-亚苯基氧基-4-邻苯二甲酸）二酐组成的两种四羧酸二酐和（B）3,3'，4,4'-联苯四羧酸（C）6-氨基-2-（对氨基苯基）苯并咪唑组成的一种二胺或由组分（C）和（D）组成的二种或三种二胺，至少一种二胺由双（4-氨基 - 苯基）醚（D1）和苯二胺（D2）组成的金属层压体，以及通过将所述聚酰亚胺共聚物层压到金属箔上制成的金属层压板。由于聚酰亚胺共聚物的线性热膨胀系数低，所以包含作为金属箔上的层的新型聚酰亚胺共聚物的金属层叠体具有低卷曲敏感性，导致卷曲，扭曲，翘曲等导致温度变化，并且还具有令人满意的粘合性和热尺寸稳定性和低吸水性，因此可以用作适合于需要高尺寸稳定性的柔性精细印刷电路板。

5. 发明申请

US20090133907A1 Novel polyimide copolymer and metal laminate using the same 审中-公开
公开(公告)号：US20090133907A1
公开(公告)日：2009-05-28
申请号：US12290523
申请日：2008-10-31
申请人： Min Zuo , Jenq-Tain Lin
发明人： Min Zuo , Jenq-Tain Lin
IPC分类号： H05K1/00 , C08G69/26
CPC分类号： C08G73/1042 , B32B15/08 , B32B27/34 , C08G73/1085 , H05K1/0346 , Y10T428/31681 , Y10T428/31692 , Y10T428/31721
摘要： A novel polyimide copolymer, which is a copolymer comprising two kinds of tetracarboxylic acid dianhydrides consisting of (A) isopropylidene-bis(4-phenyleneoxy-4-phthalic acid) dianhydride and (B) 3,3′,4,4′-biphenyltetracarboxylic acid dianhydride, and one kind of a diamine consisting of (C) 6-amino-2-(p-aminophenyl)benzimidazole, or two or three kinds of diamines consisting of component (C) and (D) at least one kind of diamines consisting of bis(4-amino-phenyl)ether (D1) and phenylenediamine (D2), and a metal laminate manufactured by laminating said polyimide copolymer to a metallic foil. The metal laminate comprising the novel polyimide copolymer as a layer on the metallic foil has a low curling susceptibility to cause curling, twisting, warping, etc. against temperature changes due to a low coefficient of linear thermal expansion of the polyimide copolymer, and also has satisfactory adhesiveness and thermal dimensional stability and a low water absorbability, and thus can be used as a suitable for a flexible, finely printed circuit board requiring a high dimensional stability.

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