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1. 发明授权

US08518297B2 Polishing composition and polishing method using the same 有权
标题翻译：抛光组合物和抛光方法使用相同
公开(公告)号：US08518297B2
公开(公告)日：2013-08-27
申请号：US12362991
申请日：2009-01-30
申请人： Mikikazu Shimizu , Tomohiko Akatsuka , Kazuya Sumita
发明人： Mikikazu Shimizu , Tomohiko Akatsuka , Kazuya Sumita
IPC分类号： C09K13/06
CPC分类号： H01L21/3212 , C09G1/02
摘要： The present invention provides a polishing composition that can be suitably used in polishing of polysilicon, and a polishing method using the polishing composition. The polishing composition contains abrasive grains and an anionic surfactant having a monooxyethylene group or a polyoxyethylene group and has a pH of 9 to 12. If the anionic surfactant contained in the polishing composition has a polyoxyethylene group, the number of repeating oxyethylene units in the polyoxyethylene group is preferably 2 to 8. The anionic surfactant contained in the polishing composition can be an anionic surfactant that has a phosphate group, a carboxy group, or a sulfo group as well as a monooxyethylene group or a polyoxyethylene group. The content of the anionic surfactant in the polishing composition is preferably 20 to 500 ppm.
摘要翻译：本发明提供了可以适用于多晶硅研磨的抛光组合物和使用该抛光组合物的研磨方法。抛光组合物含有磨粒和具有单氧乙烯基或聚氧乙烯基的阴离子表面活性剂，其pH为9〜12。如果研磨用组合物中含有的阴离子表面活性剂具有聚氧乙烯基，则聚氧乙烯基团优选为2〜8。抛光组合物中所含的阴离子表面活性剂可以是具有磷酸基，羧基或磺基以及单氧乙烯基或聚氧乙烯基的阴离子表面活性剂。抛光组合物中阴离子表面活性剂的含量优选为20〜500ppm。

2. 发明申请

US20090197414A1 Polishing Composition and Polishing Method Using The Same 审中-公开
标题翻译：抛光组合和抛光方法使用它
公开(公告)号：US20090197414A1
公开(公告)日：2009-08-06
申请号：US12363004
申请日：2009-01-30
申请人： Mikikazu Shimizu , Tomohiko Akatsuka , Kazuya Sumita
发明人： Mikikazu Shimizu , Tomohiko Akatsuka , Kazuya Sumita
IPC分类号： H01L21/304 , C09G1/02
CPC分类号： B24B37/044 , C09G1/02 , H01L21/3212
摘要： The present invention provides a polishing composition that can be suitably used in polishing of polysilicon, and a polishing method using the polishing composition. The polishing composition contains a nitrogen-containing nonionic surfactant and abrasive grains and has a pH of 9 to 12. The content of the nitrogen-containing nonionic surfactant in the polishing composition is preferably 20 to 500 ppm. The abrasive grains contained in the polishing composition are preferably colloidal silica. The average primary particle diameter of the abrasive grains contained in the polishing composition is preferably 10 to 90 nm. The content of the abrasive grains in the polishing composition is preferably 1.0 to 5.0% by mass.
摘要翻译：本发明提供了可以适用于多晶硅研磨的抛光组合物和使用该抛光组合物的研磨方法。抛光组合物含有含氮非离子表面活性剂和磨粒，pH为9〜12。抛光组合物中含氮非离子表面活性剂的含量优选为20〜500ppm。抛光组合物中所含的磨粒优选为胶体二氧化硅。研磨用组合物中所含的磨粒的平均一次粒径优选为10〜90nm。研磨用组合物中的磨粒的含量优选为1.0〜5.0质量％。

3. 发明授权

US09117761B2 Polishing composition and polishing method 有权
标题翻译：抛光组合物和抛光方法
公开(公告)号：US09117761B2
公开(公告)日：2015-08-25
申请号：US13814644
申请日：2011-08-02
申请人： Shuichi Tamada , Tatsuhiko Hirano , Takahiro Umeda , Kazuya Sumita , Yoshihiro Izawa
发明人： Shuichi Tamada , Tatsuhiko Hirano , Takahiro Umeda , Kazuya Sumita , Yoshihiro Izawa
IPC分类号： C09K13/00 , H01L21/306 , B24B37/04 , C09G1/02 , C09K3/14 , H01L21/321
CPC分类号： H01L21/30625 , B24B37/044 , C09G1/02 , C09K3/1409 , C09K3/1463 , H01L21/3212
摘要： A polishing composition contains a water-soluble polymer, a polishing accelerator, and an oxidizing agent. The water-soluble polymer is a polyamide-polyamine polymer having an amine value of 150 mg KOH/1 g·solid or greater.
摘要翻译：抛光组合物含有水溶性聚合物，抛光促进剂和氧化剂。水溶性聚合物是胺值为150mg KOH / 1g·固体以上的聚酰胺 - 聚胺聚合物。

4. 发明申请

US20130203254A1 POLISHING COMPOSITION AND POLISHING METHOD 有权
标题翻译：抛光组合物和抛光方法
公开(公告)号：US20130203254A1
公开(公告)日：2013-08-08
申请号：US13814644
申请日：2011-08-02
申请人： Shuichi Tamada , Tatsuhiko Hirano , Takahiro Umeda , Kazuya Sumita , Yoshihiro Izawa
发明人： Shuichi Tamada , Tatsuhiko Hirano , Takahiro Umeda , Kazuya Sumita , Yoshihiro Izawa
IPC分类号： H01L21/306
CPC分类号： H01L21/30625 , B24B37/044 , C09G1/02 , C09K3/1409 , C09K3/1463 , H01L21/3212
摘要： A polishing composition contains a water-soluble polymer, a polishing accelerator, and an oxidizing agent. The water-soluble polymer is a polyamide-polyamine polymer having an amine value of 150 mg KOH/1 g·solid or greater.
摘要翻译：抛光组合物含有水溶性聚合物，抛光促进剂和氧化剂。水溶性聚合物是胺值为150mg KOH / 1g·固体以上的聚酰胺 - 聚胺聚合物。

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