专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US06798193B2 Calibrated, low-profile magnetic sensor 有权
标题翻译：校准，低调磁传感器
公开(公告)号：US06798193B2
公开(公告)日：2004-09-28
申请号：US10219239
申请日：2002-08-14
申请人： Mike W. Zimmerman , Lamar F. Ricks , Curtis B. Johnson , Joel D. Stolfus , Douglas L. Mueller
发明人： Mike W. Zimmerman , Lamar F. Ricks , Curtis B. Johnson , Joel D. Stolfus , Douglas L. Mueller
IPC分类号： G01R3500
CPC分类号： G01D5/147 , G01R33/06 , Y10T29/49007
摘要： A calibrated, low-profile magnetic sensor and method for forming such a sensor are described herein. Generally, a magnetic sensing device is formed within a housing, wherein the magnetic sensing device comprises at least one magnet. The magnetic sensor includes a compact integrated circuit package such as, for example, a small outline integrated circuit package (SOIC). A magnetic sensing element is generally mounted to the compact integrated circuit package. The magnetic sensing device can be configured to additionally incorporate a printed circuit board (PCB) having a hole formed therein such that the compact integrated circuit package can be surface mounted off-center on the printed circuit board, so that the hole can be located within the printed circuit board to match a shape of the magnet, allowing the magnet to pass through the circuit board adjacent to the SOIC to complete the magnetic circuit. An orifice placed with in the housing permits a tool to be passed through the orifice within the housing to contact the magnet. The magnet can be placed in the optimum position for calibration of the magnetic circuit thereof. The same orifice that is used for calibrating the position of the magnet can also be utilized as an injection port for encapsulating the device using an injection epoxy dispensing process.
摘要翻译：本文描述了用于形成这种传感器的经校准的低轮廓磁传感器和方法。通常，在壳体内形成磁感测装置，其中磁感测装置包括至少一个磁体。磁传感器包括紧凑的集成电路封装，例如小外形集成电路封装（SOIC）。磁感应元件通常安装在小型集成电路封装上。磁感测装置可以被配置成额外结合具有形成在其中的孔的印刷电路板（PCB），使得紧凑型集成电路封装可以在印刷电路板上偏心地表面安装，使得孔可以位于印刷电路板与磁体形状相匹配，允许磁体通过与SOIC相邻的电路板，以完成磁路。放置在壳体中的孔允许工具穿过壳体内的孔口以接触磁体。可以将磁体置于用于校准其磁路的最佳位置。用于校准磁体位置的相同的孔口也可以用作用于使用注射环氧树脂分配工艺来封装装置的注射端口。

2. 发明授权

US07030604B1 Thermal coefficients of nudge compensation and tare for linear and rotary MR array position transducers 有权
标题翻译：用于线性和旋转MR阵列位置传感器的微动补偿和去皮的热系数
公开(公告)号：US07030604B1
公开(公告)日：2006-04-18
申请号：US11223071
申请日：2005-09-08
申请人： Anthony M. Dmytriw , Michael J. Latoria , Lamar F. Ricks , Curtis B. Johnson
发明人： Anthony M. Dmytriw , Michael J. Latoria , Lamar F. Ricks , Curtis B. Johnson
IPC分类号： G01B7/30 , G01B7/14
CPC分类号： G01D3/032 , G01D3/0365 , G01D5/145
摘要： Methods and systems are disclosed in which the errors caused by thermal expansion in magnetoresistive position transducers are reduced by predicting the physical alterations over temperature between centerline-to-centerline distances of particular magnetoresistive sensors or components within a magnetoresistive array and also between such an array and a magnet being sensed caused by thermal expansion.
摘要翻译：公开了一种方法和系统，其中通过预测在磁阻阵列内的特定磁阻传感器或组件的中心线到中心线距离之间的温度的物理变化以及在这种阵列与由热膨胀引起的磁体被感测。

3. 发明授权

US07026897B2 Multiple output magnetic sensor 失效
标题翻译：多输出磁传感器
公开(公告)号：US07026897B2
公开(公告)日：2006-04-11
申请号：US10336477
申请日：2003-01-03
申请人： Wayne A. Lamb , Lamar F. Ricks , Greg R. Furlong , Curtis B. Johnson
发明人： Wayne A. Lamb , Lamar F. Ricks , Greg R. Furlong , Curtis B. Johnson
IPC分类号： H01H9/00
CPC分类号： E05B85/26 , E05B81/66 , E05B81/70 , E05B2047/0068 , E05B2047/0069
摘要： A door position sensing system includes a door claw having first and second magnets mounted thereon, and a Hall sensor mounted so as to sense the magnetic fields of the first and second magnets. The first magnet is mounted in a door half-latch position, and the second magnet is mounted in a door full-latch position. A processor is responsive to the Hall sensor to provide outputs indicating the half-latch and full-latch positions of a door. The processor may also be arranged to indicate a door open position when neither magnet is near the sensor.
摘要翻译：门位置检测系统包括具有安装在其上的第一和第二磁体的门爪和安装成感测第一和第二磁体的磁场的霍尔传感器。第一磁体安装在门半闩锁位置，第二磁体安装在门的全闩锁位置。处理器响应于霍尔传感器以提供指示门的半锁定和完全闩锁位置的输出。处理器也可以被布置为当两个磁体都不在传感器附近时指示门打开位置。

4. 发明授权

US07644625B2 Differential pressure sense die based on silicon piezoresistive technology 有权
标题翻译：基于硅压阻技术的差压感应芯片
公开(公告)号：US07644625B2
公开(公告)日：2010-01-12
申请号：US11956811
申请日：2007-12-14
申请人： Lamar F. Ricks
发明人： Lamar F. Ricks
IPC分类号： G01L7/00
CPC分类号： G01L13/025
摘要： A method and apparatus for designing a differential pressure sense die based on a unique silicon piezoresistive technology for sensing low differential pressure in harsh duty applications is disclosed. The pressure sense die comprises of an etched pressure diaphragm and a hole that is drilled through the sense die wherein the pressure sense die possess a backside and a front side and are associated with varying pressures. A top cap can be attached to the front side and an optional constraint for stress relief can be attached to the backside of the differential pressure sense die. The top cap and the constraint comprise of glass and/or silicon and can be attached with an anodic bonding process or glass frit process.
摘要翻译：公开了一种基于用于在苛刻工作应用中感测低压差的独特硅压阻技术来设计差压感测管芯的方法和装置。压力感应模具包括蚀刻的压力隔膜和通过感测模头钻出的孔，其中压力感测模具具有背侧和前侧并与变化的压力相关联。顶盖可以连接到前侧，并且用于应力消除的可选约束可以附着在差压感测模的背面。顶盖和约束包括玻璃和/或硅，并且可以通过阳极接合工艺或玻璃料加工来附着。

5. 发明授权

US07520051B2 Packaging methods and systems for measuring multiple measurands including bi-directional flow 有权
标题翻译：用于测量多个被测量包括双向流量的包装方法和系统
公开(公告)号：US07520051B2
公开(公告)日：2009-04-21
申请号：US11649988
申请日：2007-01-04
申请人： Craig S. Becke , Lamar F. Ricks , Jamie W. Speldrich
发明人： Craig S. Becke , Lamar F. Ricks , Jamie W. Speldrich
IPC分类号： H05K3/30
CPC分类号： G01F5/00 , G01F1/684 , G01F1/72 , G01F15/185 , Y10T29/4913 , Y10T29/49169
摘要： A packing method and system for measuring multiple measurands including bi-directional flow comprises of sampling ports arranged within a flow tube in a symmetrical pattern. The ports are arranged symmetrically with respect to the X and Y centerlines of the flow tube. In addition, the ports are also arranged symmetrical to the restrictor to minimize the amount of turbulent flow within the flow tube.
摘要翻译：用于测量包括双向流的多个被测量的包装方法和系统包括以对称图案布置在流管内的取样口。端口相对于流管的X和Y中心线对称布置。另外，端口也与限制器对称地设置，以使流管内的紊流量最小化。

6. 发明授权

US07513164B1 Single diaphragm ATF differential pressure transducer 有权
标题翻译：单隔膜ATF差压传感器
公开(公告)号：US07513164B1
公开(公告)日：2009-04-07
申请号：US11958828
申请日：2007-12-18
申请人： Bomani Khemet , Lamar F. Ricks , William S. Hoover
发明人： Bomani Khemet , Lamar F. Ricks , William S. Hoover
IPC分类号： G01L7/00
CPC分类号： G01L9/0055
摘要： An advanced thick film (ATF) pressure transducer can be produced from an advanced thick film stack on a metallic substrate. The metallic substrate has a flexible metallic diaphragm that flexes when there is a pressure differential across its top and bottom surfaces. The conductive and dielectric layers of the ATF stack are patterned into wire networks and bond pads. A strain sensor can be attached to bond pads or can be formed as part of an ATF layer. Flexure of the diaphragm stresses the strain sensor to produce an output proportional to the pressure differential. The ATF pressure transducer can be packaged into a housing that provides easy deployment and electrical interconnectivity.
摘要翻译：先进的厚膜（ATF）压力传感器可以由金属基底上的先进的厚膜叠层制成。金属基底具有柔性金属隔膜，当在其顶表面和底表面之间存在压差时，其可挠曲。 ATF堆叠的导电和介电层被图案化成有线网络和接合焊盘。应变传感器可以连接到接合焊盘，或者可以形成为ATF层的一部分。隔膜的弯曲应力应变传感器产生与压差成比例的输出。 ATF压力传感器可以封装在一个容易部署和电互连的外壳中。

7. 发明授权

US07513149B1 Robust MEMS flow die with integrated protective flow channel 有权
公开(公告)号：US07513149B1
公开(公告)日：2009-04-07
申请号：US11948188
申请日：2007-11-30
申请人： Lamar F. Ricks
发明人： Lamar F. Ricks
IPC分类号： G01F1/68
CPC分类号： G01F1/6845 , G01F1/6842
摘要： A MEMS flow sensor has a flow channel that avoids wire bond pads and ancillary circuit elements. A fluid can move from the bottom of the sensor substrate, though an inlet hole, over a sensing element on the top of the substrate, and then through an outlet hole. The inlet hole and the outlet hole can pass from the substrate top to the substrate bottom. A top cap can be fixed to the top of the substrate such that it covers the sensing element, the inlet hole, and the outlet hole. The top cap constrains the flow channel and keeps fluid, either gaseous or liquid, from exiting the channel and contacting the wire bond pads or ancillary circuit elements.

8. 发明授权

US07173414B2 Position detection apparatus and method for linear and rotary sensing applications 有权
标题翻译：线性和旋转传感应用的位置检测装置和方法
公开(公告)号：US07173414B2
公开(公告)日：2007-02-06
申请号：US10993964
申请日：2004-11-18
申请人： Lamar F. Ricks , Ryan R. Furio , Andrew Nicol
发明人： Lamar F. Ricks , Ryan R. Furio , Andrew Nicol
IPC分类号： G01B7/30
CPC分类号： G01D5/142 , G01D3/022 , G01D5/24452 , G01D5/2449
摘要： A position detection system and method for linear and rotary sensing applications are disclosed herein, including a plurality of magnetoresistive sensing components for linear and rotary detection sensing, and an integrated circuit for amplifying and calibrating signals generated by the magnetoresistive sensing components in order to provide a full digital calibration and a ratio-metric output voltage or digital output signal indicative of linear and rotary position data.
摘要翻译：本文公开了用于线性和旋转感测应用的位置检测系统和方法，包括用于线性和旋转检测感测的多个磁阻感测部件，以及用于放大和校准由磁阻感测部件产生的信号的集成电路，以便提供全数字校准和比例度量输出电压或指示线性和旋转位置数据的数字输出信号。

9. 发明授权

US07116101B1 Specific location of hall chips for sensing redundant angular positions 失效
标题翻译：霍尔芯片的特定位置用于感测冗余角位置
公开(公告)号：US07116101B1
公开(公告)日：2006-10-03
申请号：US11314334
申请日：2005-12-20
申请人： Richard A. Bear , Michael T. Bunyer , Lamar F. Ricks
发明人： Richard A. Bear , Michael T. Bunyer , Lamar F. Ricks
IPC分类号： G01B7/34 , G01B7/14
CPC分类号： G01D5/142
摘要： A Hall-effect sensor apparatus, system and method. In general, a substrate having a surface can be provided. A plurality of Hall-effect sensing elements can then be configured upon the substrate, such that the centerline of a sensing plane associated with the plurality of Hall-effect sensing elements is located towards the surface of substrate, which results in a reduction of the distance between the centerline of the plane of the plurality of Hall-effect sensing elements and an axis of rotation of an associated bias magnet, thereby optimizing the location of the plurality of Hall-effect sensing elements and minimizing sensitivity to misposition and an increase in sensing accuracy.
摘要翻译：霍尔效应传感器装置，系统和方法。通常，可以提供具有表面的基板。然后可以在衬底上配置多个霍尔效应感测元件，使得与多个霍尔效应感测元件相关联的感测平面的中心线朝向衬底的表面定位，这导致距离的减小在多个霍尔效应感测元件的平面的中心线和相关联的偏置磁体的旋转轴线之间，从而优化多个霍尔效应感测元件的位置并且最小化对错位的灵敏度和感测精度的增加。

10. 发明授权

US08230745B2 Wet/wet differential pressure sensor based on microelectronic packaging process 有权
标题翻译：湿/湿差压传感器基于微电子封装工艺
公开(公告)号：US08230745B2
公开(公告)日：2012-07-31
申请号：US12273960
申请日：2008-11-19
申请人： Paul Rozgo , Alistair Bradley , Ryan S. Jones , Lamar F. Ricks
发明人： Paul Rozgo , Alistair Bradley , Ryan S. Jones , Lamar F. Ricks
IPC分类号： G01L13/02 , G01L15/00
CPC分类号： G01L13/025 , G01L9/0054 , G01L19/0069 , G01L19/145 , G01L19/147 , G01L19/148 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/10155 , H01L2924/15151 , H01L2924/16151 , H01L2924/00014
摘要： Method and system for a wet/wet differential pressure sensor based on microelectronic packaging process. A top cap with a hole can be attached to a topside of a MEMS-configured pressure sense die with a pressure sensing diaphragm in order to allow sensed media to come in contact with the topside of the pressure sensing diaphragm. An optional constraint with a hole for stress relief can be attached to a backside of the pressure sense die. Adhesive and/or elastomeric seals and/or solder can be utilized to seal the pressure sense die allowing sensed media to come in contact with both sides of the pressure sensing diaphragm without coming into contact with wirebonds and other metallized surfaces. The MEMS-configured pressure sense die can also be bonded to a substrate with standard die attach materials. Such microelectronic packaging processes yield a high performance and cost effective solution thereby providing wet-wet pressure sensing capability.
摘要翻译：基于微电子封装工艺的湿/湿差压传感器的方法和系统。具有孔的顶盖可以通过压力感测隔膜连接到MEMS配置的压力感测模具的顶部，以便允许感测的介质与压力感测隔膜的顶侧接触。具有用于应力消除的孔的可选约束可以附接到压力感测模的背面。可以使用粘合剂和/或弹性体密封件和/或焊料来密封压力感测模具，允许感测到的介质与压力感测膜片的两侧接触，而不与引线接合和其它金属化表面接触。 MEMS配置的压力感应模具也可以用标准的芯片附着材料粘合到基板上。这种微电子封装方法产生高性能和成本有效的解决方案，从而提供湿湿压力感测能力。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式