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    • 3. 发明授权
    • Differential pressure sense die based on silicon piezoresistive technology
    • 基于硅压阻技术的差压感应芯片
    • US07644625B2
    • 2010-01-12
    • US11956811
    • 2007-12-14
    • Lamar F. Ricks
    • Lamar F. Ricks
    • G01L7/00
    • G01L13/025
    • A method and apparatus for designing a differential pressure sense die based on a unique silicon piezoresistive technology for sensing low differential pressure in harsh duty applications is disclosed. The pressure sense die comprises of an etched pressure diaphragm and a hole that is drilled through the sense die wherein the pressure sense die possess a backside and a front side and are associated with varying pressures. A top cap can be attached to the front side and an optional constraint for stress relief can be attached to the backside of the differential pressure sense die. The top cap and the constraint comprise of glass and/or silicon and can be attached with an anodic bonding process or glass frit process.
    • 公开了一种基于用于在苛刻工作应用中感测低压差的独特硅压阻技术来设计差压感测管芯的方法和装置。 压力感应模具包括蚀刻的压力隔膜和通过感测模头钻出的孔,其中压力感测模具具有背侧和前侧并与变化的压力相关联。 顶盖可以连接到前侧,并且用于应力消除的可选约束可以附着在差压感测模的背面。 顶盖和约束包括玻璃和/或硅,并且可以通过阳极接合工艺或玻璃料加工来附着。
    • 4. 发明授权
    • Single diaphragm ATF differential pressure transducer
    • 单隔膜ATF差压传感器
    • US07513164B1
    • 2009-04-07
    • US11958828
    • 2007-12-18
    • Bomani KhemetLamar F. RicksWilliam S. Hoover
    • Bomani KhemetLamar F. RicksWilliam S. Hoover
    • G01L7/00
    • G01L9/0055
    • An advanced thick film (ATF) pressure transducer can be produced from an advanced thick film stack on a metallic substrate. The metallic substrate has a flexible metallic diaphragm that flexes when there is a pressure differential across its top and bottom surfaces. The conductive and dielectric layers of the ATF stack are patterned into wire networks and bond pads. A strain sensor can be attached to bond pads or can be formed as part of an ATF layer. Flexure of the diaphragm stresses the strain sensor to produce an output proportional to the pressure differential. The ATF pressure transducer can be packaged into a housing that provides easy deployment and electrical interconnectivity.
    • 先进的厚膜(ATF)压力传感器可以由金属基底上的先进的厚膜叠层制成。 金属基底具有柔性金属隔膜,当在其顶表面和底表面之间存在压差时,其可挠曲。 ATF堆叠的导电和介电层被图案化成有线网络和接合焊盘。 应变传感器可以连接到接合焊盘,或者可以形成为ATF层的一部分。 隔膜的弯曲应力应变传感器产生与压差成比例的输出。 ATF压力传感器可以封装在一个容易部署和电互连的外壳中。
    • 10. 发明申请
    • PRESSURE SENSOR WITH ON-BOARD COMPENSATION
    • 带有板上补偿的压力传感器
    • US20110132096A1
    • 2011-06-09
    • US12634551
    • 2009-12-09
    • Lamar F. Ricks
    • Lamar F. Ricks
    • G01L19/04G01L9/06
    • G01L19/02G01L9/065
    • The present disclosure relates generally to pressure sensors, and more particularly, to methods and apparatus for compensating pressure sensors for stress, temperature and/or other induced offsets and/or errors. In one illustrative embodiment, a pressure sensor may include a pressure sensing die mounted to a substrate of a pressure sensor package. The pressure sensor die may include on-board compensation. In some instances, the on-board compensation may include an on-board heating element and an on-board zener diode trim network, both situated on or in the pressure sensing die. The zener diode trim network may include one or more zener diodes and one or more resistive elements, where the zener diodes can be selectively activated to “trim” the resistive network to compensate for one or more offsets and/or errors of the pressure sensor. The on-board heating element may be configured to heat the pressure sensor assembly to various temperatures so that temperature related offsets and/or errors may be identified, and then compensated for with the zener diode trim network.
    • 本公开一般涉及压力传感器,更具体地,涉及用于补偿压力传感器用于应力,温度和/或其他诱导偏移和/或误差的方法和装置。 在一个示例性实施例中,压力传感器可以包括安装到压力传感器封装的基板的压力感测芯片。 压力传感器芯片可以包括板载补偿。 在一些情况下,车载补偿可以包括位于压力感测芯片上或其中的车载加热元件和车载齐纳二极管调整网络。 齐纳二极管调整网络可以包括一个或多个齐纳二极管和一个或多个电阻元件,其中齐纳二极管可以被选择性地激活以“修整”电阻网络以补偿压力传感器的一个或多个偏移和/或误差。 车载加热元件可以被配置为将压力传感器组件加热到各种温度,使得可以识别温度相关的偏移和/或误差,然后用齐纳二极管调整网络进行补偿。