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1. 发明授权

US4768702A Die bonding apparatus 失效
标题翻译：焊接装置
公开(公告)号：US4768702A
公开(公告)日：1988-09-06
申请号：US42705
申请日：1987-04-27
申请人： Michio Takahashi , Shinichi Arai , Tooru Mita , Tatsuhiro Suzuki
发明人： Michio Takahashi , Shinichi Arai , Tooru Mita , Tatsuhiro Suzuki
IPC分类号： H01L21/52 , B23Q1/36 , B23Q1/50 , H01L21/00 , B23K20/02
CPC分类号： H01L21/67138 , B23Q1/36 , B23Q1/50 , H01L24/81 , H01L2224/16225 , H01L2924/10253
摘要： As a die bonding apparatus for establishing electrical connection between electrodes on one side of a semiconductor chip and associated electrodes on a package comprises a pair of pinching and pressing mechanisms having a pair of pinching and pressing surfaces adapted to be moved closer relative to each other and so as to pinch and press semiconductor chip and package and at least one remote center mechanism provided in at least one of the pair of pinching and pressing mechanisms, in such a manner that a remote center thereof is positioned in the pinching and pressing surface of above-mentioned one pinching and pressing mechanism, for adjusting orientations of the pair of pinching and pressing surfaces to make the orientations thereof correspond to those of both surfaces of the semiconductor chip and the package at the time of the pressing and pinching operation all of the electrodes on one side of the semiconductor chip are thereby uniformly pressed against the corresponding electrodes on the package without any laterally shifting movement thereof even if the chip is inclined relative to the package because the sizes of bumps of the electrodes on the chip are not constant.
摘要翻译：作为用于在半导体芯片的一侧上的电极和封装上的相关电极之间建立电连接的芯片焊接装置，包括一对夹紧和压制机构，其具有适于彼此相对移动的一对夹紧和按压表面，以便夹紧并按压半导体芯片和封装以及至少一个远程中心机构，其设置在所述一对夹紧和挤压机构中的至少一个中，使得其远程中心位于上述的夹紧和按压表面中所述一个夹紧和挤压机构用于调节所述一对夹紧和挤压表面的取向，使得其取向对应于在挤压和捏合操作时半导体芯片和封装的两个表面的取向全部电极因此半导体芯片的一侧由此被均匀地压在相应的电极上即使芯片相对于封装是倾斜的，因为芯片上的电极的凸块的尺寸不恒定，因此其没有任何横向移位的移动。

2. 发明授权

US5059559A Method of aligning and bonding tab inner leads 失效
标题翻译：对准和粘接标签内引线的方法
公开(公告)号：US5059559A
公开(公告)日：1991-10-22
申请号：US265704
申请日：1988-11-01
申请人： Michio Takahashi , Tooru Mita , Yasuo Nakagawa , Toshimitsu Hamada , Hisafumi Iwata , Aizo Kaneda , Kouji Serizawa , Hiroyuki Tanaka , Koichi Sugimoto , Toshihiko Sakai , Keizo Matsukawa , Tsutomu Mimata
发明人： Michio Takahashi , Tooru Mita , Yasuo Nakagawa , Toshimitsu Hamada , Hisafumi Iwata , Aizo Kaneda , Kouji Serizawa , Hiroyuki Tanaka , Koichi Sugimoto , Toshihiko Sakai , Keizo Matsukawa , Tsutomu Mimata
IPC分类号： H01L21/00 , H01L21/603
CPC分类号： H01L21/67144 , H01L24/50 , Y10T29/49121
摘要： The present invention relates to a multi-pin chip mounting method and apparatus based on a TAB (Tape Automated Bonding) system in which leads formed on a tape and bumps formed an IC chip are aligned with each other and compress-bonded to each other. An IC chip having bumps formed on a surface thereof and inner leads formed on a carrier tape are disposed opposite to each other at a bonding station. A position of the IC chip on a stage is detected through the inner leads at the bonding station to determine the amount of correction of position of the stage. The inner leads and the IC chip are aligned with each other on the basis of the determined correction amount and are thereafter bonded to each other.
摘要翻译：本发明涉及一种基于TAB（磁带自动接合）系统的多针芯片安装方法和装置，其中形成在磁带上的引线和形成IC芯片的凸起彼此对准并且彼此压接。在其表面形成有凸起的IC芯片和形成在载带上的内部引线在接合台处彼此相对设置。通过焊接台的内部引线检测台架上的IC芯片的位置，以确定台阶位置的校正量。内部引线和IC芯片基于确定的校正量彼此对准，然后彼此结合。

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