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    • 2. 发明申请
    • Method of fabricating a planar MIM capacitor
    • 制造平面MIM电容器的方法
    • US20070232014A1
    • 2007-10-04
    • US11396844
    • 2006-04-03
    • Bradley LarsenJerry Yue
    • Bradley LarsenJerry Yue
    • H01L21/20
    • H01L28/40
    • A method of fabricating a Metal-Insulator-Metal (MIM) capacitor is presented. The method includes depositing a bottom plate of the MIM capacitor on a passivating dielectric layer which may be a pre-metal or post metal dielectric layer. A capacitor dielectric of the MIM capacitor is subsequently deposited on top of the bottom plate. The capacitor dielectric and the bottom plate both conform to the profile of the passivating dielectric layer. In addition, because the bottom plate is located on a dielectric, which is thermally stable and does not morph or change significantly with successive thermal processing, the capacitor dielectric does not have to be designed to compensate for topography changes due to such thermal processing.
    • 提出了一种制造金属 - 绝缘体 - 金属(MIM)电容器的方法。 该方法包括将MIM电容器的底板沉积在钝化介质层上,钝化介电层可以是金属前金属或后金属介电层。 MIM电容器的电容电介质随后沉积在底板的顶部上。 电容器电介质和底板都符合钝化介电层的轮廓。 另外,由于底板位于电介质上,其是热稳定的并且不会随着连续热处理而变形或显着变化,所以电容器电介质不必被设计成补偿由于这种热处理而引起的形貌变化。