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1. 发明授权

US08212218B2 Dosimeter powered by passive RF absorption 有权
标题翻译：剂量计由被动射频吸收提供动力
公开(公告)号：US08212218B2
公开(公告)日：2012-07-03
申请号：US12627076
申请日：2009-11-30
申请人： Cyril Cabral, Jr. , Michael S. Gordon , Steven J. Koester , Conal E. Murray , Kenneth P. Rodbell , Stephen M. Rossnagel , Robert L. Wisnieff , Jeng-bang Yau
发明人： Cyril Cabral, Jr. , Michael S. Gordon , Steven J. Koester , Conal E. Murray , Kenneth P. Rodbell , Stephen M. Rossnagel , Robert L. Wisnieff , Jeng-bang Yau
IPC分类号： G01T1/02
CPC分类号： G01T1/026
摘要： A system for determining an amount of radiation includes a dosimeter configured to receive the amount of radiation, the dosimeter comprising a circuit having a resonant frequency, such that the resonant frequency of the circuit changes according to the amount of radiation received by the dosimeter, the dosimeter further configured to absorb RF energy at the resonant frequency of the circuit; a radio frequency (RF) transmitter configured to transmit the RF energy at the resonant frequency to the dosimeter; and a receiver configured to determine the resonant frequency of the dosimeter based on the absorbed RF energy, wherein the amount of radiation is determined based on the resonant frequency.
摘要翻译：用于确定辐射量的系统包括配置成接收辐射量的剂量计，该剂量计包括具有谐振频率的电路，使得电路的谐振频率根据剂量计接收的辐射量而改变，剂量计还被配置为吸收电路的谐振频率处的RF能量; 射频（RF）发射器，被配置为以共振频率将所述RF能量传输到所述剂量计; 以及接收器，被配置为基于所吸收的RF能量来确定所述剂量计的谐振频率，其中所述辐射量基于所述谐振频率来确定。

2. 发明申请

US20110127438A1 Dosimeter Powered by Passive RF Absorption 有权
标题翻译：剂量计由被动RF吸收
公开(公告)号：US20110127438A1
公开(公告)日：2011-06-02
申请号：US12627076
申请日：2009-11-30
申请人： Cyril Cabral, JR. , Michael S. Gordon , Steven J. Koester , Conal E. Murray , Kenneth P. Rodbell , Stephen M. Rossnagel , Robert L. Wisnieff , Jeng-bang Yau
发明人： Cyril Cabral, JR. , Michael S. Gordon , Steven J. Koester , Conal E. Murray , Kenneth P. Rodbell , Stephen M. Rossnagel , Robert L. Wisnieff , Jeng-bang Yau
IPC分类号： G01T1/02 , G01T3/00
CPC分类号： G01T1/026
摘要： A system for determining an amount of radiation includes a dosimeter configured to receive the amount of radiation, the dosimeter comprising a circuit having a resonant frequency, such that the resonant frequency of the circuit changes according to the amount of radiation received by the dosimeter, the dosimeter further configured to absorb RF energy at the resonant frequency of the circuit; a radio frequency (RF) transmitter configured to transmit the RF energy at the resonant frequency to the dosimeter; and a receiver configured to determine the resonant frequency of the dosimeter based on the absorbed RF energy, wherein the amount of radiation is determined based on the resonant frequency.
摘要翻译：用于确定辐射量的系统包括配置成接收辐射量的剂量计，该剂量计包括具有谐振频率的电路，使得电路的谐振频率根据剂量计接收的辐射量而改变，剂量计还被配置为吸收电路的谐振频率处的RF能量; 射频（RF）发射器，被配置为以共振频率将所述RF能量传输到所述剂量计; 以及接收器，被配置为基于所吸收的RF能量来确定所述剂量计的谐振频率，其中所述辐射量基于所述谐振频率来确定。

3. 发明申请

US20090108212A1 RADIATION DETECTION SCHEMES, APPARATUS AND METHODS OF TRANSMITTING RADIATION DETECTION INFORMATION TO A NETWORK 审中-公开
标题翻译：辐射检测方案，向网络发射辐射检测信息的装置和方法
公开(公告)号：US20090108212A1
公开(公告)日：2009-04-30
申请号：US12326198
申请日：2008-12-02
申请人： Michael S. Gordon , Kenneth P. Rodbell , Robert L. Wisnieff
发明人： Michael S. Gordon , Kenneth P. Rodbell , Robert L. Wisnieff
IPC分类号： G01T1/00
CPC分类号： G01T1/04
摘要： Personal radiation detection devices, methods of obtaining radiation exposure data, and networks of personal radiation devices. The detection devices may include passive devices and active devices. The passive detection devices may have the same form factor as credit cards or be included in common types of credit card form factor sized cards.
摘要翻译：个人辐射检测装置，获得辐射照射数据的方法和个人辐射装置的网络。检测设备可以包括无源设备和有源设备。被动检测设备可以具有与信用卡相同的形式，或者被包括在常规类型的信用卡形状因子大小的卡中。

4. 发明授权

US07491948B2 Method of detecting and transmitting radiation detection information to a network 失效
标题翻译：检测和发射辐射检测信息到网络的方法
公开(公告)号：US07491948B2
公开(公告)日：2009-02-17
申请号：US11342429
申请日：2006-01-30
申请人： Michael S. Gordon , Kenneth P. Rodbell , Robert L. Wisnieff
发明人： Michael S. Gordon , Kenneth P. Rodbell , Robert L. Wisnieff
IPC分类号： G01T3/00
CPC分类号： G01T1/04
摘要： A method of detecting and transmitting radiation detection information to a network. The method including: communicating with one or more personal radiation detection devices, each device including, a host memory, an event memory, a microprocessor, a global positioning unit and a transceiver or a transmitter; a radiation shield around the host memory and the event memory; a radiation detection memory, the radiation detection memory, responsive to alpha radiation and including two or more SRAM arrays including cross-coupled invertors coupled to wordlines through different value capacitors; a conversion device including a material able to convert neutron and/or gamma radiation into alpha radiation; and an event detection circuit configured to detect and to store data relative to detection of the alpha radiation events by the radiation detection memory; storing the data in the event memory; and retrieving, in a reading device of the network, the data stored in the event memory.
摘要翻译：一种检测和发射辐射检测信息到网络的方法。该方法包括：与一个或多个个人辐射检测设备通信，每个设备包括主机存储器，事件存储器，微处理器，全球定位单元和收发器或发射器; 围绕主机存储器和事件存储器的辐射屏蔽; 辐射检测存储器，所述辐射检测存储器响应于α辐射并且包括两个或更多个SRAM阵列，包括通过不同值电容器耦合到字线的交叉耦合的反相器; 转换装置，其包括能够将中子和/或γ辐射转换为α辐射的材料; 以及事件检测电路，被配置为检测并存储相对于所述辐射检测存储器对所述α辐射事件的检测的数据; 将数据存储在事件存储器中; 以及在所述网络的读取设备中检索存储在所述事件存储器中的数据。

5. 发明申请

US20080308747A1 RADIATION DETECTION SCHEMES, APPARATUS AND METHODS OF TRANSMITTING RADIATION DETECTION INFORMATION TO A NETWORK 失效
标题翻译：辐射检测方案，向网络发射辐射检测信息的装置和方法
公开(公告)号：US20080308747A1
公开(公告)日：2008-12-18
申请号：US11342429
申请日：2006-01-30
申请人： Michael S. Gordon , Kenneth P. Rodbell , Robert L. Wisnieff
发明人： Michael S. Gordon , Kenneth P. Rodbell , Robert L. Wisnieff
IPC分类号： G01T3/00
CPC分类号： G01T1/04
摘要： Personal radiation detection devices, methods of obtaining radiation exposure data, and networks of personal radiation devices. The detection devices may include passive devices and active devices. The passive detection devices may have the same form factor as credit cards or be included in common types of credit card form factor sized cards. The active devices may be incorporated into common and widely distributed host devices.
摘要翻译：个人辐射检测装置，获得辐射照射数据的方法和个人辐射装置的网络。检测设备可以包括无源设备和有源设备。被动检测设备可以具有与信用卡相同的形式，或者被包括在常规类型的信用卡形状因子大小的卡中。有源器件可以并入公共和广泛分布的主机设备中。

6. 发明授权

US08247271B2 Formation of alpha particle shields in chip packaging 有权
标题翻译：在芯片封装中形成α粒子屏蔽
公开(公告)号：US08247271B2
公开(公告)日：2012-08-21
申请号：US12200352
申请日：2008-08-28
申请人： Paul Stephen Andry , Cyril Cabral, Jr. , Kenneth P. Rodbell , Robert L. Wisnieff
发明人： Paul Stephen Andry , Cyril Cabral, Jr. , Kenneth P. Rodbell , Robert L. Wisnieff
IPC分类号： H01L21/30
CPC分类号： H01L23/556 , H01L21/304 , H01L21/481 , H01L24/11 , H01L24/29 , H01L24/81 , H01L24/83 , H01L2224/16 , H01L2224/16113 , H01L2224/16225 , H01L2224/16227 , H01L2224/29111 , H01L2224/73204 , H01L2224/81801 , H01L2224/83801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/04953 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/19041 , H01L2924/19043 , H01L2924/2064 , H01L2924/3025 , H01L2224/13111 , H01L2924/00014
摘要： A structure fabrication method. First, an integrated circuit including N chip electric pads is provided electrically connected to a plurality of devices on the integrated circuit. Then, an interposing shield having a top side and a bottom side and having N electric conductors in the interposing shield is provided being exposed to a surrounding ambient at the top side but not at the bottom side. Next, the integrated circuit is bonded to the top side of the interposing shield such that the N chip electric pads are in electrical contact with the N electric conductors. Next, the bottom side of the interposing shield is polished so as to expose the N electric conductors to the surrounding ambient at the bottom side of the interposing shield. Then, N solder bumps are formed on the polished bottom side of the interposing shield and in electrical contact with the N electric conductors.
摘要翻译：一种结构制造方法。首先，将包括N个芯片电焊盘的集成电路电连接到集成电路上的多个器件。然后，设置具有顶侧和底侧并且在中间屏蔽中具有N个电导体的插入式屏蔽件，其暴露于顶侧周围的环境而不是在底侧。接下来，集成电路接合到中间屏蔽的顶侧，使得N个芯片电极焊盘与N个导电体电接触。接下来，对中介屏蔽的底面进行抛光，以将N根电导体暴露于插入式屏蔽的底侧周围环境。然后，在中间屏蔽的抛光底面上形成N个焊料凸块，并与N个导电体电接触。

7. 发明授权

US08928145B2 Formation of alpha particle shields in chip packaging 有权
标题翻译：在芯片封装中形成α粒子屏蔽
公开(公告)号：US08928145B2
公开(公告)日：2015-01-06
申请号：US13533182
申请日：2012-06-26
申请人： Paul Stephen Andry , Cyril Cabral, Jr. , Kenneth P. Rodbell , Robert L. Wisnieff
发明人： Paul Stephen Andry , Cyril Cabral, Jr. , Kenneth P. Rodbell , Robert L. Wisnieff
IPC分类号： H01L23/556 , H01L23/00
CPC分类号： H01L23/556 , H01L21/304 , H01L21/481 , H01L24/11 , H01L24/29 , H01L24/81 , H01L24/83 , H01L2224/16 , H01L2224/16113 , H01L2224/16225 , H01L2224/16227 , H01L2224/29111 , H01L2224/73204 , H01L2224/81801 , H01L2224/83801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/04953 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/19041 , H01L2924/19043 , H01L2924/2064 , H01L2924/3025 , H01L2224/13111 , H01L2924/00014
摘要： A structure and system for forming the structure. The structure includes a semiconductor chip and an interposing shield having a top side and a bottom side. The semiconductor chip includes N chip electric pads, wherein N is a positive integer of at least 2. The N chip electric pads are electrically connected to a plurality of devices on the semiconductor chip. The electric shield includes 2N electric conductors and N shield electric pads. Each shield electrical pad is in electrical contact and direct physical contact with a corresponding pair of electric conductors of the 2N electric conductors. The interposing shield includes a shield material. The shield material includes a first semiconductor material. The semiconductor chip is bonded to the top side of the interposing shield. Each chip electric pads is in electrical contact and direct physical contact with a corresponding shield electrical pad of the N shield electric pads.
摘要翻译：用于形成结构的结构和系统。该结构包括半导体芯片和具有顶侧和底侧的插入屏蔽。半导体芯片包括N个芯片电极焊盘，其中N是至少为2的正整数。N个芯片电极焊盘与半导体芯片上的多个器件电连接。电气屏蔽包括2N个导电体和N个屏蔽电极垫。每个屏蔽电焊垫与2N电导体的相应电导体电接触并直接物理接触。中间屏蔽包括屏蔽材料。屏蔽材料包括第一半导体材料。半导体芯片被结合到插入式屏蔽的顶侧。每个芯片电焊盘与N个屏蔽电焊盘的相应屏蔽电焊垫电接触并直接物理接触。

8. 发明申请

US20120267768A1 FORMATION OF ALPHA PARTICLE SHIELDS IN CHIP PACKAGING 有权
标题翻译：在芯片包装中形成ALPHA颗粒
公开(公告)号：US20120267768A1
公开(公告)日：2012-10-25
申请号：US13533182
申请日：2012-06-26
申请人： Paul Stephen Andry , Cyril Cabral, JR. , Kenneth P. Rodbell , Robert L. Wisnieff
发明人： Paul Stephen Andry , Cyril Cabral, JR. , Kenneth P. Rodbell , Robert L. Wisnieff
IPC分类号： H01L23/556 , B23K3/00
CPC分类号： H01L23/556 , H01L21/304 , H01L21/481 , H01L24/11 , H01L24/29 , H01L24/81 , H01L24/83 , H01L2224/16 , H01L2224/16113 , H01L2224/16225 , H01L2224/16227 , H01L2224/29111 , H01L2224/73204 , H01L2224/81801 , H01L2224/83801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/04953 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/19041 , H01L2924/19043 , H01L2924/2064 , H01L2924/3025 , H01L2224/13111 , H01L2924/00014
摘要： A structure and system for forming the structure. The structure includes a semiconductor chip and an interposing shield having a top side and a bottom side. The semiconductor chip includes N chip electric pads, wherein N is a positive integer of at least 2. The N chip electric pads are electrically connected to a plurality of devices on the semiconductor chip. The electric shield includes 2N electric conductors and N shield electric pads. Each shield electrical pad is in electrical contact and direct physical contact with a corresponding pair of electric conductors of the 2N electric conductors. The interposing shield includes a shield material. The shield material includes a first semiconductor material. The semiconductor chip is bonded to the top side of the interposing shield. Each chip electric pads is in electrical contact and direct physical contact with a corresponding shield electrical pad of the N shield electric pads.
摘要翻译：用于形成结构的结构和系统。该结构包括半导体芯片和具有顶侧和底侧的插入屏蔽。半导体芯片包括N个芯片电极焊盘，其中N是至少为2的正整数。N个芯片电极焊盘与半导体芯片上的多个器件电连接。电气屏蔽包括2N个导电体和N个屏蔽电极垫。每个屏蔽电焊垫与2N电导体的相应电导体电接触并直接物理接触。中间屏蔽包括屏蔽材料。屏蔽材料包括第一半导体材料。半导体芯片被结合到插入式屏蔽的顶侧。每个芯片电焊盘与N个屏蔽电焊盘的相应屏蔽电焊垫电接触并直接物理接触。

9. 发明申请

US20080318365A1 FORMATION OF ALPHA PARTICLE SHIELDS IN CHIP PACKAGING 有权
标题翻译：在芯片包装中形成ALPHA颗粒
公开(公告)号：US20080318365A1
公开(公告)日：2008-12-25
申请号：US12200352
申请日：2008-08-28
申请人： Paul Stephen Andry , Cyril Cabral, JR. , Kenneth P. Rodbell , Robert L. Wisnieff
发明人： Paul Stephen Andry , Cyril Cabral, JR. , Kenneth P. Rodbell , Robert L. Wisnieff
IPC分类号： H01L21/60
CPC分类号： H01L23/556 , H01L21/304 , H01L21/481 , H01L24/11 , H01L24/29 , H01L24/81 , H01L24/83 , H01L2224/16 , H01L2224/16113 , H01L2224/16225 , H01L2224/16227 , H01L2224/29111 , H01L2224/73204 , H01L2224/81801 , H01L2224/83801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/04953 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/19041 , H01L2924/19043 , H01L2924/2064 , H01L2924/3025 , H01L2224/13111 , H01L2924/00014
摘要： A structure fabrication method. First, an integrated circuit including N chip electric pads is provided electrically connected to a plurality of devices on the integrated circuit. Then, an interposing shield having a top side and a bottom side and having N electric conductors in the interposing shield is provided being exposed to a surrounding ambient at the top side but not at the bottom side. Next, the integrated circuit is bonded to the top side of the interposing shield such that the N chip electric pads are in electrical contact with the N electric conductors. Next, the bottom side of the interposing shield is polished so as to expose the N electric conductors to the surrounding ambient at the bottom side of the interposing shield. Then, N solder bumps are formed on the polished bottom side of the interposing shield and in electrical contact with the N electric conductors.
摘要翻译：一种结构制造方法。首先，将包括N个芯片电焊盘的集成电路电连接到集成电路上的多个器件。然后，设置具有顶侧和底侧并且在插入式屏蔽中具有N个电导体的插入式屏蔽件，其暴露于顶侧周围的环境而不是在底侧。接下来，集成电路接合到中间屏蔽的顶侧，使得N个芯片电极焊盘与N个导电体电接触。接下来，对中介屏蔽的底面进行抛光，以将N根电导体暴露于插入式屏蔽的底侧周围环境。然后，在中间屏蔽的抛光底面上形成N个焊料凸块，并与N个导电体电接触。

10. 发明授权

US08785217B2 Tunable radiation source 有权
标题翻译：可调辐射源
公开(公告)号：US08785217B2
公开(公告)日：2014-07-22
申请号：US13230798
申请日：2011-09-12
申请人： Michael A. Gaynes , Michael S. Gordon , Nancy C. LaBianca , Kenneth P. Rodbell
发明人： Michael A. Gaynes , Michael S. Gordon , Nancy C. LaBianca , Kenneth P. Rodbell
IPC分类号： G01R31/26 , H01L21/66
CPC分类号： H01L23/556 , G01R31/2881 , G06F17/5036 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00
摘要： An energy distribution of soft error-inducing radiation likely to be encountered by an electronic circuit during operation is determined. A tuned radiation source having a source energy distribution similar to the determined energy distribution is prepared. The electronic circuit is tested using the tuned radiation source.
摘要翻译：确定在操作期间可能由电子电路遇到的软误差诱发辐射的能量分布。制备具有与所确定的能量分布相似的源能分布的调谐辐射源。使用调谐的辐射源测试电子电路。

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