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1. 发明授权

US06449163B1 Inboard retention system for processor enclosure assemblies with substrate alignment 失效
标题翻译：具有基板对准的处理器外壳组件的内置固定系统
公开(公告)号：US06449163B1
公开(公告)日：2002-09-10
申请号：US09093138
申请日：1998-06-08
申请人： Michael R. Stark , Michael L. Rutigliano
发明人： Michael R. Stark , Michael L. Rutigliano
IPC分类号： H05K720
CPC分类号： H05K7/1431
摘要： A retention mechanism which may include a pair of flexible tabs. The flexible tabs may be pressed into opposing side edges of a substrate which supports an integrated circuit package. The substrate may be part of an electronic cartridge which has a cover. The flexible tab may extend through a space between the substrate and the cover such that the retention mechanism has a profile that is no greater than the cartridge. The retention mechanism may be mounted to a motherboard. The motherboard may have a connector that receives the substrate. An insertion tool can be used to plug the cartridge into the connector and couple the flexible tab to the substrate. An extraction tool can be used to pull the cartridge out of the connector and separate the substrate from the flexible tabs.
摘要翻译：保持机构，其可以包括一对柔性突片。柔性突片可以被压入支撑集成电路封装的基板的相对的侧边缘中。基板可以是具有盖的电子墨盒的一部分。柔性突片可以延伸穿过基板和盖之间的空间，使得保持机构具有不大于盒的轮廓。保持机构可以安装到母板上。主板可以具有接收基板的连接器。可以使用插入工具将盒插入连接器并将柔性片连接到衬底。可以使用提取工具将墨盒从连接器拉出并将基片与柔性舌片分开。

2. 发明授权

US06071137A Pressure actuated zero insertion force circuit board edge connector socket 失效
标题翻译：压力启动零插入力电路板边缘连接器插座
公开(公告)号：US06071137A
公开(公告)日：2000-06-06
申请号：US59659
申请日：1998-04-13
申请人： Michael L. Rutigliano
发明人： Michael L. Rutigliano
IPC分类号： G01R31/28 , H01R12/85 , H05K3/36 , H05K3/40 , H01R4/60
CPC分类号： G01R31/2808 , H01R12/853 , H05K3/365 , H05K3/4007
摘要： An electrical connector for establishing an interconnection between the contact pads of a printed circuit board and an electrical device. The connector includes a flexible circuit that is capable of being electrically coupled to a tester, driver, or some other external electrical device. The flexible circuit has a first side and an opposite second side and includes at least one metal layer and a plurality of electrically conductive contact bumps that are attached to and protrude from the metal layer along the first side. An expandable bladder is positioned adjacent the flexible circuit and exerts a force against the second side of the flexible circuit to cause the contact bumps to physically engage with the contact pads of the printed circuit board. A gas cylinder, pump, air compressor or other fluid pressure source is operatively coupled to the bladder for causing expansion of the bladder to effect the engagement of the contact bumps of the flexible circuit with the contact pads of the printed circuit board.
摘要翻译：一种用于在印刷电路板的接触焊盘和电气设备之间建立互连的电连接器。连接器包括能够电耦合到测试器，驱动器或一些其它外部电气设备的柔性电路。柔性电路具有第一侧和相对的第二侧，并且包括至少一个金属层和多个导电接触凸块，其沿着第一侧附接到金属层并从该金属层突出。可膨胀囊被定位成邻近柔性电路并且对柔性电路的第二侧施加力，以使接触凸块与印刷电路板的接触垫物理接合。气瓶，泵，空气压缩机或其他流体压力源可操作地联接到气囊，用于引起气囊的膨胀，以实现柔性电路的接触凸块与印刷电路板的接触垫的接合。

3. 发明授权

US6043983A EMI containment for microprocessor core mounted on a card using surface mounted clips 失效
标题翻译：使用表面安装的夹子安装在卡上的微处理器核心的EMI保护
公开(公告)号：US6043983A
公开(公告)日：2000-03-28
申请号：US98819
申请日：1998-06-17
申请人： Scot W. Taylor , Robert Starkston , Charles Gealer , Michael L. Rutigliano , Raymond A. Krick , John A. Rabenius , Edmond L. Hart , Ravi V. Mahajan , Farukh Fares
发明人： Scot W. Taylor , Robert Starkston , Charles Gealer , Michael L. Rutigliano , Raymond A. Krick , John A. Rabenius , Edmond L. Hart , Ravi V. Mahajan , Farukh Fares
IPC分类号： H05K9/00 , H05K7/20
CPC分类号： H05K9/0033
摘要： An electronic cartridge which includes a cover that is electrically coupled to a substrate by a clip. An integrated circuit package is mounted to the substrate and at least partially enclosed by the cover. The clips and cover may be connected to a ground plane of the substrate. The cover and substrate may create a "shield" about the integrated circuit package so that any electro-magnetic field that flows from the package is grounded to the substrate.
摘要翻译：一种电子墨盒，包括通过夹子电耦合到基底的盖。集成电路封装被安装到基板并且至少部分地被盖封闭。夹子和盖可以连接到基板的接地平面。盖和基板可以围绕集成电路封装产生“屏蔽”，使得从封装流出的任何电磁场接地到基板。

4. 发明授权

US09347987B2 Direct liquid-contact micro-channel heat transfer devices, methods of temperature control for semiconductive devices, and processes of forming same 有权
公开(公告)号：US09347987B2
公开(公告)日：2016-05-24
申请号：US12590379
申请日：2009-11-06
申请人： Christopher R. Schroeder , Christopher W. Ackerman , James C. Shipley , Tolga Acikalin , Ioan Sauciuc , Michael L. Rutigliano , James G. Maveety , Ashish X. Gupta
发明人： Christopher R. Schroeder , Christopher W. Ackerman , James C. Shipley , Tolga Acikalin , Ioan Sauciuc , Michael L. Rutigliano , James G. Maveety , Ashish X. Gupta
IPC分类号： H01L23/473 , G01R31/28 , F28F3/12
CPC分类号： G01R31/2875 , F28F3/12 , G01R31/2642 , G06F1/20 , G06F2200/201 , H01L23/467 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： An apparatus to test a semiconductive device includes a base plane that holds at least one heat-transfer fluid unit cell. The at least one heat-transfer fluid unit cell includes a fluid supply structure including a supply-orifice cross section as well as a fluid return structure including a return-orifice cross section. The supply-orifice cross section is greater than the return-orifice cross section. A die interface is also included to be a liquid-impermeable material.

5. 发明授权

US08797053B2 Positioning and socketing for semiconductor dice 有权
标题翻译：半导体芯片的定位和插槽
公开(公告)号：US08797053B2
公开(公告)日：2014-08-05
申请号：US13114876
申请日：2011-05-24
申请人： Michael L. Rutigliano , Eric J. M. Moret , David Shia
发明人： Michael L. Rutigliano , Eric J. M. Moret , David Shia
IPC分类号： G01R31/00 , G01R1/073
CPC分类号： G01R1/0735 , G01R31/2891
摘要： Devices and methods useful for testing bare and packaged semiconductor dice are provided. As integrated circuit chips become smaller and increasingly complex, the interface presented by a chip for connectivity with power supplies and other components of the system into which it is integrated similarly becomes smaller and more complex. Embodiments of the invention provide micron-scale accuracy alignment capabilities for fine pitch device first level interconnect areas. Embodiments of the invention employ air-bearings to effectuate the movement and alignment of a device under test with a testing interface. Additionally, testing interfaces comprising membranes supported by thermal fluids are provided.
摘要翻译：提供了用于测试裸机和封装的半导体晶片的器件和方法。随着集成电路芯片变得越来越小，并且越来越复杂，与芯片的电源和系统的其他组件的连接的接口所呈现的接口也变得越来越小，越来越复杂。本发明的实施例提供了用于细间距器件第一级互连区域的微米级精度对准能力。本发明的实施例采用空气轴承来实现被测设备的移动和对准与测试界面。另外，提供了包括由热流体支撑的膜的测试界面。

6. 发明授权

US5813876A Pressure actuated zero insertion force circuit board edge connector socket 失效
公开(公告)号：US5813876A
公开(公告)日：1998-09-29
申请号：US662887
申请日：1996-06-13
申请人： Michael L. Rutigliano
发明人： Michael L. Rutigliano
IPC分类号： G01R31/28 , H01R12/85 , H05K3/36 , H05K3/40 , H01R13/15
CPC分类号： G01R31/2808 , H01R12/853 , H05K3/365 , H05K3/4007
摘要： An electrical connector for establishing an interconnection between the contact pads of a printed circuit board and an electrical device. The connector includes a flexible circuit that is capable of being electrically coupled to a tester, driver, or some other external electrical device. The flexible circuit has a first side and an opposite second side and includes at least one metal layer and a plurality of electrically conductive contact bumps that are attached to and protrude from the metal layer along the first side. An expandable bladder is positioned adjacent the flexible circuit and exerts a force against the second side of the flexible circuit to cause the contact bumps to physically engage with the contact pads of the printed circuit board. A gas cylinder, pump, air compressor or other fluid pressure source is operatively coupled to the bladder for causing expansion of the bladder to effect the engagement of the contact bumps of the flexible circuit with the contact pads of the printed circuit board.

7. 发明授权

US09207274B2 Direct liquid-contact micro-channel heat transfer devices, methods of temperature control for semiconductive devices, and processes of forming same 有权
公开(公告)号：US09207274B2
公开(公告)日：2015-12-08
申请号：US12590379
申请日：2009-11-06
申请人： Christopher R. Schroeder , Christopher W. Ackerman , James C. Shipley , Tolga Acikalin , Ioan Sauciuc , Michael L. Rutigliano , James G. Maveety , Ashish X. Gupta
发明人： Christopher R. Schroeder , Christopher W. Ackerman , James C. Shipley , Tolga Acikalin , Ioan Sauciuc , Michael L. Rutigliano , James G. Maveety , Ashish X. Gupta
IPC分类号： H01L23/473 , G01R31/28 , F28F3/12
摘要： An apparatus to test a semiconductive device includes a base plane that holds at least one heat-transfer fluid unit cell. The at least one heat-transfer fluid unit cell includes a fluid supply structure including a supply-orifice cross section as well as a fluid return structure including a return-orifice cross section. The supply-orifice cross section is greater than the return-orifice cross section. A die interface is also included to be a liquid-impermeable material.

8. 发明申请

US20110109335A1 Direct liquid-contact micro-channel heat transfer devices, methods of temperature control for semiconductive devices, and processes of forming same 有权
标题翻译：直接液体接触微通道传热装置，半导体装置的温度控制方法及其形成方法
公开(公告)号：US20110109335A1
公开(公告)日：2011-05-12
申请号：US12590379
申请日：2009-11-06
申请人： Christopher R. Schroeder , Christopher W. Ackerman , James C. Shipley , Tolga Acikalin , Ioan Sauciuc , Michael L. Rutigliano , James G. Maveety , Ashish X. Gupta
发明人： Christopher R. Schroeder , Christopher W. Ackerman , James C. Shipley , Tolga Acikalin , Ioan Sauciuc , Michael L. Rutigliano , James G. Maveety , Ashish X. Gupta
IPC分类号： G01R31/26 , F28D15/00 , G01R31/10
CPC分类号： G01R31/2875 , F28F3/12 , G01R31/2642 , G06F1/20 , G06F2200/201 , H01L23/467 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： An apparatus to test a semiconductive device includes a base plane that holds at least one heat-transfer fluid unit cell. The at least one heat-transfer fluid unit cell includes a fluid supply structure including a supply-orifice cross section as well as a fluid return structure including a return-orifice cross section. The supply-orifice cross section is greater than the return-orifice cross section. A die interface is also included to be a liquid-impermeable material.
摘要翻译：测试半导体装置的装置包括保持至少一个传热流体单元的基座。至少一个传热流体单元包括包括供给孔横截面的流体供应结构以及包括回流孔横截面的流体返回结构。供应孔横截面大于回流孔横截面。模具界面也被包括为液体不可渗透的材料。

9. 发明申请

US20120299609A1 POSITIONING AND SOCKETING FOR SEMICONDUCTOR DICE 有权
标题翻译：半导体器件的定位和占有
公开(公告)号：US20120299609A1
公开(公告)日：2012-11-29
申请号：US13114876
申请日：2011-05-24
申请人： Michael L. Rutigliano , Eric J. M. Moret , David Shia
发明人： Michael L. Rutigliano , Eric J. M. Moret , David Shia
IPC分类号： G01R31/26
CPC分类号： G01R1/0735 , G01R31/2891
摘要： Devices and methods useful for testing bare and packaged semiconductor dice are provided. As integrated circuit chips become smaller and increasingly complex, the interface presented by a chip for connectivity with power supplies and other components of the system into which it is integrated similarly becomes smaller and more complex. Embodiments of the invention provide micron-scale accuracy alignment capabilities for fine pitch device first level interconnect areas. Embodiments of the invention employ air-bearings to effectuate the movement and alignment of a device under test with a testing interface. Additionally, testing interfaces comprising membranes supported by thermal fluids are provided.
摘要翻译：提供了用于测试裸机和封装的半导体晶片的器件和方法。随着集成电路芯片变得越来越小，并且越来越复杂，与芯片的电源和系统的其他组件的连接的接口所呈现的接口也变得越来越小，越来越复杂。本发明的实施例提供了用于细间距器件第一级互连区域的微米级精度对准能力。本发明的实施例采用空气轴承来实现被测设备的移动和对准与测试界面。另外，提供了包括由热流体支撑的膜的测试界面。

10. 发明授权

US06239973B1 EMI containment for microprocessor core mounted on a card using surface mounted clips 失效
标题翻译：使用表面安装的夹子安装在卡上的微处理器核心的EMI保护
公开(公告)号：US06239973B1
公开(公告)日：2001-05-29
申请号：US09535424
申请日：2000-03-27
申请人： Scot W. Taylor , Robert Starkston , Charles Gealer , Michael L. Rutigliano , Raymond A. Krick , John A. Rabenius , Edmond L. Hart , Ravi V. Mahajan , Farukh Fares
发明人： Scot W. Taylor , Robert Starkston , Charles Gealer , Michael L. Rutigliano , Raymond A. Krick , John A. Rabenius , Edmond L. Hart , Ravi V. Mahajan , Farukh Fares
IPC分类号： H05H720
CPC分类号： H05K9/0033
摘要： An electronic cartridge which includes a cover that is electrically coupled to a substrate by a clip. An integrated circuit package is mounted to the substrate and at least partially enclosed by the cover. The clips and cover may be connected to a ground plane of the substrate. The cover and substrate may create a “shield” about the integrated circuit package so that any electromagnetic field that flows from the package is grounded to the substrate.
摘要翻译：一种电子墨盒，包括通过夹子电耦合到基底的盖。集成电路封装被安装到基板并且至少部分地被盖封闭。夹子和盖可以连接到基板的接地平面。盖和基板可以围绕集成电路封装产生“屏蔽”，使得从封装流出的任何电磁场被接地到基板。

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