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    • 2. 发明授权
    • Electroless gold plating bath and method
    • 化学镀金浴及方法
    • US06736886B2
    • 2004-05-18
    • US10189130
    • 2002-07-02
    • Kazuyuki SudaYasuo OhtaYasushi Takizawa
    • Kazuyuki SudaYasuo OhtaYasushi Takizawa
    • C23C1854
    • C23C18/42C23C18/54
    • Electroless gold plating baths and plating methods using these baths are provided. The electroless gold plating bath includes i) water-soluble gold compound, ii) complexing agent that stabilizes gold ions in the plating bath, but does not cause substantial dissolution of nickel, cobalt or palladium in the plating bath, and iii) a polyethyleneimine compound. When a material to be plated is subjected to such a gold plating bath, corrosion of the base metal under the surface of the material to be plated is reduced by controlling the substitution reaction rate immediately after initiation of the reaction, and adhesion between the base metal and deposited gold coating is increased.
    • 提供使用这些浴的无电镀金浴和电镀方法。 化学镀金浴包括i)水溶性金化合物,ii)使电镀液中的金离子稳定但不会使镀镍液中的镍,钴或钯发生实质溶解的络合剂,和iii)聚乙烯亚胺化合物 。 当要镀覆的材料经受这样的镀金浴时,通过控制反应开始后立即的取代反应速率来降低被镀材料表面下的贱金属的腐蚀,并且在基体金属 并且沉积的金涂层增加。