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1. 发明申请

US20080105558A1 Electrochemically Fabricated Hermetically Sealed Microstructures and Methods of and Apparatus for Producing Such Structures 审中-公开
标题翻译：电化学制造的密封微结构，以及用于生产这种结构的方法和装置
公开(公告)号：US20080105558A1
公开(公告)日：2008-05-08
申请号：US11927680
申请日：2007-10-30
申请人： Adam Cohen , Michael Lockard , Dennis Smalley , Vacit Arat , Christopher Bang , John Dixon
发明人： Adam Cohen , Michael Lockard , Dennis Smalley , Vacit Arat , Christopher Bang , John Dixon
IPC分类号： C25D5/10
CPC分类号： B81C1/00293 , B81B2201/042 , B81C1/00333 , B81C2201/0197 , B81C2203/0145 , C25D1/003 , G01P15/0802 , G01P15/125 , H01P1/202 , H01P3/06 , H01P5/183 , H01P11/00 , H01P11/005 , H05K3/4647
摘要： In some embodiments, multilayer structures are electrochemically fabricated from at least one structural material (e.g. nickel), at least one sacrificial material (e.g. copper), and at least one sealing material (e.g. solder). In some embodiments, the layered structure is made to have a desired configuration which is at least partially and immediately surrounded by sacrificial material which is in turn surrounded almost entirely by structural material. The surrounding structural material includes openings in the surface through which etchant can attack and remove trapped sacrificial material found within. Sealing material is located near the openings. After removal of the sacrificial material, the box is evacuated or filled with a desired gas or liquid. Thereafter, the sealing material is made to flow, seal the openings, and resolidify. In other embodiments, a post-layer formation lid or other enclosure completing structure is added.
摘要翻译：在一些实施例中，多层结构由至少一种结构材料（例如镍），至少一种牺牲材料（例如铜）和至少一种密封材料（例如焊料）进行电化学制造。在一些实施例中，层状结构被制成具有至少部分地且立即被牺牲材料包围的期望构型，牺牲材料又被几乎完全由结构材料包围。周围的结构材料包括在表面中的开口，蚀刻剂可以通过该开口攻击和去除在其内发现的被捕获的牺牲材料。密封材料位于开口附近。在除去牺牲材料之后，将盒子抽空或填充所需的气体或液体。此后，使密封材料流动，密封开口并重新固化。在其他实施例中，添加了后层形成盖或其它外壳完成结构。

2. 发明申请

US20070045121A1 Electrochemically fabricated hermetically sealed microstructures and methods of and apparatus for producing such structures 审中-公开
标题翻译：电化学制造的密封微结构，以及用于生产这种结构的方法和装置
公开(公告)号：US20070045121A1
公开(公告)日：2007-03-01
申请号：US11435809
申请日：2006-05-16
申请人： Adam Cohen , Michael Lockard , Dennis Smalley , Vacit Arat , Christopher Bang , John Dixon
发明人： Adam Cohen , Michael Lockard , Dennis Smalley , Vacit Arat , Christopher Bang , John Dixon
IPC分类号： C25D5/02
CPC分类号： B81C1/00293 , B81B2201/042 , B81C1/00333 , B81C2201/0197 , B81C2203/0145 , C25D1/003 , G01P15/0802 , G01P15/125 , H01P1/202 , H01P3/06 , H01P5/183 , H01P11/00 , H01P11/005 , H05K3/4647
摘要： In some embodiments, multilayer structures are electrochemically fabricated from at least one structural material (e.g. nickel), at least one sacrificial material (e.g. copper), and at least one sealing material (e.g. solder). In some embodiments, the layered structure is made to have a desired configuration which is at least partially and immediately surrounded by sacrificial material which is in turn surrounded almost entirely by structural material. The surrounding structural material includes openings in the surface through which etchant can attack and remove trapped sacrificial material found within. Sealing material is located near the openings. After removal of the sacrificial material, the box is evacuated or filled with a desired gas or liquid. Thereafter, the sealing material is made to flow, seal the openings, and resolidify. In other embodiments, a post-layer formation lid or other enclosure completing structure is added.
摘要翻译：在一些实施例中，多层结构由至少一种结构材料（例如镍），至少一种牺牲材料（例如铜）和至少一种密封材料（例如焊料）进行电化学制造。在一些实施例中，层状结构被制成具有至少部分地且立即被牺牲材料包围的期望构型，牺牲材料又被几乎完全由结构材料包围。周围的结构材料包括在表面中的开口，蚀刻剂可以通过该开口攻击和去除在其内发现的被捕获的牺牲材料。密封材料位于开口附近。在除去牺牲材料之后，将盒子抽空或填充所需的气体或液体。此后，使密封材料流动，密封开口并重新固化。在其他实施例中，添加了后层形成盖或其它外壳完成结构。

3. 发明申请

US20050199583A1 Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates 有权
公开(公告)号：US20050199583A1
公开(公告)日：2005-09-15
申请号：US11029218
申请日：2005-01-03
申请人： Adam Cohen , Michael Lockard , Kieun Kim , Qui Le , Gang Zhang , Uri Frodis , Dale McPherson , Dennis Smalley
发明人： Adam Cohen , Michael Lockard , Kieun Kim , Qui Le , Gang Zhang , Uri Frodis , Dale McPherson , Dennis Smalley
IPC分类号： B44C1/22 , C03C15/00 , C03C25/68 , C23F1/00 , C25D5/02 , C25D5/10 , H01L21/44 , H01L21/4763
CPC分类号： C25D1/003 , B33Y10/00 , C23C18/1605 , C23C18/1608 , C23C18/1653 , C25D5/022 , C25D5/10
摘要： Some embodiments of the present invention are directed to techniques for building up single layer or multi-layer structures on dielectric or partially dielectric substrates. Certain embodiments deposit seed layer material directly onto substrate materials while other embodiments use an intervening adhesion layer material. Some embodiments use different seed layer materials and/or adhesion layer materials for sacrificial and structural conductive building materials. Some embodiments apply seed layer and/or adhesion layer materials in what are effectively selective manners while other embodiments apply the materials in blanket fashion. Some embodiments remove extraneous depositions (e.g. depositions to regions unintended to form part of a layer) via planarization operations while other embodiments remove the extraneous material via etching operations. Other embodiments are directed to the electrochemical fabrication of multilayer mesoscale or microscale structures which are formed using at least one conductive structural material, at least one conductive sacrificial material, and at least one dielectric material. In some embodiments the dielectric material is a UV-curable photopolymer.

4. 发明申请

US20050173374A1 Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates 有权
公开(公告)号：US20050173374A1
公开(公告)日：2005-08-11
申请号：US11029014
申请日：2005-01-03
申请人： Adam Cohen , Michael Lockard , Kieun Kim , Qui Le , Gang Zhang , Uri Frodis , Dale McPherson , Dennis Smalley
发明人： Adam Cohen , Michael Lockard , Kieun Kim , Qui Le , Gang Zhang , Uri Frodis , Dale McPherson , Dennis Smalley
IPC分类号： B44C1/22 , C03C15/00 , C03C25/68 , C23C18/16 , C23F1/00 , C25D5/02 , C25D5/10 , C25D5/34 , H01L21/288 , H01L21/44 , H01L21/4763 , H01L21/768
CPC分类号： B44C1/22 , B33Y10/00 , B81C1/00492 , C03C15/00 , C03C25/68 , C23C18/1605 , C23C18/161 , C23C18/1651 , C23C18/1653 , C23C18/405 , C23F1/00 , C25D1/003 , C25D5/02 , C25D5/10 , H01L21/2885 , H01L21/44 , H01L21/4763 , H01L21/76885
摘要： Some embodiments of the present invention are directed to techniques for building up single layer or multi-layer structures on dielectric or partially dielectric substrates. Certain embodiments deposit seed layer material directly onto substrate materials while other embodiments use an intervening adhesion layer material. Some embodiments use different seed layer materials and/or adhesion layer materials for sacrificial and structural conductive building materials. Some embodiments apply seed layer and/or adhesion layer materials in what are effectively selective manners while other embodiments apply the materials in blanket fashion. Some embodiments remove extraneous depositions (e.g. depositions to regions unintended to form part of a layer) via planarization operations while other embodiments remove the extraneous material via etching operations. Other embodiments are directed to the electrochemical fabrication of multilayer mesoscale or microscale structures which are formed using at least one conductive structural material, at least one conductive sacrificial material, and at least one dielectric material. In some embodiments the dielectric material is a UV-curable photopolymer.

5. 发明申请

US20070199825A1 Methods of Reducing Interlayer Discontinuities in Electrochemically Fabricated Three-Dimensional Structures 审中-公开
标题翻译：减少电化学三维结构中层间不连续性的方法
公开(公告)号：US20070199825A1
公开(公告)日：2007-08-30
申请号：US11668955
申请日：2007-01-30
申请人： Adam Cohen , Michael Lockard , Dennis Smalley
发明人： Adam Cohen , Michael Lockard , Dennis Smalley
IPC分类号： C25D5/02
CPC分类号： C25D5/02 , B33Y10/00 , C23C18/1605 , C23C18/1651 , C25D1/003 , H01P11/006
摘要： Disclosed methods reduce the discontinuities that between individual layers of a structure that is formed at least in part using electrochemical fabrication techniques. Discontinuities may exist between layers of a structure as a result of up-facing or down-facing regions defined in data descriptive of the structure or they may exist as a result of building limitations, e.g., those that result in non-parallel orientation between a building axis and sidewall surfaces of layers. Methods for reducing discontinuities may be applied to all regions or only to selected regions of the structure. Methods may be tailored to improve the accuracy between an original design of the structure and the structure as fabricated or they may simply be used to smooth the discontinuities between layers. Methods may include deposition operations that selectively favor filling of the discontinuities and/or etching operations that selectively favor removal of material from protrusions that define discontinuities.
摘要翻译：公开的方法减少了使用电化学制造技术至少部分形成的结构的各个层之间的不连续性。结构的层之间可能存在不连续性，这是由于在描述结构的数据中定义的面向上或向下的区域的结果，或者它们可能由于构建限制而存在，例如导致在建筑轴线和层的侧壁表面。用于减少不连续性的方法可以应用于所有区域或仅应用于结构的选定区域。可以调整方法以提高结构的原始设计和所制造的结构之间的精度，或者可以简单地用于平滑层之间的不连续性。方法可以包括选择性地有利于填充不连续性和/或蚀刻操作的沉积操作，其选择性地有利于从限定不连续性的突起中去除材料。

6. 发明申请

US20070015367A1 Electrochemical fabrication methods including use of surface treatments to reduce overplating and/or planarization during formation of multi-layer three-dimensional structures 有权
标题翻译：电化学制造方法包括在形成多层三维结构期间使用表面处理来减少过度平坦化和/或平坦化
公开(公告)号：US20070015367A1
公开(公告)日：2007-01-18
申请号：US11523206
申请日：2006-09-19
申请人： Adam Cohen , Dennis Smalley , Michael Lockard , Qui Le
发明人： Adam Cohen , Dennis Smalley , Michael Lockard , Qui Le
IPC分类号： H01L21/311
CPC分类号： H01L21/288 , B33Y10/00 , C23C18/1605 , C25D5/022 , C25D5/10 , H01L21/311 , H01L21/7682 , H01L21/76879
摘要： A method of fabricating three-dimensional structures from a plurality of adhered layers of at least a first and a second material wherein the first material is a conductive material and wherein each of a plurality of layers includes treating a surface of a first material prior to deposition of the second material. The treatment of the surface of the first material either (1) decreases the susceptibility of deposition of the second material onto the surface of the first material or (2) eases or quickens the removal of any second material deposited on the treated surface of the first material. In some embodiments the treatment of the first surface includes forming a dielectric coating over the surface and the second material is electrodeposited (e.g. using an electroplating or electrophoretic process). In other embodiments the first material is coated with a conductive material that doesn't readily accept deposits of electroplated or electroless deposited materials.
摘要翻译：从至少第一和第二材料的多个粘附层制造三维结构的方法，其中所述第一材料是导电材料，并且其中多个层中的每一个包括在沉积之前处理第一材料的表面的第二种材料。第一材料的表面的处理（1）降低了将第二材料沉积到第一材料的表面上的敏感性，或（2）减轻或加快了沉积在第一材料的处理表面上的任何第二材料的去除材料。在一些实施例中，第一表面的处理包括在表面上形成电介质涂层，并且第二材料被电沉积（例如使用电镀或电泳工艺）。在其它实施例中，第一材料涂覆有不容易接受电镀或无电沉积材料沉积物的导电材料。

7. 发明申请

US20060226015A1 Method of forming electrically isolated structures using thin dielectric coatings 审中-公开
标题翻译：使用薄电介质涂层形成电隔离结构的方法
公开(公告)号：US20060226015A1
公开(公告)日：2006-10-12
申请号：US11325405
申请日：2006-01-03
申请人： Dennis Smalley , Adam Cohen , Ananda Kumar , Michael Lockard
发明人： Dennis Smalley , Adam Cohen , Ananda Kumar , Michael Lockard
IPC分类号： C25D5/02
CPC分类号： A61N1/00 , C23C18/1605 , C23C18/1651 , C25D1/003 , C25D1/20 , C25D5/022 , G01R1/0483 , G01R1/06716 , G01R1/07357 , G01R31/2886 , H05K3/467 , H05K3/4682
摘要： Electrochemical fabrication processes and apparatus for producing multi-layer structures where each layer includes the deposition of at least two materials and wherein the formation of at least some layers including operations for providing coatings of dielectric material that isolate at least-portions of a first conductive material from (1) other portions of the first conductive material, (2) a second conductive material, or (3) another dielectric material, and wherein the thickness of the dielectric coatings are thin compared to the thicknesses of the layers used in forming the structures. In some preferred embodiments, portions of each individual layer are encapsulated by dielectric material while in other embodiments only boundaries between distinct regions of materials are isolated from one another by dielectric barriers.
摘要翻译：用于生产多层结构的电化学制造方法和装置，其中每个层包括至少两种材料的沉积，并且其中形成至少一些层，包括用于提供绝缘材料的涂层的操作，所述介电材料的涂层隔离第一导电材料的至少一部分从（1）第一导电材料的其他部分，（2）第二导电材料或（3）另一种介电材料，并且其中电介质涂层的厚度与用于形成结构的层的厚度相比较薄。在一些优选实施例中，每个单独层的部分被电介质材料包封，而在其它实施例中，材料的不同区域之间的边界通过电介质屏障彼此隔离。

8. 发明申请

US20050230261A1 Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates 审中-公开
标题翻译：电介质材料和/或使用电介质基片的电化学制造方法
公开(公告)号：US20050230261A1
公开(公告)日：2005-10-20
申请号：US11029216
申请日：2005-01-03
申请人： Adam Cohen , Michael Lockard , Kieun Kim , Qui Le , Gang Zhang , Uri Frodis , Dale McPherson , Dennis Smalley
发明人： Adam Cohen , Michael Lockard , Kieun Kim , Qui Le , Gang Zhang , Uri Frodis , Dale McPherson , Dennis Smalley
IPC分类号： B44C1/22 , C03C15/00 , C03C25/68 , C23F1/00 , C25D5/02 , C25D5/10 , H01L21/44 , H01L21/4763
CPC分类号： C25D1/003 , C23C18/1605 , C23C18/1608 , C23C18/165 , C23C18/1653 , C23C18/405 , C25D5/022 , C25D5/10
摘要： Some embodiments of the present invention are directed to techniques for building up single layer or multi-layer structures on dielectric or partially dielectric substrates. Certain embodiments deposit seed layer material directly onto substrate materials while other embodiments use an intervening adhesion layer material. Some embodiments use different seed layer materials and/or adhesion layer materials for sacrificial and structural conductive building materials. Some embodiments apply seed layer and/or adhesion layer materials in what are effectively selective manners while other embodiments apply the materials in blanket fashion. Some embodiments remove extraneous depositions (e.g. depositions to regions unintended to form part of a layer) via planarization operations while other embodiments remove the extraneous material via etching operations. Other embodiments are directed to the electrochemical fabrication of multilayer mesoscale or microscale structures which are formed using at least one conductive structural material, at least one conductive sacrificial material, and at least one dielectric material. In some embodiments the dielectric material is a UV-curable photopolymer.
摘要翻译：本发明的一些实施例涉及在电介质或部分电介质基底上建立单层或多层结构的技术。某些实施方案将种子层材料直接沉积到基底材料上，而其它实施例使用中间粘合层材料。一些实施例使用不同种子层材料和/或用于牺牲和结构导电建筑材料的粘合层材料。一些实施例将种子层和/或粘合层材料应用于有选择性的方式，而其它实施例以毯子的方式应用材料。一些实施例通过平面化操作去除外来沉积物（例如沉积到不想要形成层的一部分的区域），而其他实施例通过蚀刻操作去除外来材料。其它实施方案涉及使用至少一种导电结构材料，至少一种导电牺牲材料和至少一种电介质材料形成的多层中尺度或微结构结构的电化学制造。在一些实施方案中，电介质材料是可UV固化的光聚合物。

9. 发明申请

US20050067292A1 Electrochemically fabricated structures having dielectric or active bases and methods of and apparatus for producing such structures 审中-公开
标题翻译：具有电介质或活性碱的电化学制造结构以及用于制造这种结构的方法和装置
公开(公告)号：US20050067292A1
公开(公告)日：2005-03-31
申请号：US10841006
申请日：2004-05-07
申请人： Jeffrey Thompson , Adam Cohen , Michael Lockard , Dennis Smalley
发明人： Jeffrey Thompson , Adam Cohen , Michael Lockard , Dennis Smalley
IPC分类号： B81C1/00 , C25D5/02
CPC分类号： C25D1/003 , B81C1/00373 , B81C2201/0181 , B81C2201/019
摘要： Multilayer structures are electrochemically fabricated on a temporary (e.g. conductive) substrate and are thereafter bonded to a permanent (e.g. dielectric, patterned, multi-material, or otherwise functional) substrate and removed from the temporary substrate. In some embodiments, the structures are formed from top layer to bottom layer, such that the bottom layer of the structure becomes adhered to the permanent substrate, while in other embodiments the structures are formed from bottom layer to top layer and then a double substrate swap occurs. The permanent substrate may be a solid that is bonded (e.g. by an adhesive) to the layered structure or it may start out as a flowable material that is solidified adjacent to or partially surrounding a portion of the structure with bonding occurring during solidification. The multilayer structure may be released from a sacrificial material prior to attaching the permanent substrate or it may be released after attachment.
摘要翻译：多层结构在临时的（例如导电的）衬底上电化学地制造，然后在永久（例如电介质，图案化，多材料或其他功能）的衬底上结合并从临时衬底去除。在一些实施例中，结构由顶层到底层形成，使得结构的底层变得粘附到永久性基底上，而在其它实施例中，结构由底层到顶层形成，然后是双层衬底交换发生。永久性基材可以是与层状结构结合的固体（例如通过粘合剂），或者可以作为在凝固期间发生结合而邻近或部分地围绕结构的一部分固化的可流动材料开始。多层结构可以在附着永久性基底之前从牺牲材料上释放，或者在附着后可以释放多层结构。

10. 发明申请

US20050023145A1 Methods and apparatus for forming multi-layer structures using adhered masks 审中-公开
标题翻译：使用粘合掩模形成多层结构的方法和设备
公开(公告)号：US20050023145A1
公开(公告)日：2005-02-03
申请号：US10841272
申请日：2004-05-07
申请人： Adam Cohen , Jill Thomassian , Michael Lockard , Marvin Kilgo , Uri Frodis , Dennis Smalley
发明人： Adam Cohen , Jill Thomassian , Michael Lockard , Marvin Kilgo , Uri Frodis , Dennis Smalley
IPC分类号： C25D1/00 , C25D5/02 , C25D5/10 , C25D5/14 , C25D5/48 , C25D5/50 , A01N25/34
CPC分类号： C25D1/003 , C25D1/00 , C25D1/20 , C25D5/02 , C25D5/022 , C25D5/10 , C25D5/14 , C25D5/48 , C25D5/50
摘要： Numerous electrochemical fabrication methods and apparatus are provided for producing multi-layer structures (e.g. having meso-scale or micro-scale features) from a plurality of layers of deposited materials using adhered masks (e.g. formed from liquid photoresist or dry film), where two or more materials may be provided per layer where at least one of the materials is a structural material and one or more of any other materials may be a sacrificial material which will be removed after formation of the structure. Materials may comprise conductive materials that are electrodeposited or deposited in an electroless manner. In some embodiments special care is undertaken to ensure alignment between patterns formed on successive layers.
摘要翻译：提供了多种电化学制造方法和装置，用于使用粘附的掩模（例如由液体光致抗蚀剂或干膜形成）从多层沉积材料制备多层结构（例如具有中尺度或微尺度特征），其中两个或者可以在每层中提供更多的材料，其中至少一种材料是结构材料，并且任何其它材料中的一种或多种可以是在形成结构之后被去除的牺牲材料。材料可以包括以无电解方式电沉积或沉积的导电材料。在一些实施例中，特别注意确保在连续层上形成的图案之间的对准。

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