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    • 6. 发明授权
    • Multi-chip module architecture
    • 多芯片模块架构
    • US09478858B1
    • 2016-10-25
    • US13837934
    • 2013-03-15
    • James B. WestLee M. PaulsenDaniel L. WoodellMichael L. HagemanRussell D. WyseAdrian Hill
    • James B. WestLee M. PaulsenDaniel L. WoodellMichael L. HagemanRussell D. WyseAdrian Hill
    • H01Q3/00H01Q3/34
    • H01Q3/34G01S7/292G01S7/414G01S13/5244G01S13/581G01S13/953Y02A90/18
    • Electronically scanned arrays and multi-chip modules (MCMs) that may be used in such arrays are provided. One MCM may include a set of one or more first semiconductor components and a plurality of second semiconductor components. The first semiconductor component set is coupled to the plurality of second semiconductor components, and the first semiconductor component set is configured to control the plurality of second semiconductor components. Each of the plurality of second semiconductor components is accessible through a plurality of data strings providing communication between the first semiconductor component set and the plurality of second semiconductor components, each data string defining a unique path between the first semiconductor component set and the plurality of second semiconductor components, such that the plurality of data strings provide redundant data paths between the first semiconductor component set and the plurality of second semiconductor components.
    • 提供了可用于这种阵列的电子扫描阵列和多芯片模块(MCM)。 一个MCM可以包括一组一个或多个第一半导体部件和多个第二半导体部件。 第一半导体部件组耦合到多个第二半导体部件,并且第一半导体部件组被配置为控制多个第二半导体部件。 多个第二半导体部件中的每一个可通过提供第一半导体部件组和多个第二半导体部件之间的通信的多个数据串来访问,每个数据串在第一半导体部件组和多个第二半导体部件之间限定唯一的路径 半导体部件,使得多个数据串提供第一半导体部件组和多个第二半导体部件之间的冗余数据路径。