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1. 发明授权

US5798567A Ball grid array integrated circuit package which employs a flip chip integrated circuit and decoupling capacitors 失效
标题翻译：球栅阵列集成电路封装，采用倒装芯片集成电路和去耦电容
公开(公告)号：US5798567A
公开(公告)日：1998-08-25
申请号：US915969
申请日：1997-08-21
申请人： Michael G. Kelly , Pirooz Emad
发明人： Michael G. Kelly , Pirooz Emad
IPC分类号： H01L23/13 , H01L23/498 , H01L23/50 , H05K1/02 , H05K3/34 , H01L23/34
CPC分类号： H01L23/50 , H01L23/13 , H01L23/49816 , H01L23/49827 , H05K1/0231 , H05K3/3436 , H01L2224/16225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73253 , H01L24/45 , H01L24/48 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/14 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/19041 , H01L2924/19106 , H05K2201/10477 , H05K2201/1053 , H05K2201/10734 , Y02P70/613
摘要： A ball grid array to integrated circuit interconnection. The interconnection includes a ball grid array substrate having a first surface and a second surface. The first surface comprising a plurality of substrate interconnection conductive pads. A power supply via connects a power supply conductive pad of the first surface to a first conductive area on the second surface. A ground via connects a ground conductive pad of the first surface to a second conductive area on the second surface. A decoupling capacitor connected between the first conductive area and the second conductive area. The interconnection further comprises an integrated circuit comprising a plurality of integrated circuit conductive pads. A plurality of smaller solder balls interconnect at least one of the integrated circuit conductive pads to at least one of the substrate interconnection conductive pads. A circuit board substrate is electrically interconnected by larger solder balls to the ball grid array substrate.
摘要翻译：一个球栅阵列到集成电路互连。互连包括具有第一表面和第二表面的球栅阵列基板。所述第一表面包括多个衬底互连导电焊盘。电源通孔将第一表面的电源导电焊盘连接到第二表面上的第一导电区域。接地通孔将第一表面的接地导电焊盘连接到第二表面上的第二导电区域。连接在第一导电区域和第二导电区域之间的去耦电容器。互连还包括包括多个集成电路导电焊盘的集成电路。多个较小的焊球将至少一个集成电路导电焊盘连接到至少一个衬底互连导电焊盘。电路板基板通过较大的焊球与球栅阵列基板电连接。

2. 发明授权

US08859545B2 Tetrahydronaphthyridine and tetrahydropyrido[4,3-D]pyrimidine compounds and compositions thereof useful for the treatment of inflammatory and respiratory diseases 有权
标题翻译：四氢吡啶和四氢吡啶并[4,3-D]嘧啶化合物及其组合物可用于治疗炎性和呼吸系统疾病
公开(公告)号：US08859545B2
公开(公告)日：2014-10-14
申请号：US12660588
申请日：2010-03-01
申请人： Michael G. Kelly , John Kincaid , Carl J. Kaub
发明人： Michael G. Kelly , John Kincaid , Carl J. Kaub
IPC分类号： C07D471/04 , C07D413/12 , A61K31/5355 , A61K31/519 , A61P19/02 , A61P25/16 , A61P25/28 , A61P25/18 , A61P25/22 , A61P11/06 , A61P9/10 , A61P25/24
CPC分类号： C07D471/04
摘要： Tetrahydronaphthyridine and tetrahydropyrido[4,3-d]pyrimidine compounds are disclosed that have formula 1: where A, B, L, N, R1, R3, R4′, Y and Z are as defined herein. The compounds and pharmaceutical compositions thereof are useful for the prevention and treatment of a variety of conditions in mammals including humans, including by way of non-limiting example, pain, inflammation, respiratory conditions, and others.
摘要翻译：公开了具有式1的四氢萘并吡啶和四氢吡啶并[4,3-d]嘧啶化合物：其中A，B，L，N，R 1，R 3，R 4'，Y和Z如本文所定义。其化合物及其药物组合物可用于预防和治疗包括人在内的哺乳动物中的多种病症，包括作为非限制性实例，疼痛，炎症，呼吸病症等。

3. 发明申请

US20140134804A1 Method And System For A Semiconductor For Device Package With A Die-To-Packaging Substrate First Bond 有权
标题翻译：用于器件封装的半导体的方法和系统具有封装到封装的基板第一键
公开(公告)号：US20140134804A1
公开(公告)日：2014-05-15
申请号：US13678058
申请日：2012-11-15
申请人： Michael G. Kelly , Ronald Patrick Huemoeller , Won Chul Do , David Jon Hiner
发明人： Michael G. Kelly , Ronald Patrick Huemoeller , Won Chul Do , David Jon Hiner
IPC分类号： H01L21/762
CPC分类号： H01L21/76251 , H01L21/486 , H01L21/50 , H01L21/563 , H01L21/67288 , H01L21/6836 , H01L21/6838 , H01L21/68735 , H01L23/147 , H01L23/3107 , H01L23/3128 , H01L23/3142 , H01L23/3675 , H01L23/481 , H01L23/49816 , H01L23/49827 , H01L23/49833 , H01L23/5386 , H01L23/544 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L24/95 , H01L24/97 , H01L25/0652 , H01L25/0655 , H01L25/0657 , H01L25/50 , H01L2221/68322 , H01L2223/54486 , H01L2224/13147 , H01L2224/16145 , H01L2224/16146 , H01L2224/16225 , H01L2224/16227 , H01L2224/17181 , H01L2224/27622 , H01L2224/2763 , H01L2224/29011 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2224/81001 , H01L2224/81005 , H01L2224/81011 , H01L2224/81024 , H01L2224/81191 , H01L2224/81203 , H01L2224/81815 , H01L2224/83101 , H01L2224/83104 , H01L2224/83192 , H01L2224/83203 , H01L2224/83855 , H01L2224/92125 , H01L2224/92225 , H01L2224/97 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06568 , H01L2225/06589 , H01L2924/12042 , H01L2924/15311 , H01L2924/16152 , H01L2924/1616 , H01L2924/16235 , H01L2924/16251 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/3511 , H01L2924/00014 , H01L2924/00 , H01L2224/81
摘要： Methods and systems for a semiconductor device package with a die-to-packing substrate first bond are disclosed and may include bonding a first semiconductor die to a packaging substrate, applying an underfill material between the first semiconductor die and the packaging substrate, and bonding one or more additional die to the first semiconductor die. The additional die may comprise electronic devices. The first semiconductor die may comprise an interposer die or may comprise electronic devices. The first semiconductor die may be bonded to the packaging substrate utilizing a mass reflow process or a thermal compression process. The additional die may be bonded to the first die utilizing a mass reflow process or a thermal compression process. The bonded die may be encapsulated in a mold material, which may comprise a polymer. The one or more additional die may comprise micro-bumps for coupling to the first semiconductor die.
摘要翻译：公开了具有管芯到基板的第一接合的半导体器件封装的方法和系统，并且可以包括将第一半导体管芯接合到封装基板，在第一半导体管芯和封装基板之间施加底部填充材料，或更多的额外管芯到第一半导体管芯。附加的管芯可以包括电子器件。第一半导体管芯可以包括插入器管芯，或者可以包括电子器件。第一半导体管芯可以利用质量回流工艺或热压缩工艺结合到封装衬底上。可以使用质量回流工艺或热压缩工艺将附加模具结合到第一模具。粘合的模具可以包封在可以包含聚合物的模具材料中。一个或多个附加管芯可以包括用于耦合到第一半导体管芯的微突起。

4. 发明授权

US07745451B2 Tetrahydronaphthyridine and tetrahydropyrido[4,3-d]pyrimidine compounds and compositions thereof useful in the treatment of conditions associated with neurological and inflammatory disorders and dysfunctions 有权
标题翻译：四氢吡啶并四氢吡啶并[4,3-d]嘧啶化合物及其组合物可用于治疗与神经系统疾病和炎症疾病和功能障碍有关的病症
公开(公告)号：US07745451B2
公开(公告)日：2010-06-29
申请号：US11429026
申请日：2006-05-04
申请人： Michael G. Kelly , John Kincaid , Carl J. Kaub
发明人： Michael G. Kelly , John Kincaid , Carl J. Kaub
IPC分类号： C07D471/04 , C07D487/04 , C07D413/04 , C07D413/06 , C07D295/13 , C07D209/04 , C07D209/34
CPC分类号： C07D471/04
摘要： Fused heterocyclic compounds are disclosed that have formula 1: where A, B, L, N, R1, R3, R4′, Y and Z are as defined herein. The compounds and pharmaceutical compositions thereof are useful for the prevention and treatment of a variety of conditions in mammals including humans, including by way of non-limiting example, pain, inflammation, cognitive disorders, anxiety, depression, and others.
摘要翻译：公开了具有式1的稠合杂环化合物：其中A，B，L，N，R 1，R 3，R 4'，Y和Z如本文所定义。其化合物及其药物组合物可用于预防和治疗包括人在内的哺乳动物中的多种病症，包括非限制性实例，疼痛，炎症，认知障碍，焦虑，抑郁等。

5. 发明申请

US20100004222A1 Amide Derivatives as Ion-Channel Ligands and Pharmaceutical Compositions and Methods of Using the Same 审中-公开
标题翻译：酰胺衍生物作为离子通道配体和药物组合物及其使用方法
公开(公告)号：US20100004222A1
公开(公告)日：2010-01-07
申请号：US12224357
申请日：2007-02-22
申请人： Michael G. Kelly , Carl J. Kaub , John Kincaid , Satyanarayana Janagani , Guoxian Wu , Zhi-Liang Wei , Kiran Sahasrabudhe , Matthew Duncton , Ravindra B. Upasani , Yunfeng Fang , Matthew Cox , Jianhua He
发明人： Michael G. Kelly , Carl J. Kaub , John Kincaid , Satyanarayana Janagani , Guoxian Wu , Zhi-Liang Wei , Kiran Sahasrabudhe , Matthew Duncton , Ravindra B. Upasani , Yunfeng Fang , Matthew Cox , Jianhua He
IPC分类号： A61K31/47 , C07D215/38 , C07D513/04 , C07D471/04 , C07D217/02 , C07D265/36 , C07D413/12 , C07D319/16 , C07D277/62 , C07D267/14 , C07D498/04 , A61K31/436 , A61K31/4375 , A61K31/498 , A61K31/404 , A61K31/428 , A61K31/437 , A61K31/553 , A61P25/00 , A61P11/00
CPC分类号： C07D209/08 , C07D209/48 , C07D215/06 , C07D217/02 , C07D217/22 , C07D231/56 , C07D235/08 , C07D237/28 , C07D241/42 , C07D263/58 , C07D265/36 , C07D267/14 , C07D277/64 , C07D295/088 , C07D295/13 , C07D317/52 , C07D317/58 , C07D319/18 , C07D333/54 , C07D401/12 , C07D405/12 , C07D413/12 , C07D471/04 , C07D491/04 , C07D498/04 , C07D513/04
摘要： Compounds are disclosed that have a formula represented by the following: Formula (I). The compounds may be prepared as pharmaceutical compositions, and may be used for the prevention and treatment of a variety of conditions in mammals including humans, including by way of non-limiting example, pain, inflammation, traumatic injury, and others.
摘要翻译：公开了具有由下式表示的式的化合物：式（I）。化合物可以制备成药物组合物，并且可以用于预防和治疗包括人在内的哺乳动物中的各种病症，包括作为非限制性实例，疼痛，炎症，创伤性损伤等。

6. 发明授权

US07560460B2 Substituted piperazines and methods of use 失效
标题翻译：取代的哌嗪和使用方法
公开(公告)号：US07560460B2
公开(公告)日：2009-07-14
申请号：US11116759
申请日：2005-04-27
申请人： Christopher H. Fotsch , Michael G. Kelly , Mark H. Norman , Ning Xi , Shimin Xu
发明人： Christopher H. Fotsch , Michael G. Kelly , Mark H. Norman , Ning Xi , Shimin Xu
IPC分类号： A61K31/497 , C07D241/02 , C07D403/10 , C07D401/08 , C07D403/04 , C07D405/02 , C07D411/02
CPC分类号： C07D207/08 , A61K38/00 , C07D205/04 , C07D207/09 , C07D209/14 , C07D209/42 , C07D211/26 , C07D211/60 , C07D211/62 , C07D213/38 , C07D213/81 , C07D213/82 , C07D215/48 , C07D217/06 , C07D217/14 , C07D217/26 , C07D233/64 , C07D295/185 , C07D317/60 , C07D317/68 , C07D319/18 , C07D401/12 , C07D403/12 , C07D409/12 , C07D413/12 , C07D417/12 , C07D451/02 , C07K5/06026 , C07K5/06139 , C07K5/06147 , C07K5/06191
摘要： Selected substituted piperazine compounds are effective for prophylaxis and treatment of diseases, such as obesity and the like. The invention encompasses novel compounds, analogs, prodrugs and pharmaceutically acceptable salts thereof, pharmaceutical compositions and methods for prophylaxis and treatment of diseases and other maladies or conditions involving activation of the melanocortin receptor. The subject invention also relates to processes for making such compounds as well as to intermediates useful in such processes.
摘要翻译：所选的取代哌嗪化合物对于预防和治疗诸如肥胖症等疾病是有效的。本发明包括新颖的化合物，类似物，前药和药学上可接受的盐，用于预防和治疗涉及黑皮质素受体活化的疾病和其它疾病或病症的药物组合物和方法。本发明还涉及制备这些化合物的方法以及在这些方法中有用的中间体。

7. 发明授权

US07537960B2 Method of making multi-chip package with high-speed serial communications between semiconductor dice 有权
标题翻译：半导体芯片之间采用高速串行通信制造多芯片封装的方法
公开(公告)号：US07537960B2
公开(公告)日：2009-05-26
申请号：US11972602
申请日：2008-01-10
申请人： Michael G. Kelly , Paul G. Chenard , Revathi Uma Polisetti , Patrick A. McKinley
发明人： Michael G. Kelly , Paul G. Chenard , Revathi Uma Polisetti , Patrick A. McKinley
IPC分类号： H01L21/00 , H01L21/30
CPC分类号： H01L25/18 , H01L24/73 , H01L25/0655 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48464 , H01L2224/49171 , H01L2224/49175 , H01L2224/73265 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A multi-chip package includes a package substrate. First and second semiconductor die are formed on the package substrate. The first and the second semiconductor die are configured to communicate with each other via a high-speed serial communications protocol.
摘要翻译：多芯片封装包括封装基板。第一和第二半导体管芯形成在封装衬底上。第一和第二半导体管芯被配置为经由高速串行通信协议相互通信。

8. 发明授权

US07359198B2 System and method for inducing turbulence in fluid for dissipating thermal energy of electronic circuitry 失效
标题翻译：用于在流体中引起湍流以耗散电子电路的热能的系统和方法
公开(公告)号：US07359198B2
公开(公告)日：2008-04-15
申请号：US11238418
申请日：2005-09-29
申请人： Michael G. Kelly , Mark D. Johnson , William H. Sisson , Jeffrey P. Tobin
发明人： Michael G. Kelly , Mark D. Johnson , William H. Sisson , Jeffrey P. Tobin
IPC分类号： H05K7/20 , F28F7/00 , H01L23/34
CPC分类号： H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A method for cooling a circuit comprises generating movement of fluid along a path through a closed-loop system. The method further comprises inducing turbulence in the fluid by movement of at least a portion of a turbulence-inducing device arranged in the path, and dissipating thermal energy from the circuit by the fluid. A system comprises a circuit, and a closed-loop cooling system comprising fluid for cooling the circuit and at least one active turbulence-inducing device. In one embodiment, the turbulence-inducing device is a microelectromechanical system (MEMS) device. In one embodiment, the MEMS device is solely responsible for bulk fluid movement through the closed-loop cooling system.
摘要翻译：用于冷却回路的方法包括沿着通过闭环系统的路径产生流体的运动。该方法还包括通过移动位于路径中的紊流诱导装置的至少一部分，并且通过流体从该回路消散热能来在流体中引起湍流。一种系统包括电路和闭环冷却系统，其包括用于冷却电路的流体和至少一个主动湍流诱导装置。在一个实施例中，湍流诱导装置是微机电系统（MEMS）装置。在一个实施例中，MEMS装置单独负责通过闭环冷却系统的大量流体运动。

9. 发明授权

US07342310B2 Multi-chip package with high-speed serial communications between semiconductor die 有权
标题翻译：多芯片封装与半导体芯片之间的高速串行通信
公开(公告)号：US07342310B2
公开(公告)日：2008-03-11
申请号：US10841741
申请日：2004-05-07
申请人： Michael G. Kelly , Paul A. Chenard , Revathi Uma Polisetti , Patrick A. Mckinley
发明人： Michael G. Kelly , Paul A. Chenard , Revathi Uma Polisetti , Patrick A. Mckinley
IPC分类号： H01L23/34
CPC分类号： H01L25/18 , H01L24/73 , H01L25/0655 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48464 , H01L2224/49171 , H01L2224/49175 , H01L2224/73265 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A multi-chip package includes a package substrate. First and second semiconductor die are formed on the package substrate. The first and the second semiconductor die are configured to communicate with each other via a high-speed serial communications protocol.
摘要翻译：多芯片封装包括封装基板。第一和第二半导体管芯形成在封装衬底上。第一和第二半导体管芯被配置为经由高速串行通信协议相互通信。

10. 发明授权

US06689792B2 Antipsychotic indolyl derivatives 失效
标题翻译：抗精神病药物吲哚衍生物
公开(公告)号：US06689792B2
公开(公告)日：2004-02-10
申请号：US09976321
申请日：2001-10-12
申请人： Michael G. Kelly , Young H. Kang
发明人： Michael G. Kelly , Young H. Kang
IPC分类号： A61K31454
CPC分类号： C07D209/42 , C07D209/08 , C07D209/34 , C07D403/12
摘要： Compounds of formula (1) are provided: wherein R1 and R2 are H, OH, F, Cl, Br, I, 1 to 6 carbon alkyl or alkenyl, 1 to 6 carbon alkoxy, aryl, OR5, nitro, amino, CF3 or R1 and R2 are taken together to form a fused ring at the 2,3- or 3,4-positions providing a fused phenyl group or a benzodioxane group, or a 4- or 7-substituted indole group, or a 5- or 8-substituted quinoline group; R3 represents a group selected from hydrogen, a 1 to 6 carbon alkyl, a 1 to 4 carbon alkoxy or a halogen; R4 represents a group selected from hydrogen, 1 to 6 carbon alkyl or R5; R5 is CH2Ph in which the phenyl ring can be optionally substituted by a group selected from OMe, halogen, CF3; X is selected from a group represented by C, CR4, [[CHR4]] and CHCH2; A is selected from a group represented by N, NH, CH and CH2; B is selected from a group represented by ═O, ═S, H and H2; or A and B may be concatenated together to form indole, benzimidazole, indolone or indoline moieties; or a pharmaceutically acceptable salt thereof, as well as pharmaceutical compositions and methods of treating central nervous system disorders utilizing these compounds.
摘要翻译：提供式（1）化合物：其中R 1和R 2是H，OH，F，Cl，Br，I，1至6碳烷基或烯基，1至6个碳烷氧基，芳基，OR 5，硝基，氨基，CF 3或R 1 并且R 2一起在2,3或3,4位上形成稠环，提供稠合苯基或苯并二恶烷基，或4-或7-取代的吲哚基，或5-或8-取代的吲哚基，取代的喹啉基; R 3表示选自氢，1至6个碳烷基，1至4个碳烷氧基或卤素的基团; R 4表示选自氢，1至6个碳烷基或R 5的基团; R 5是CH 2 Ph，其中苯环可任选被选自OMe，卤素，CF 3的基团取代; X选自C，CR 4，[[CHR]]和CHCH 2表示的基团; A选自N，NH， CH和CH 2; B选自由= O，= S，H和H 2表示的基团;或者A和B可以连接在一起形成吲哚，苯并咪唑，吲哚酮或二氢吲哚部分; 或其药学上可接受的盐，以及利用这些化合物治疗中枢神经系统疾病的药物组合物和方法。

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