会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 6. 发明授权
    • Methods for passivating silicon devices at low temperature to achieve
low interface state density and low recombination velocity while
preserving carrier lifetime
    • 在低温下钝化硅器件以实现低界面态密度和低复合速度同时保持载流子寿命的方法
    • US5462898A
    • 1995-10-31
    • US249121
    • 1994-05-25
    • Zhizhang ChenAjeet Rohatgi
    • Zhizhang ChenAjeet Rohatgi
    • H01L21/3105H01L21/316H01L23/31H01L21/02
    • H01L21/02164H01L21/02211H01L21/02274H01L21/02307H01L21/02337H01L21/02345H01L21/02362H01L21/3105H01L21/31612H01L23/3171H01L2924/0002H01L2924/13091H01L2924/19041Y10S438/958
    • A new process has been developed to achieve a very low SiO.sub.x /Si interface state density D.sub.it, low recombination velocity S ( 5 ms) for oxides deposited on silicon substrates at low temperature. The technique involves direct plasma-enhanced chemical vapor deposition (PECVD), with appropriate growth conditions, followed by a photo-assisted rapid thermal annealing (RTA) process. Approximately 500-A-thick SiO.sub.x layers are deposited on Si by PECVD at 250.degree. C. with 0.02 W/cm.sup.-2 rf power, then covered with SiN or an evaporated thin aluminum layer, and subjected to a photo-assisted anneal in forming gas ambient at 350.degree. C., resulting in an interface state density D.sub.it in the range of about 1-4.times.10.sup.10 cm.sup.-2 eV.sup.-1, which sets a record for the lowest interface state density D.sub.it for PECVD oxides fabricated to date. Detailed analysis shows that the PECVD deposition conditions, photo-assisted anneal, forming gas ambient, and the presence of an aluminum layer on top of the oxides during the anneal, all contributed to this low value of interface state density D.sub.it. Detailed metal-oxide semiconductor analysis and model calculations show that such a low recombination velocity S is the result of moderately high positive oxide charge (5.times.10.sup.11 -1.times.10.sup.12 cm.sup.-2) and relatively low midgap interface state density (1.times.10.sup.10 -4.times.10.sup.10 cm.sup.-2 eV.sup.-1). Photo-assisted anneal was found to be superior to furnace annealing, and a forming gas ambient was better than a nitrogen ambient for achieving a very low surface recombination velocity S.
    • 已经开发了一种新的工艺,以实现低沉积在硅衬底上的氧化物的低SiO x / Si界面态密度Dit,低复合速度S(<2cm / s)和高有效载流子寿命Teff(> 5ms) 温度。 该技术涉及直接等离子体增强化学气相沉积(PECVD),具有合适的生长条件,随后进行光辅助快速热退火(RTA)工艺。 通过PECVD在250℃下以0.02W / cm 2的功率将约500-A厚的SiO x层沉积在Si上,然后用SiN或蒸发的薄铝层覆盖,并在成型中进行光辅助退火 气体环境在350℃,导致约1-4x10 10 cm -2 eV-1范围内的界面态密度Dit,这为迄今为止制造的PECVD氧化物的最低界面态密度Dit设置了记录。 详细分析表明,在退火过程中,PECVD沉积条件,光辅助退火,形成气体环境以及氧化物顶部铝层的存在都导致了界面态密度Dit的这个低值。 详细的金属氧化物半导体分析和模型计算表明,这种低复合速度S是中等高的正电荷电荷(5×10 11 -1×10 12 cm -2)和相对较低的中间隙界面态密度(1×10-4-4×10cm-2eV-1 )。 发现光辅助退火优于炉退火,并且形成气体环境优于氮环境以实现非常低的表面复合速度S.