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    • 10. 发明授权
    • Automating photolithography in the fabrication of integrated circuits
    • 在制造集成电路时自动化光刻
    • US06418353B1
    • 2002-07-09
    • US09064802
    • 1998-04-22
    • Michael D. RostokerNicholas F. PaschAshok K. Kapoor
    • Michael D. RostokerNicholas F. PaschAshok K. Kapoor
    • G06F1900
    • G03F7/705G03F7/70433G03F7/70625
    • Automated photolithography of integrated circuit wafers is enabled with a processor connected to a Rayleigh derator, a form factor generator, a logic synthesizer, a layout generator, a lithography module and a wafer process. The Rayleigh derator receives manufacturing information resulting from yield data in the wafer process, and this manufacturing data is then used to derate the theoretical minimum feature size available for etching wafer masks given a known light source and object lens numerical aperture. This minimum feature size is then used by a form factor generator in sizing transistors in a net list to their smallest manufacturable size. A logic synthesizer then converts the net list into a physical design using a layout generator combined with user defined constraints. This physical design is then used by the mask lithography module to generate wafer masks for use in the semiconductor manufacturing. Manufacturing data including process and. yield parameters is then transferred back to the Rayleigh processor for use in the designing of subsequent circuits. In this way, a direct coupling exists between the measurement of wafer process parameters and the automated sizing of semiconductor devices, enabling the production of circuits having the smallest manufacturable device sizes available for the given lithography and wafer process.
    • 集成电路晶片的自动光刻可通过连接到瑞利分离器,形状因子发生器,逻辑合成器,布局发生器,光刻模块和晶片工艺的处理器来实现。 Rayleigh变矩器接收由晶片工艺中的屈服数据产生的制造信息,然后使用该制造数据降低可用于蚀刻具有已知光源和物镜数值孔径的晶片掩模的理论最小特征尺寸。 然后,这种最小特征尺寸由形状因子发生器用于将网络列表中的晶体管调整到其最小可制造尺寸。 然后,逻辑合成器将网络列表转换为使用布局生成器与用户定义的约束组合的物理设计。 然后该掩模光刻模块将该物理设计用于半导体制造中使用的晶片掩模。 制造数据包括流程和。 然后将产量参数转移回瑞利处理器用于后续电路的设计。 以这种方式,在晶片工艺参数的测量和半导体器件的自动化尺寸之间存在直接耦合,使得能够生产具有可用于给定光刻和晶片工艺的最小可制造器件尺寸的电路。