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1. 发明授权

US09648744B2 Ejectable component assemblies in electronic devices 有权
公开(公告)号：US09648744B2
公开(公告)日：2017-05-09
申请号：US13610701
申请日：2012-09-11
申请人： Michael B. Wittenberg , Miguel C. Christophy , Shayan Malek
发明人： Michael B. Wittenberg , Miguel C. Christophy , Shayan Malek
IPC分类号： H05K1/18 , G06F1/16 , H05K7/02 , H05K3/00 , H05K3/30 , G06K13/08 , H05K1/11
CPC分类号： H05K1/18 , G06F1/1658 , G06K13/0825 , H04M2250/14 , H05K1/117 , H05K1/183 , H05K3/00 , H05K3/30 , H05K7/02 , H05K2201/09036 , H05K2201/09063 , H05K2201/09163 , Y10T29/49124 , Y10T29/4913
摘要： Electronic devices are provided with ejectable component assemblies. Each ejectable component assembly may include a tray that can be loaded with one or more types of removable module, such as a mini-SIM card and a micro-SIM card, and inserted into the device. Each assembly may also include a cover coupled to a circuit board. The tray may be inserted through an opening in the electronic device and into a space between the cover and the circuit board. A portion of the space is contained within the pocket. A portion of the tray may be contained within the pocket when the tray is inserted into the device for holding the module at a functional insertion position within the device.

2. 发明申请

US20140029206A1 EJECTABLE COMPONENT ASSEMBLIES IN ELECTRONIC DEVICES 有权
标题翻译：电子设备中的可组装组件组件
公开(公告)号：US20140029206A1
公开(公告)日：2014-01-30
申请号：US13610701
申请日：2012-09-11
申请人： Michael B. Wittenberg , Miguel C. Christophy , Shayan Malek
发明人： Michael B. Wittenberg , Miguel C. Christophy , Shayan Malek
IPC分类号： H05K1/18 , H05K3/00 , H05K3/30 , H05K7/02
CPC分类号： H05K1/18 , G06F1/1658 , G06K13/0825 , H04M2250/14 , H05K1/117 , H05K1/183 , H05K3/00 , H05K3/30 , H05K7/02 , H05K2201/09036 , H05K2201/09063 , H05K2201/09163 , Y10T29/49124 , Y10T29/4913
摘要： Electronic devices are provided with ejectable component assemblies. Each ejectable component assembly may include a tray that can be loaded with one or more types of removable module, such as a mini-SIM card and a micro-SIM card, and inserted into the device. Each assembly may also include a cover coupled to a circuit board. The tray may be inserted through an opening in the electronic device and into a space between the cover and the circuit board. A portion of the space is contained within the pocket. A portion of the tray may be contained within the pocket when the tray is inserted into the device for holding the module at a functional insertion position within the device.
摘要翻译：电子设备设置有可喷射部件组件。每个可弹出的部件组件可以包括托盘，该托盘可以装载有一个或多个类型的可拆卸模块，例如mini-SIM卡和微型SIM卡，并插入到该装置中。每个组件还可以包括联接到电路板的盖。托盘可以插入电子设备中的开口并进入盖和电路板之间的空间。空间的一部分被包含在口袋内。当托盘插入设备中时，托盘的一部分可以容纳在口袋内，用于将模块保持在设备内的功能插入位置。

3. 发明授权

US08913390B2 Thermally conductive printed circuit board bumpers 有权
标题翻译：导热印刷电路板保险杠
公开(公告)号：US08913390B2
公开(公告)日：2014-12-16
申请号：US13536890
申请日：2012-06-28
申请人： Shayan Malek , Michael B. Wittenberg , Miguel C. Christophy
发明人： Shayan Malek , Michael B. Wittenberg , Miguel C. Christophy
IPC分类号： H05K7/20
CPC分类号： H05K7/205
摘要： An electronic device may have electrical components that generate heat. The components may be mounted on a printed circuit board having a peripheral edge with an edge surface. The edge surface may be coated with a layer of metal. Metal traces in the printed circuit board such as ground plane traces may be used to conduct heat from the electrical components to the layer of metal on the edge surface. The edge surface may be separated from an adjacent thermally conductive electronic device housing structure by an air gap. Thermally conductive elastomeric bumper structures may bridge the air gap between the edge surface of the printed circuit and the housing structure. The thermally conductive elastomeric bumper structures may conduct heat from the layer of metal on the edge surface to the housing structure and may serve as a cushioning interface between the printed circuit and the housing structure.
摘要翻译：电子设备可以具有产生热量的电气部件。组件可以安装在具有边缘表面的外围边缘的印刷电路板上。边缘表面可以涂覆一层金属。印刷电路板中的金属迹线（如接地平面迹线）可用于将热量从电气部件传导到边缘表面上的金属层。边缘表面可以通过气隙与相邻的导热电子器件壳体结构分离。导热弹性保险杠结构可以桥接印刷电路的边缘表面和壳体结构之间的气隙。导热弹性体保险杠结构可以将热量从边缘表面上的金属层传导到壳体结构，并且可以用作印刷电路和壳体结构之间的缓冲界面。

4. 发明申请

US20140002996A1 Thermally Conductive Printed Circuit Board Bumpers 有权
标题翻译：导热印刷电路板缓冲器
公开(公告)号：US20140002996A1
公开(公告)日：2014-01-02
申请号：US13536890
申请日：2012-06-28
申请人： Shayan Malek , Michael B. Wittenberg , Miguel C. Christophy
发明人： Shayan Malek , Michael B. Wittenberg , Miguel C. Christophy
IPC分类号： H05K7/20
CPC分类号： H05K7/205
摘要： An electronic device may have electrical components that generate heat. The components may be mounted on a printed circuit board having a peripheral edge with an edge surface. The edge surface may be coated with a layer of metal. Metal traces in the printed circuit board such as ground plane traces may be used to conduct heat from the electrical components to the layer of metal on the edge surface. The edge surface may be separated from an adjacent thermally conductive electronic device housing structure by an air gap. Thermally conductive elastomeric bumper structures may bridge the air gap between the edge surface of the printed circuit and the housing structure. The thermally conductive elastomeric bumper structures may conduct heat from the layer of metal on the edge surface to the housing structure and may serve as a cushioning interface between the printed circuit and the housing structure.
摘要翻译：电子设备可以具有产生热量的电气部件。组件可以安装在具有边缘表面的周边边缘的印刷电路板上。边缘表面可以涂覆一层金属。印刷电路板中的金属迹线（如接地平面迹线）可用于将热量从电气部件传导到边缘表面上的金属层。边缘表面可以通过气隙与相邻的导热电子器件壳体结构分离。导热弹性保险杠结构可以桥接印刷电路的边缘表面和壳体结构之间的气隙。导热弹性体保险杠结构可以将热量从边缘表面上的金属层传导到壳体结构，并且可以用作印刷电路和壳体结构之间的缓冲界面。

5. 发明授权

US09058941B2 Floating switch assemblies and methods for making the same 有权
标题翻译：浮动开关组件及其制造方法
公开(公告)号：US09058941B2
公开(公告)日：2015-06-16
申请号：US13589236
申请日：2012-08-20
申请人： Shayan Malek , Miguel C. Christophy , Andriy Pletenetskyy
发明人： Shayan Malek , Miguel C. Christophy , Andriy Pletenetskyy
IPC分类号： H01H1/10 , H01H13/14 , H01H13/20 , H01H1/58
CPC分类号： H01H13/10 , H01H13/06 , H01H13/14 , H01H13/20 , H01H2001/5816 , H01H2207/004 , H01H2215/004 , H01H2215/006 , H01H2223/002 , H01H2223/004 , H01H2223/03 , H01H2223/06 , Y10T29/49105
摘要： Switch assemblies that mitigate stack up variations and methods of making the same are provided. The stack up variations are mitigated by embodiments that use a floating switch design. The floating switch design may eliminate height variations in the stack up by directly mounting an activation assembly to a support bracket. This ensures that the stack up height of the activation assembly and support bracket remain fixed, independent of a flexible printed circuit board (PCB) that may also be secured to the activation assembly. This way, regardless of the thickness of the flexible PCB and any height variations in solder used to secure the flexible PCB to the activation assembly, the stack up height of the activation assembly and support bracket remains fixed.
摘要翻译：提供了减轻堆叠变化的开关组件及其制造方法。堆叠变化由使用浮动开关设计的实施例减轻。浮动开关设计可以通过将启动组件直接安装到支撑架上来消除堆叠中的高度变化。这确保了激活组件和支撑支架的堆叠高度保持固定，而与可以固定到激活组件的柔性印刷电路板（PCB）无关。这样，无论柔性PCB的厚度和用于将柔性PCB固定到激活组件的焊料的任何高度变化，激活组件和支撑支架的堆叠高度保持固定。

6. 发明申请

US20140048400A1 FLOATING SWITCH ASSEMBLIES AND METHODS FOR MAKING THE SAME 有权
标题翻译：浮动开关组件及其制造方法
公开(公告)号：US20140048400A1
公开(公告)日：2014-02-20
申请号：US13589236
申请日：2012-08-20
申请人： Shayan Malek , Miguel C. Christophy , Andriy Pletenetskyy
发明人： Shayan Malek , Miguel C. Christophy , Andriy Pletenetskyy
IPC分类号： H01H1/00 , H01H11/00
CPC分类号： H01H13/10 , H01H13/06 , H01H13/14 , H01H13/20 , H01H2001/5816 , H01H2207/004 , H01H2215/004 , H01H2215/006 , H01H2223/002 , H01H2223/004 , H01H2223/03 , H01H2223/06 , Y10T29/49105
摘要： Switch assemblies that mitigate stack up variations and methods of making the same are provided. The stack up variations are mitigated by embodiments that use a floating switch design. The floating switch design may eliminate height variations in the stack up by directly mounting an activation assembly to a support bracket. This ensures that the stack up height of the activation assembly and support bracket remain fixed, independent of a flexible printed circuit board (PCB) that may also be secured to the activation assembly. This way, regardless of the thickness of the flexible PCB and any height variations in solder used to secure the flexible PCB to the activation assembly, the stack up height of the activation assembly and support bracket remains fixed.
摘要翻译：提供了减轻堆叠变化的开关组件及其制造方法。堆叠变化由使用浮动开关设计的实施例减轻。浮动开关设计可以通过将启动组件直接安装到支撑架上来消除堆叠中的高度变化。这确保了激活组件和支撑支架的堆叠高度保持固定，而与可以固定到激活组件的柔性印刷电路板（PCB）无关。这样，无论柔性PCB的厚度和用于将柔性PCB固定到激活组件的焊料的任何高度变化，激活组件和支撑支架的堆叠高度保持固定。

7. 发明申请

US20130344352A1 Battery Protection Structures 有权
标题翻译：电池保护结构
公开(公告)号：US20130344352A1
公开(公告)日：2013-12-26
申请号：US13530641
申请日：2012-06-22
申请人： Shayan Malek , Miguel C. Christophy , Jared M. Kole
发明人： Shayan Malek , Miguel C. Christophy , Jared M. Kole
IPC分类号： H01M2/02 , H01M2/00
CPC分类号： H01M2/10 , H01M2/0212 , H01M2/1005 , H01M2/1094 , H01M2/34 , H01M10/425
摘要： A battery may have a foil battery pack with leads that are coupled to a printed circuit board. Battery protection structures formed from an insulating material such as plastic may be used to protect the foil battery pack. The foil battery pack may have a rectangular shape with front and rear faces surrounded by a rectangular peripheral edge. The battery protection structures may have a ring shape that surrounds the peripheral edge while leaving the front and rear faces exposed to minimize the size of the battery protection structures. An elastomeric material may be used to form the battery protection structures. The elastomeric material may allow the battery protection structures to stretch when the battery pack expands during use. Two shots of plastic may be incorporated into the battery protection structures to provide both puncture resistance and the ability to stretch during use.
摘要翻译：电池可以具有箔片电池组，其具有耦合到印刷电路板的引线。可以使用由诸如塑料的绝缘材料形成的电池保护结构来保护箔片电池组。箔片电池组可以具有矩形形状，其前表面和后表面被矩形周边边缘包围。电池保护结构可以具有围绕周边边缘的环形，同时使前表面和背面暴露以最小化电池保护结构的尺寸。可以使用弹性体材料来形成电池保护结构。当电池组在使用期间膨胀时，弹性体材料可以允许电池保护结构拉伸。电池保护结构中可以并入两束塑料，以提供使用时的抗刺穿性和拉伸能力。

8. 发明授权

US08808895B2 Battery protection structures 有权
标题翻译：电池保护结构
公开(公告)号：US08808895B2
公开(公告)日：2014-08-19
申请号：US13530641
申请日：2012-06-22
申请人： Shayan Malek , Miguel C. Christophy , Jared M. Kole
发明人： Shayan Malek , Miguel C. Christophy , Jared M. Kole
IPC分类号： H01M2/10
CPC分类号： H01M2/10 , H01M2/0212 , H01M2/1005 , H01M2/1094 , H01M2/34 , H01M10/425
摘要： A battery may have a foil battery pack with leads that are coupled to a printed circuit board. Battery protection structures formed from an insulating material such as plastic may be used to protect the foil battery pack. The foil battery pack may have a rectangular shape with front and rear faces surrounded by a rectangular peripheral edge. The battery protection structures may have a ring shape that surrounds the peripheral edge while leaving the front and rear faces exposed to minimize the size of the battery protection structures. An elastomeric material may be used to form the battery protection structures. The elastomeric material may allow the battery protection structures to stretch when the battery pack expands during use. Two shots of plastic may be incorporated into the battery protection structures to provide both puncture resistance and the ability to stretch during use.
摘要翻译：电池可以具有箔片电池组，其具有耦合到印刷电路板的引线。可以使用由诸如塑料的绝缘材料形成的电池保护结构来保护箔片电池组。箔片电池组可以具有矩形形状，其前表面和后表面被矩形周边边缘包围。电池保护结构可以具有围绕周边边缘的环形，同时使前表面和背面暴露以最小化电池保护结构的尺寸。可以使用弹性体材料来形成电池保护结构。当电池组在使用期间膨胀时，弹性体材料可以允许电池保护结构拉伸。可以将两束塑料引入电池保护结构中以提供抗穿刺性和在使用过程中拉伸的能力。

9. 发明授权

US09077795B2 Latch mechanism device and methods of use 有权
标题翻译：锁定机构装置及使用方法
公开(公告)号：US09077795B2
公开(公告)日：2015-07-07
申请号：US13421487
申请日：2012-03-15
申请人： Bryan P. Kiple , Michael B. Wittenberg , Shayan Malek
发明人： Bryan P. Kiple , Michael B. Wittenberg , Shayan Malek
IPC分类号： H05K7/14 , H04M1/02 , F16B21/18
CPC分类号： H04M1/0277 , F16B21/186 , Y10T24/45262 , Y10T24/45623 , Y10T24/45984 , Y10T29/49826
摘要： Latch mechanism devices for attaching components within a device and methods of use are provided herein. In one aspect, the latch mechanism includes a pair of deflectable members between which a protruding latch member, such as a latch pin, is inserted thereby separating the deflectable members. A latch pin can have a distal insertion portion and a proximal locking portion, the locking portion having a reduced profile so as to resiliently receive the deflectable members displaced by insertion of the latch pin so as to couple the latch pin between the cords. The latch pin can have insertion faces and locking faces angled so as to control the force required to insert and retract the latch pin from the cord pair. The latch mechanism may utilize releasing mechanisms for separating or reducing tension in the deflectable members to facilitate retraction of the latch pin.
摘要翻译：本文提供了用于附接装置内的部件的锁定机构装置和使用方法。在一个方面，闩锁机构包括一对可偏转构件，在其间插入突出的闩锁构件，例如闩锁销，由此分离可偏转构件。闩锁销可以具有远侧插入部分和近侧锁定部分，锁定部分具有减小的轮廓，以便弹性地接收通过插入闩锁销移动的可偏转部件，从而将闩锁销连接在电线之间。闩锁销可以具有成角度的插入面和锁定面，以便控制将插销从线对插入和缩回所需的力。闩锁机构可以利用用于分离或减小可偏转构件中的张力的释放机构，以便于闩锁销的缩回。

10. 发明申请

US20140055961A1 Printed Circuit Boards with Recesses 审中-公开
标题翻译：具有凹版印刷电路板
公开(公告)号：US20140055961A1
公开(公告)日：2014-02-27
申请号：US13593352
申请日：2012-08-23
申请人： Shayan Malek , Nicholas G. L. Merz , Michael B. Wittenberg
发明人： Shayan Malek , Nicholas G. L. Merz , Michael B. Wittenberg
IPC分类号： H05K3/34 , H05K3/46 , H05K7/00
CPC分类号： H05K3/1216 , H05K1/183 , H05K3/1225 , H05K3/3436 , H05K3/3484 , H05K2201/09036 , Y10T29/49144 , Y10T29/49155
摘要： Printed circuit boards are provided with recess-mounted components. The components may be mounted within recesses in the surface of a printed circuit board substrate that are larger than the component. A solder stencil may be used to mount the components in a recess. The solder stencil may have curved portions between a planar portion and a depressed portion. The difference in the lateral width of the recess and the lateral width of the component may be configured to allow the planar portion and the depressed portion to be placed against the surface of the printed circuit board without damaging edges of the recess during solder application processes. The recess may be formed by placing a dummy component having a size and shape that is larger than the size and shape of the recess-mounted component against a portion of the printed circuit board during board formation operations.
摘要翻译：印刷电路板设有凹槽安装部件。组件可以安装在印刷电路板基板的大于该部件的表面中的凹部内。可以使用焊接模板将组件安装在凹槽中。焊料模板可以在平坦部分和凹陷部分之间具有弯曲部分。凹部的横向宽度和部件的横向宽度的差异可以被配置为允许平面部分和凹陷部分抵靠印刷电路板的表面放置，而不会在焊接应用过程中损坏凹部的边缘。可以通过在板形成操作期间将具有大于凹入安装部件的尺寸和形状的尺寸和形状放置在印刷电路板的一部分上的方式来形成凹部。

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