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    • 6. 发明授权
    • Method for selecting a substrate intended for use in a cutting operation
    • 选择用于切割操作的基板的方法
    • US5961766A
    • 1999-10-05
    • US62206
    • 1998-04-17
    • Eng-Pi ChangYao-Feng Wang
    • Eng-Pi ChangYao-Feng Wang
    • G01N3/24G01N19/04B32B31/14B32B31/18G01N3/00G01N3/08
    • G01N3/24G01N19/04Y10T156/1052Y10T156/1082
    • This invention relates to a method for selecting a substrate intended for use in a cutting operation. The method is particularly suitable for selecting facestock materials intended for use in making pressure-sensitive adhesive (PSA) constructions such as PSA labels. The method includes the following steps (A)-(D). Step (A) involves cutting the substrate during a first cutting step to form at least two shapes in the substrate. The shapes are positioned in spaced relationship to each other. A matrix is formed during this cutting step. The matrix is the waste substrate material around the shapes. Step (B) involves cutting the substrate with a second cutting step to form a test sample. The test sample is comprised of part of one shape, part of the next adjacent shape, and the matrix around the shape parts. Step (C) involves separating the matrix from the shape parts while measuring the force required to separate the matrix from the shape parts and measuring the displacement of the separating force. Step (D) involves determining the friction energy required to separate the matrix from the shape parts. The selection of the substrate is dependent on the friction energy.
    • 本发明涉及一种选择用于切割操作的基板的方法。 该方法特别适用于选择用于制造PSA标签等压敏粘合剂(PSA)结构的面材。 该方法包括以下步骤(A) - (D)。 步骤(A)涉及在第一切割步骤期间切割基底以在基底中形成至少两种形状。 形状彼此间隔开。 在该切割步骤期间形成矩阵。 矩阵是形状周围的废弃基材。 步骤(B)涉及用第二切割步骤切割基底以形成测试样品。 测试样品由一部分形状,下一个相邻形状的一部分和围绕形状部分的基体组成。 步骤(C)涉及将基体与形状部分分开,同时测量将基体与形状部分离开并测量分离力的位移所需的力。 步骤(D)涉及确定将矩阵与形状部分分离所需的摩擦能。 衬底的选择取决于摩擦能。