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    • 3. 发明授权
    • Organic solvent dispersed nano-talc slurry
    • 有机溶剂分散纳米滑石浆
    • US07249723B2
    • 2007-07-31
    • US11018946
    • 2004-12-21
    • Jianhong HeQiping ZhongSrikanth Raghunathan
    • Jianhong HeQiping ZhongSrikanth Raghunathan
    • B02C19/00
    • C09C1/28B02C23/06B82Y30/00C01B33/22C01B33/38C01P2004/04C01P2004/20C01P2004/62C01P2004/64C01P2006/12C08K3/34C08K2201/011C09C1/021C09C1/405C09C1/407C09C1/42C09C3/04C09C3/041Y10S977/888Y10S977/90
    • The invention provides high surface area talc compositions by a novel hybrid milling method or soaking method. The hybrid milling method comprises dry milling talc powder followed by mixing with water and wet milling to provide a nano-talc slurry with high surface area, also of the invention. The soaking method comprises dry milling talc powder followed by mixing with water and soaking to provide high surface area nano-talc slurry. The slurry may be dewatered and dried to provide dry nano-talc powder. The nano-talc powder provided by the invention is a novel hydrophilic talc composition. Further embodiments of the invention include organic solvent dispersed nano-talc slurries and methods for providing the same. These slurries can be used to provide polymer nano-talc composites in the form of coatings, sealing and gasketing materials, foams, extruded thermoplastic and thermoset sheets and films, thermoplastic pellets, thermoplastic and thermoset molded polymer composite articles. Another embodiment is a polyurethane nano-talc composite article derived from the organic solvent dispersed slurries.
    • 本发明通过新的混合研磨方法或浸泡方法提供高表面积的滑石组合物。 混合研磨方法包括干磨滑石粉,然后与水混合并进行湿磨以提供具有高表面积的纳米滑石浆料,也是本发明的。 浸泡方法包括干磨滑石粉,随后与水混合并浸泡以提供高表面积的纳米滑石浆料。 可将浆料脱水并干燥以提供干燥的纳米滑石粉末。 本发明提供的纳米滑石粉是一种新型亲水滑石组合物。 本发明的其它实施方案包括有机溶剂分散的纳米滑石浆料及其提供方法。 这些浆料可用于提供涂料,密封和填料材料,泡沫,挤出的热塑性塑料和热固性片材和薄膜,热塑性颗粒,热塑性和热固性模塑聚合物复合制品形式的聚合物纳米滑石复合材料。 另一个实施方案是衍生自分散有机溶剂浆料的聚氨酯纳米滑石复合制品。
    • 6. 发明申请
    • Method For Manufacturing Wraparound Shield Write Head Using Hard Masks
    • 使用硬掩模制造绕组屏蔽写头的方法
    • US20130026131A1
    • 2013-01-31
    • US13193520
    • 2011-07-28
    • Shiwen HuangFenglin LiuQiping ZhongKyusik ShinYingjian Chen
    • Shiwen HuangFenglin LiuQiping ZhongKyusik ShinYingjian Chen
    • G11B5/127
    • G11B5/3116G11B5/3163
    • The present disclosure describes a method for manufacturing a full wraparound shield damascene write head through the implementation of a three layered (tri-layered) hard mask. According to an embodiment of the invention, the various layers of hard mask are used for different purposes during the formation of a write head. The wraparound shield head of the present invention exhibits improved physical characteristics that further result in improved performance characteristics. Use of the hard mask layers according to the present invention allows for use of manufacturing processes that can be more closely controlled than those processes used in other processes. For example, smaller dimension lithographic techniques can be used. Also, reliance on certain CMP processes is not necessary where the use of CMP processes is not as well-controlled as deposition or lithographic techniques as is possible using the present invention.
    • 本公开描述了通过实施三层(三层)硬掩模制造全封装屏蔽镶嵌写头的方法。 根据本发明的实施例,在形成写入头期间,各种硬掩模层用于不同的目的。 本发明的环绕式屏蔽头表现出改进的物理特性,进一步导致改善的性能特征。 根据本发明的硬掩模层的使用允许使用可以比其它工艺中使用的那些方法更加严格地控制的制造工艺。 例如,可以使用较小尺寸的光刻技术。 此外,在使用CMP工艺不如使用本发明可能的沉积或光刻技术那样不受控制的情况下,对某些CMP工艺的依赖是不必要的。