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1. 发明申请

US20140069878A1 RACKING SYSTEM FOR SUPPORTING PHOTOVOLTAIC MODULE MOUNTING AND METHODS OF ITS USE 审中-公开
标题翻译：用于支持光伏模块安装的支架系统及其使用方法
公开(公告)号：US20140069878A1
公开(公告)日：2014-03-13
申请号：US13607917
申请日：2012-09-10
申请人： Max William Reed , Daniel Joshua Hipwood
发明人： Max William Reed , Daniel Joshua Hipwood
IPC分类号： F24J2/52 , B23Q3/00
CPC分类号： F24S25/12 , F24S25/13 , F24S2025/014 , Y02B10/20 , Y02E10/47 , Y10T29/49895
摘要： Racking systems for supporting a photovoltaic module are provided. The racking system includes a support lip; a lower retaining wall substantially oriented in a retaining plane and extending from the lower retaining wall; a lower support wall substantially oriented in a support plane and positioned on an opposite side of the lower retaining wall than the support lip; and an upper support wall substantially oriented in the support plane. The lower retaining wall and the lower support wall are joined together by a resting rail to define a retaining groove therebetween. Methods are also provided for mounting a photovoltaic module onto a racking system.
摘要翻译：提供了用于支撑光伏模块的货架系统。货架系统包括支撑唇; 下保持壁基本上定向在保持平面中并且从下保持壁延伸; 下支撑壁基本上定位在支撑平面中，并且位于下保持壁的与支撑唇缘相反的一侧上; 以及基本上在支撑平面中定向的上支撑壁。下保持壁和下支撑壁通过搁置轨道连接在一起，以在其间限定保持槽。还提供了用于将光伏模块安装到货架系统上的方法。

2. 发明申请

US20130153004A1 JUNCTION BOX WITH A SUPPORT MEMBER FOR THIN FILM PHOTOVOLTAIC DEVICES AND THEIR METHODS OF MANUFACTURE 审中-公开
标题翻译：具有薄膜光伏器件支持部件的接线盒及其制造方法
公开(公告)号：US20130153004A1
公开(公告)日：2013-06-20
申请号：US13326945
申请日：2011-12-15
申请人： Jeffrey Todd Knapp , Max William Reed , Loucas Tsakalakos , Jeffrey Scott Erlbaum
发明人： Jeffrey Todd Knapp , Max William Reed , Loucas Tsakalakos , Jeffrey Scott Erlbaum
IPC分类号： H01L31/048 , H01R43/20
CPC分类号： H01L31/02013 , H01R13/5219 , H02S40/34 , Y02E10/50 , Y10T29/49208
摘要： Photovoltaic devices are generally provided that can include, in one particular embodiment, a transparent substrate; a plurality of thin film layers defining a plurality of photovoltaic cells connected in series to each other on the transparent substrate; a first lead connected to one of the photovoltaic cells; and, an encapsulation substrate on the plurality of thin film layers. The encapsulation substrate can generally define a back surface and a connection aperture through which the first lead extends. A junction box can be positioned over the connection aperture and connected to the first lead. The junction box generally comprises a support member extending through the connection aperture to mechanically support the transparent substrate in an area opposite to the connection aperture. Methods and kits are also generally provided.
摘要翻译：通常提供光伏器件，其在一个具体实施例中可以包括透明衬底; 多个薄膜层，限定在所述透明基板上彼此串联连接的多个光伏电池; 连接到一个光伏电池的第一引线; 以及在所述多个薄膜层上的封装基板。封装基板通常可以限定第一引线延伸穿过的后表面和连接孔。接线盒可以定位在连接孔上并连接到第一个引线。接线盒通常包括延伸穿过连接孔的支撑构件，以在与连接孔相对的区域中机械地支撑透明衬底。还通常提供方法和试剂盒。

3. 发明申请

US20110262712A1 METHOD FOR INCREASING THE WORKING SURFACE AREA OF A PHOTOVOLTAIC (PV) MODULE AND ASSOCIATED SUBSTRATES 审中-公开
标题翻译：增加光伏（PV）模块和相关基板的工作表面面积的方法
公开(公告)号：US20110262712A1
公开(公告)日：2011-10-27
申请号：US12765340
申请日：2010-04-22
申请人： Edwin Jackson Little , Max William Reed , Jason Scott Paulman
发明人： Edwin Jackson Little , Max William Reed , Jason Scott Paulman
IPC分类号： B32B3/00 , B23K26/00
CPC分类号： H01L31/0463 , Y02E10/50 , Y10T428/24612
摘要： A method for processing substrates in the formation of photovoltaic (PV) modules, the substrates having a plurality of thin film layers deposited thereon. The method includes determining the geometric center of the substrate and performing subsequent processing steps for defining individual cells on the substrate using the geometric center of the substrate as a starting reference point for such processing steps.
摘要翻译：一种用于在形成光伏（PV）模块中处理衬底的方法，所述衬底具有沉积在其上的多个薄膜层。该方法包括确定衬底的几何中心并执行随后的处理步骤，用于使用衬底的几何中心定义衬底上的各个单元作为用于这些处理步骤的起始参考点。

4. 发明授权

US08481355B2 Modular system and process for continuous deposition of a thin film layer on a substrate 有权
标题翻译：用于在衬底上连续沉积薄膜层的模块化系统和工艺
公开(公告)号：US08481355B2
公开(公告)日：2013-07-09
申请号：US12638687
申请日：2009-12-15
申请人： Mark Jeffrey Pavol , Russell Weldon Black , Brian Robert Murphy , Christopher Rathweg , Edwin Jackson Little , Max William Reed
发明人： Mark Jeffrey Pavol , Russell Weldon Black , Brian Robert Murphy , Christopher Rathweg , Edwin Jackson Little , Max William Reed
IPC分类号： H01L21/00
CPC分类号： H01L31/186 , C23C14/568 , C23C16/54 , H01L31/1828 , H01L31/1864 , Y02E10/543 , Y02P70/521
摘要： A system and associated process for vapor deposition of a thin film layer on a photovoltaic (PV) module substrate is includes establishing a vacuum chamber and introducing the substrates individually into the vacuum chamber. A conveyor system is operably disposed within the vacuum chamber and is configured for conveying the substrates in a serial arrangement through a vapor deposition apparatus within the vacuum chamber at a controlled constant linear speed. A post-heat section is disposed within the vacuum chamber immediately downstream of the vapor deposition apparatus in the conveyance direction of the substrates. The post-heat section is configured to maintain the substrates conveyed from the vapor deposition apparatus in a desired heated temperature profile until the entire substrate has exited the vapor deposition apparatus.
摘要翻译：用于在光伏（PV）模块衬底上蒸镀薄膜层的系统和相关工艺包括建立真空室并将衬底单独地引入真空室中。输送系统可操作地设置在真空室内，并且被配置为以一控制的恒定线速度将串联排列的基板通过真空室内的气相沉积设备输送。在真空室内，在基板的输送方向上，在蒸镀装置的正下方配置后热部。后热部被构造成将从蒸镀装置输送的基板保持在期望的加热温度分布，直到整个基板离开蒸镀装置。

5. 发明申请

US20130153003A1 ADHESIVE PLUG FOR THIN FILM PHOTOVOLTAIC DEVICES AND THEIR METHODS OF MANUFACTURE 审中-公开
标题翻译：薄膜光电装置用胶带及其制造方法
公开(公告)号：US20130153003A1
公开(公告)日：2013-06-20
申请号：US13326889
申请日：2011-12-15
申请人： Troy Alan Berens , Bradley Crume , Loucas Tsakalakos , Jeffrey Scott Erlbaum , Max William Reed
发明人： Troy Alan Berens , Bradley Crume , Loucas Tsakalakos , Jeffrey Scott Erlbaum , Max William Reed
IPC分类号： H01L31/048 , H01L31/18
CPC分类号： H01L31/02013 , H02S40/34 , Y02E10/50
摘要： Photovoltaic devices are provided that include: a transparent substrate; a plurality of thin film layers on the glass substrate; and, a first lead connected to one of the photovoltaic cells. An encapsulation substrate can be positioned on the plurality of thin film layers, and defines a connection aperture through which the first lead extends. The connection aperture generally has a perimeter defined by an aperture wall of the encapsulation substrate. An adhesive plug can be positioned within the connection aperture to mechanically support the transparent substrate in the area of the connection aperture. A back plate or back washer can also be bonded to the adhesive plug and/or back surface of the encapsulation substrate to help dissipate energy in and/or provide support to the encapsulation substrate. Methods are also provided for mechanically supporting a transparent substrate in an area opposite to a connection aperture defined in an encapsulation substrate.
摘要翻译：提供了光伏器件，其包括：透明衬底; 玻璃基板上的多个薄膜层; 以及连接到一个光伏电池的第一引线。封装衬底可以定位在多个薄膜层上，并且限定了第一引线延伸通过的连接孔。连接孔通常具有由封装衬底的孔壁限定的周边。粘合塞可以位于连接孔内，以在连接孔的区域中机械地支撑透明基底。背板或后垫圈也可以结合到封装基板的粘合塞和/或后表面，以帮助耗散能量和/或提供对封装基板的支撑。还提供了用于在与封装衬底中限定的连接孔相对的区域中机械地支撑透明衬底的方法。

6. 发明申请

US20130153001A1 SUPPORT INSERT FOR THIN FILM PHOTOVOLTAIC DEVICES AND THEIR METHODS OF MANUFACTURE 审中-公开
标题翻译：薄膜光伏器件的支持插件及其制造方法
公开(公告)号：US20130153001A1
公开(公告)日：2013-06-20
申请号：US13326775
申请日：2011-12-15
申请人： Max William Reed , Jeffrey Todd Knapp , Troy Alan Berens , Venkata Sai Rahul Chandra Abbaraju , Bradley Crume
发明人： Max William Reed , Jeffrey Todd Knapp , Troy Alan Berens , Venkata Sai Rahul Chandra Abbaraju , Bradley Crume
IPC分类号： H01L31/048
CPC分类号： H02S40/34 , F24S25/00 , F24S80/50 , F24S2025/011 , H01L31/02013 , H01R13/5205 , Y02E10/47 , Y02E10/50
摘要： Photovoltaic devices are provided that include: a transparent substrate; a plurality of thin film layers on the glass substrate; and, a first lead connected to one of the photovoltaic cells. An encapsulation substrate is positioned on the plurality of thin film layers, and defines a connection aperture through which the first lead extends. The connection aperture has a perimeter defined by an aperture wall of the encapsulation substrate. A support insert is positioned within the connection aperture to mechanically support the transparent substrate in the area of the connection aperture. The support insert is configured such that the first lead is able to extend through the connection aperture while the support insert in place within the connection aperture. A kit is also provided that includes an encapsulation substrate defining a connection aperture; and, a support insert configured to be coupled within the connection aperture of the encapsulation substrate.
摘要翻译：提供了光伏器件，其包括：透明衬底; 玻璃基板上的多个薄膜层; 以及连接到一个光伏电池的第一引线。封装衬底位于多个薄膜层上，并且限定了第一引线延伸通过的连接孔。连接孔具有由封装衬底的孔壁限定的周边。支撑插入件位于连接孔内，以在连接孔的区域中机械地支撑透明基底。支撑插入件构造成使得第一引线能够延伸穿过连接孔，同时支撑件插入连接孔内的适当位置。还提供了一种套件，其包括限定连接孔的封装衬底; 以及被配置为耦合在所述封装基板的连接孔内的支撑插入件。

7. 发明授权

US08207006B1 Vapor deposition apparatus and process for continuous deposition of a thin film layer on a substrate 有权
公开(公告)号：US08207006B1
公开(公告)日：2012-06-26
申请号：US13447534
申请日：2012-04-16
申请人： Christopher Rathweg , Max William Reed , Mark Jeffrey Pavol
发明人： Christopher Rathweg , Max William Reed , Mark Jeffrey Pavol
IPC分类号： H01L21/00
CPC分类号： C23C14/562 , C23C14/0629 , C23C14/243 , C30B23/005 , H01L31/1836 , Y02E10/50
摘要： An apparatus and related process are provided for vapor deposition of a sublimated source material as a thin film on a photovoltaic (PV) module substrate. A receptacle is disposed within a vacuum head chamber and is configured for receipt of a source material. A heated distribution manifold is disposed below the receptacle and includes a plurality of passages defined therethrough. The receptacle is indirectly heated by the distribution manifold to a degree sufficient to sublimate source material within the receptacle. A molybdenum distribution plate is disposed below the distribution manifold and at a defined distance above a horizontal plane of a substrate conveyed through the apparatus. The molybdenum distribution plate includes a pattern of holes therethrough that further distribute the sublimated source material passing through the distribution manifold onto the upper surface of the underlying substrate. The molybdenum distribution plate includes greater than about 75% by weight molybdenum.

8. 发明申请

US20140060622A1 DIRECT CONNECTION OF LEAD BAR TO CONDUCTIVE RIBBON IN A THIN FILM PHOTOVOLTAIC DEVICE 审中-公开
标题翻译：铅棒直接连接到薄膜光伏器件中的导电性RIBBON
公开(公告)号：US20140060622A1
公开(公告)日：2014-03-06
申请号：US13600846
申请日：2012-08-31
申请人： Kim James Clark , Max William Reed , Bradley Robert Crume , Troy Alan Berens
发明人： Kim James Clark , Max William Reed , Bradley Robert Crume , Troy Alan Berens
IPC分类号： H01L31/048 , H01L31/0203
CPC分类号： H01L31/02008 , H02S40/34 , Y02E10/50
摘要： Thin film photovoltaic devices that include a direct connection to at least one lead bar extending through a connection aperture defined in the encapsulation substrate to electrically connect to an underlying conductive ribbon are provided. The photovoltaic device can include: a transparent substrate; a plurality of photovoltaic cells; a conductive ribbon electrically connected to a photovoltaic cell; an encapsulation substrate laminated to the transparent substrate such that the plurality of photovoltaic cells and the conductive ribbon are positioned between the transparent substrate and the encapsulation substrate; and a lead bar extending through a connection aperture defined in the encapsulation substrate and electrically connected to the conductive ribbon. The lead bar can define a lead tab that establishes a mechanical connection having a biasing force between the lead bar and the conductive ribbon. Methods are also provided for electrically connecting at least one lead to a thin film photovoltaic device.
摘要翻译：提供了薄膜光伏器件，其包括直接连接到至少一个引线条，延伸穿过限定在封装衬底中的连接孔，以电连接到下面的导电带。光伏器件可以包括：透明衬底; 多个光伏电池; 电连接到光伏电池的导电带; 层叠在所述透明基板上的封装基板，使得所述多个光伏电池和所述导电带位于所述透明基板和所述封装基板之间; 以及引导杆，其延伸穿过限定在封装基板中并连接到导电带的连接孔。引导杆可以限定引线片，其建立在引线棒和导电带之间具有偏置力的机械连接。还提供了用于将至少一个引线电连接到薄膜光伏器件的方法。

9. 发明授权

US08597430B2 Modular system and process for continuous deposition of a thin film layer on a substrate 有权
标题翻译：用于在衬底上连续沉积薄膜层的模块化系统和工艺
公开(公告)号：US08597430B2
公开(公告)日：2013-12-03
申请号：US13560155
申请日：2012-07-27
申请人： Mark Jeffrey Pavol , Russell Weldon Black , Brian Robert Murphy , Christopher Rathweg , Edwin Jackson Little , Max William Reed
发明人： Mark Jeffrey Pavol , Russell Weldon Black , Brian Robert Murphy , Christopher Rathweg , Edwin Jackson Little , Max William Reed
IPC分类号： C23C16/54
CPC分类号： C23C14/568
摘要： A system for vapor deposition of a thin film layer on a photovoltaic module substrate is provided. The system includes a vacuum chamber having a pre-heat section, a vapor deposition apparatus, and a cool-down section; and a conveyor system operably disposed within said vacuum chamber and configured for conveying the substrates in a serial arrangement from said pre-heat section and through said vapor deposition apparatus at a controlled constant linear speed. The vapor deposition apparatus is configured for depositing a thin film of a sublimed source material onto an upper surface of the substrates as the substrates are continuously conveyed by said conveyor system through said vapor deposition apparatus.
摘要翻译：提供了一种用于在光伏模块基板上蒸镀薄膜层的系统。该系统包括具有预热部分的真空室，蒸镀装置和冷却部分; 以及输送系统，其可操作地设置在所述真空室内并且构造成用于以受控的恒定线速度从所述预热部分和通过所述蒸镀装置输送串联的基板。蒸镀装置构成为，在基板通过所述蒸镀装置由所述输送系统连续输送时，将升华的源材料的薄膜淀积在基板的上表面。

10. 发明申请

US20130153002A1 SUPPORT INSERT FOR THIN FILM PHOTOVOLTAIC DEVICES AND THEIR METHODS OF MANUFACTURE 审中-公开
标题翻译：薄膜光伏器件的支持插件及其制造方法
公开(公告)号：US20130153002A1
公开(公告)日：2013-06-20
申请号：US13326814
申请日：2011-12-15
申请人： Max William Reed , Bradley Crume , Loucas Tsakalakos , Jeffrey Scott Erlbaum , Troy Alan Berens , Jeffrey Todd Knapp
发明人： Max William Reed , Bradley Crume , Loucas Tsakalakos , Jeffrey Scott Erlbaum , Troy Alan Berens , Jeffrey Todd Knapp
IPC分类号： H01L31/048
CPC分类号： H01L31/02013 , H02S40/34 , Y02E10/50
摘要： Photovoltaic devices that include a transparent substrate; a plurality of thin film layers defining a plurality of photovoltaic cells connected in series to each other on the transparent substrate; a first lead connected to one of the photovoltaic cells; and an encapsulation substrate on the plurality of thin film layers are provided. The encapsulation substrate defines a connection aperture through which the first lead extends. A support insert, which defines a plug portion and a flange, can be positioned within the connection aperture such that the flange extends over the back surface of the encapsulation substrate. The support insert can be configured to mechanically support the transparent substrate in an area opposite to the connection aperture while still enabling the first lead to extend through the connection aperture while the support insert is in place within the connection aperture.
摘要翻译：包括透明基板的光伏器件; 多个薄膜层，限定在所述透明基板上彼此串联连接的多个光伏电池; 连接到一个光伏电池的第一引线; 并且设置在多个薄膜层上的封装基板。封装基板限定了第一引线延伸通过的连接孔。限定塞子部分和凸缘的支撑插入件可以定位在连接孔内，使得凸缘延伸在封装基板的背面上。支撑插入件可以被配置为在与连接孔相对的区域中机械地支撑透明基板，同时仍允许第一引线延伸穿过连接孔，同时支撑插件在连接孔内就位。

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