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    • 1. 发明申请
    • DIRECT CONNECTION OF LEAD BAR TO CONDUCTIVE RIBBON IN A THIN FILM PHOTOVOLTAIC DEVICE
    • 铅棒直接连接到薄膜光伏器件中的导电性RIBBON
    • US20140060622A1
    • 2014-03-06
    • US13600846
    • 2012-08-31
    • Kim James ClarkMax William ReedBradley Robert CrumeTroy Alan Berens
    • Kim James ClarkMax William ReedBradley Robert CrumeTroy Alan Berens
    • H01L31/048H01L31/0203
    • H01L31/02008H02S40/34Y02E10/50
    • Thin film photovoltaic devices that include a direct connection to at least one lead bar extending through a connection aperture defined in the encapsulation substrate to electrically connect to an underlying conductive ribbon are provided. The photovoltaic device can include: a transparent substrate; a plurality of photovoltaic cells; a conductive ribbon electrically connected to a photovoltaic cell; an encapsulation substrate laminated to the transparent substrate such that the plurality of photovoltaic cells and the conductive ribbon are positioned between the transparent substrate and the encapsulation substrate; and a lead bar extending through a connection aperture defined in the encapsulation substrate and electrically connected to the conductive ribbon. The lead bar can define a lead tab that establishes a mechanical connection having a biasing force between the lead bar and the conductive ribbon. Methods are also provided for electrically connecting at least one lead to a thin film photovoltaic device.
    • 提供了薄膜光伏器件,其包括直接连接到至少一个引线条,延伸穿过限定在封装衬底中的连接孔,以电连接到下面的导电带。 光伏器件可以包括:透明衬底; 多个光伏电池; 电连接到光伏电池的导电带; 层叠在所述透明基板上的封装基板,使得所述多个光伏电池和所述导电带位于所述透明基板和所述封装基板之间; 以及引导杆,其延伸穿过限定在封装基板中并连接到导电带的连接孔。 引导杆可以限定引线片,其建立在引线棒和导电带之间具有偏置力的机械连接。 还提供了用于将至少一个引线电连接到薄膜光伏器件的方法。
    • 2. 发明授权
    • Direct connection of lead bar to conductive ribbon in a thin film photovoltaic device
    • 在薄膜光伏器件中将引线直接连接到导电带
    • US09331631B2
    • 2016-05-03
    • US13600815
    • 2012-08-31
    • Kim James ClarkMax William ReedBradley Robert CrumeTroy Alan Berens
    • Kim James ClarkMax William ReedBradley Robert CrumeTroy Alan Berens
    • H01L31/05H01L31/02H02S40/34
    • H02S40/34
    • Thin film photovoltaic devices that include at least one lead bar extending through a connection aperture defined in the encapsulation substrate are provided. The photovoltaic device can include: a transparent substrate; a plurality of photovoltaic cells on the transparent substrate; a first conductive ribbon electrically connected to a first photovoltaic cell; an encapsulation substrate laminated to the transparent substrate such that the plurality of photovoltaic cells and the conductive ribbon are positioned between the transparent substrate and the encapsulation substrate; and, a first lead bar extending through a first connection aperture defined in the encapsulation substrate. The first lead bar is electrically connected to the first conductive ribbon. For example, a meltable conductive material can be connected to the first lead bar and to the first conductive ribbon to establish an electrical connection therebetween. Methods are also provided for electrically connecting a lead to a thin film photovoltaic device.
    • 提供包括延伸穿过限定在封装衬底中的连接孔的至少一个引线的薄膜光伏器件。 光伏器件可以包括:透明衬底; 在所述透明基板上的多个光伏电池; 电连接到第一光伏电池的第一导电带; 层叠在所述透明基板上的封装基板,使得所述多个光伏电池和所述导电带位于所述透明基板和所述封装基板之间; 以及延伸穿过限定在封装衬底中的第一连接孔的第一引线。 第一导杆与第一导电带电连接。 例如,可熔融的导电材料可以连接到第一引线和第一导电带以在它们之间形成电连接。 还提供了用于将引线电连接到薄膜光伏器件的方法。
    • 3. 发明申请
    • DIRECT CONNECTION OF LEAD BAR TO CONDUCTIVE RIBBON IN A THIN FILM PHOTOVOLTAIC DEVICE
    • 铅棒直接连接到薄膜光伏器件中的导电性RIBBON
    • US20140060621A1
    • 2014-03-06
    • US13600815
    • 2012-08-31
    • Kim James ClarkMax William ReedBradley Robert CrumeTroy Alan Berens
    • Kim James ClarkMax William ReedBradley Robert CrumeTroy Alan Berens
    • H01L31/05H01L31/18
    • H02S40/34
    • Thin film photovoltaic devices that include at least one lead bar extending through a connection aperture defined in the encapsulation substrate are provided. The photovoltaic device can include: a transparent substrate; a plurality of photovoltaic cells on the transparent substrate; a first conductive ribbon electrically connected to a first photovoltaic cell; an encapsulation substrate laminated to the transparent substrate such that the plurality of photovoltaic cells and the conductive ribbon are positioned between the transparent substrate and the encapsulation substrate; and, a first lead bar extending through a first connection aperture defined in the encapsulation substrate. The first lead bar is electrically connected to the first conductive ribbon. For example, a meltable conductive material can be connected to the first lead bar and to the first conductive ribbon to establish an electrical connection therebetween. Methods are also provided for electrically connecting a lead to a thin film photovoltaic device.
    • 提供包括延伸穿过限定在封装衬底中的连接孔的至少一个引线的薄膜光伏器件。 光伏器件可以包括:透明衬底; 在所述透明基板上的多个光伏电池; 电连接到第一光伏电池的第一导电带; 层叠在所述透明基板上的封装基板,使得所述多个光伏电池和所述导电带位于所述透明基板和所述封装基板之间; 以及延伸穿过限定在封装衬底中的第一连接孔的第一引线。 第一导杆与第一导电带电连接。 例如,可熔融的导电材料可以连接到第一引线和第一导电带以在它们之间形成电连接。 还提供了用于将引线电连接到薄膜光伏器件的方法。
    • 10. 发明授权
    • Intra-laminate disk layer for thin film photovoltaic devices and their methods of manufacture
    • 用于薄膜光伏器件的层间盘片层及其制造方法
    • US08513516B2
    • 2013-08-20
    • US12870013
    • 2010-08-27
    • Troy Alan Berens
    • Troy Alan Berens
    • H01L31/0203
    • H01L31/02013H01L31/046H01L31/0465H02S40/34Y02E10/50
    • Photovoltaic devices including an insulating layer and an intra-laminate disk layer on a plurality of thin film layers are provided. A first conductive strip, defining a first lead, is positioned on the insulating layer and connected to a first bus bar. A second conductive strip is positioned on the insulating layer and connected to a second bus bar. An adhesive layer is over the device and defines an adhesive gap through which the first lead and the second lead extend. An encapsulating substrate is on the adhesive layer, and defines a connection aperture through which the first lead and the second lead extend. The intra-laminate disk layer is positioned under the adhesive gap defined by the adhesive layer and the connection aperture defined by the encapsulating substrate.Methods of manufacturing photovoltaic devices are also provided.
    • 提供了包括多个薄膜层上的绝缘层和层叠内层叠层的光伏器件。 限定第一引线的第一导电条定位在绝缘层上并连接到第一汇流条。 第二导电带位于绝缘层上并连接到第二母线。 粘合剂层在装置上方并且限定粘合剂间隙,第一引线和第二引线通过该间隙延伸。 封装衬底位于粘合剂层上,并且限定了第一引线和第二引线延伸穿过的连接孔。 层压间盘片层位于由粘合层限定的粘合间隙和由封装衬底限定的连接孔之下。 还提供了制造光伏器件的方法。