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1. 发明申请

US20030188428A1 Removable film, a substrate with film, a process for forming the removable film and a process for the manufacturing of the circuit board 失效
公开(公告)号：US20030188428A1
公开(公告)日：2003-10-09
申请号：US10401607
申请日：2003-03-31
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
发明人： Fumio Echigo , Hideki Higashitani , Daizo Andoh , Noritake Fukuda , Yasuhiro Nakatani , Tadashi Nakamura
IPC分类号： H01K003/10 , B29C035/08 , C08J007/04
CPC分类号： H05K3/4069 , H05K3/0032 , H05K3/20 , H05K3/386 , H05K2201/0112 , H05K2201/0116 , H05K2201/0355 , H05K2203/0191 , H05K2203/1461 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165 , Y10T29/49172
摘要： Removable mask films 303 are formed on the both sides of the substrate having the adhesive layer 302 by applying and drying a resin varnish 304 including a ultraviolet-absorbing agent, and fine through holes 306 are formed by using a third harmonics YAG solid-state laser light with a relatively short wavelength not longer than that in the ultraviolet range in such a way that the effects of such a residual strain as the conventional embodiment forming a removable mask film by a laminating process may be decreased as well as the more fine hole drilling compared with conventional embodiment using the carbon dioxide gas laser with a relatively long wavelength may be performed.

2. 发明申请

US20020182804A1 Capacitor sheet, method for producing the same, board with built-in capacitors, and semiconductor device 失效
标题翻译：电容器片，其制造方法，具有内置电容器的板和半导体器件
公开(公告)号：US20020182804A1
公开(公告)日：2002-12-05
申请号：US10155700
申请日：2002-05-24
申请人： Matsushita Electric Industrial Co. Ltd.
发明人： Fumio Echigo , Tadashi Nakamura , Daizo Andoh
IPC分类号： H01L021/8242
CPC分类号： H05K1/162 , H01L28/60 , H05K1/141 , H05K3/4069 , H05K3/429 , H05K2201/09309 , H05K2201/09581
摘要： A capacitor sheet includes a laminate sheet, interface-connection feedthrough conductors for electrically connecting faces of the laminate sheet, and capacitor-connection feedthrough conductors. The laminate sheet has at least one laminate which is composed of a power source layer electrode, a grounding layer electrode, and a dielectric layer interposed between the power source layer electrode and the grounding layer electrode. The interface-connection feedthrough conductors are formed in through holes that pass through the dielectric layer, the power source layer electrode, and the grounding layer electrode, and are insulated by insulation walls from the power source layer electrode and the grounding layer electrode provided inside. The capacitor-connection feedthrough conductors are formed in regions where only either the power source layer electrode or the grounding layer electrode is provided, and are connected electrically with either the power source layer electrode or the grounding layer electrode. This configuration makes the electric connection for employing the capacitors and the electric connection between faces of the sheet independent from each other. Thus, it is possible to provide a capacitor sheet in which the adverse effects of inductances of vias are minimized.
摘要翻译：电容器片包括层压片，用于电连接层压片的表面的接口连接馈通导体和电容器连接馈通导体。层叠片具有至少一层由电源层电极，接地层电极和插在电源层电极和接地层电极之间的电介质层构成的层叠体。界面连接馈通导体形成在穿过电介质层，电源层电极和接地层电极的通孔中，并且由设置在内部的电源层电极和接地层电极的绝缘壁绝缘。电容器连接馈通导体形成在仅设置电源层电极或接地层电极的区域中，并且与电源层电极或接地层电极电连接。这种构造使得用于采用电容器的电连接和片材的面之间的电连接彼此独立。因此，可以提供一种电容器片，其中通孔的电感的不利影响被最小化。

3. 发明申请

US20040184775A1 Recording/reproducing apparatus, recording/reproducing method, computer program providing medium, and recording medium 审中-公开
标题翻译：记录/再现装置，记录/再现方法，计算机程序提供介质和记录介质
公开(公告)号：US20040184775A1
公开(公告)日：2004-09-23
申请号：US10767068
申请日：2004-01-28
申请人： Matsushita Electric Industrial Co., Ltd.
发明人： Tadashi Nakamura , Yasumori Hino , Yasuyuki Kurosawa
IPC分类号： H04N005/781
CPC分类号： H04N21/42646 , G11B27/034 , G11B27/105 , G11B27/329 , G11B2220/20 , G11B2220/216 , G11B2220/2575 , H04N5/781 , H04N5/85 , H04N9/8042 , H04N21/42661 , H04N21/4334
摘要： There is provided file management capable of recovering a reference relationship easily even when a path name is changed while a file is being referred to using the path name. In a recording/reproducing apparatus for managing information to be recorded/reproduced as files, using file system information having a directory hierarchical structure that can be referred to by a path name, and managing directories and files, using contents management information containing object management information referred to by object reference information on the path name, when information on a recording medium is updated by a recording/reproducing part, information on the update (e.g., a unique ID) is recorded in both the file system information and the object management information.
摘要翻译：即使在使用路径名称引用文件的同时更改路径名时，也提供能够容易地恢复参考关系的文件管理。在用于管理要作为文件记录/再现的信息的记录/再现装置中，使用具有可由路径名称引用的目录层次结构的文件系统信息，以及管理目录和文件，使用包含对象管理信息的内容管理信息当通过记录/再现部分更新记录介质上的信息时，通过对象参考信息关于路径名称来引用关于更新的信息（例如，唯一ID）被记录在文件系统信息和对象管理信息中。

4. 发明申请

US20020029906A1 Removable film, a substrate with film, a process for forming the removable film and a process for the manufacturing of the circuit board 失效
标题翻译：可拆卸膜，具有膜的基板，用于形成可移除膜的工艺以及用于制造电路板的工艺
公开(公告)号：US20020029906A1
公开(公告)日：2002-03-14
申请号：US09734593
申请日：2000-12-13
申请人： Matsushita Electric Industrial Co., Ltd.
发明人： Fumio Echigo , Hideki Higashitani , Daizo Andoh , Noritake Fukuda , Yasuhiro Nakatani , Tadashi Nakamura
IPC分类号： H05K003/36 , H01K003/10 , B23K026/00
CPC分类号： H05K3/4069 , H05K3/0032 , H05K3/20 , H05K3/386 , H05K2201/0112 , H05K2201/0116 , H05K2201/0355 , H05K2203/0191 , H05K2203/1461 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165 , Y10T29/49172
摘要： Removable mask films 303 are formed on the both sides of the substrate having the adhesive layer 302 by applying and drying a resin varnish 304 including a ultraviolet-absorbing agent, and fine through holes 306 are formed by using a third harmonics YAG solid-state laser light with a relatively short wavelength not longer than that in the ultraviolet range in such a way that the effects of such a residual strain as the conventional embodiment forming a removable mask film by a laminating process may be decreased as well as the more fine hole drilling compared with conventional embodiment using the carbon dioxide gas laser with a relatively long wavelength may be performed.
摘要翻译：通过施加和干燥包括紫外线吸收剂的树脂清漆304在具有粘合剂层302的基板的两侧上形成可移除掩模膜303，并且通过使用第三谐波YAG固体激光器形成细小通孔306 具有比紫外线范围内的波长相对较短波长的光可以减少通过层压方法形成可去除掩模膜的这种残留应变的效果以及更细孔钻孔与使用具有较长波长的二氧化碳气体激光器的常规实施例相比可以进行。

5. 发明申请

US20040089471A1 Printed circuit board and method of manufacturing the same 有权
公开(公告)号：US20040089471A1
公开(公告)日：2004-05-13
申请号：US10695302
申请日：2003-10-27
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
发明人： Daizo Andoh , Fumio Echigo , Tadashi Nakamura , Yasuhiro Nakatani , Yoji Ueda , Tousaku Nishiyama , Shozo Ochi
IPC分类号： H05K001/11
CPC分类号： H05K3/4069 , H05K1/0366 , H05K1/0373 , H05K3/4614 , H05K3/462 , H05K3/4652 , H05K2201/0266 , H05K2201/0355 , H05K2201/10378 , H05K2203/0191 , H05K2203/1461 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165 , Y10T428/24917
摘要： The present invention provides a printed circuit board, which includes a dielectric substrate having via holes formed in the thickness direction, and a conductor including a conductive filler is filled in the via holes. The dielectric substrate has patterned wiring layers on both surfaces, and the wiring layers are connected electrically with each other by the conductor. The dielectric substrate is made of a glass cloth or a glass nonwoven fabric impregnated with a thermosetting epoxy resin mixed with fine particles, and the conductive filler in the conductor has an average particle diameter larger than that of the fine particles. Accordingly, the printed circuit board has an improved moisture resistance as a whole and also excellent connection reliability and repair resistance. In addition, the dielectric substrate of the printed circuit board has an improved mechanical strength such as flexural rigidity. The present invention also provides a method of manufacturing such a printed circuit board.

6. 发明申请

US20010052425A1 Printed circuit board and method of manufacturing the same 有权
标题翻译：印刷电路板及其制造方法
公开(公告)号：US20010052425A1
公开(公告)日：2001-12-20
申请号：US09879385
申请日：2001-06-12
申请人： Matsushita Electric Industrial Co., Ltd.,
发明人： Daizo Andoh , Fumio Echigo , Tadashi Nakamura , Yasuhiro Nakatani , Yoji Ueda , Tousaku Nishiyama , Shozo Ochi
IPC分类号： B32B005/00
CPC分类号： H05K3/4069 , H05K1/0366 , H05K1/0373 , H05K3/4614 , H05K3/462 , H05K3/4652 , H05K2201/0266 , H05K2201/0355 , H05K2201/10378 , H05K2203/0191 , H05K2203/1461 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165 , Y10T428/24917
摘要： The present invention provides a printed circuit board, which includes a dielectric substrate having via holes formed in the thickness direction, and a conductor including a conductive filler is filled in the via holes. The dielectric substrate has patterned wiring layers on both surfaces, and the wiring layers are connected electrically with each other by the conductor. The dielectric substrate is made of a glass cloth or a glass nonwoven fabric impregnated with a thermosetting epoxy resin mixed with fine particles, and the conductive filler in the conductor has an average particle diameter larger than that of the fine particles. Accordingly, the printed circuit board has an improved moisture resistance as a whole and also excellent connection reliability and repair resistance. In addition, the dielectric substrate of the printed circuit board has an improved mechanical strength such as flexural rigidity. The present invention also provides a method of manufacturing such a printed circuit board.
摘要翻译：本发明提供了一种印刷电路板，其包括具有沿厚度方向形成的通孔的电介质基板，并且包含导电填料的导体填充在通孔中。电介质基板在两表面上具有图案化的布线层，并且布线层通过导体彼此电连接。电介质基板由玻璃布或浸渍有与微粒混合的热固性环氧树脂的玻璃无纺布制成，并且导体中的导电填料的平均粒径大于微粒的平均粒径。因此，印刷电路板整体上具有改善的耐湿性，并且还具有优异的连接可靠性和修复电阻。此外，印刷电路板的电介质基板具有改善的机械强度，例如弯曲刚度。本发明还提供一种制造这种印刷电路板的方法。

7. 发明申请

US20010026505A1 High density optical disk, apparartus for reproducing optical disk and method for producing optical disk master 失效
标题翻译：高密度光盘，用于再生光盘的装置及其制造方法
公开(公告)号：US20010026505A1
公开(公告)日：2001-10-04
申请号：US09848046
申请日：2001-05-03
申请人： Matsushita Electric Industrial Co., Ltd
发明人： Yasumori Hino , Norio Miyatake , Tadashi Nakamura
IPC分类号： G11B007/095 , G11B007/24
CPC分类号： G11B27/3027 , G11B7/00718 , G11B7/00745 , G11B7/0901 , G11B7/261 , G11B27/19 , Y10S430/146
摘要： An optical disk includes at least one region along a radial direction, and a plurality of tracks provided in the at least one region. The at least one region contains address regions radially positioned on the plurality of tracks. In the address regions, data which is common between two adjacent tracks of the plurality of tracks is recorded at positions aligned along the same radial direction on the two adjacent tracks, and data which is not common between the two adjacent tracks is recorded at positions along different radial directions on the two adjacent tracks.
摘要翻译：光盘包括沿着径向方向的至少一个区域和设置在该至少一个区域中的多个轨道。所述至少一个区域包含位于多个轨道上的径向定位的地址区。在地址区域中，在两个相邻轨道上沿着相同的径向方向对准的位置处记录在多个轨道的两个相邻轨道之间共同的数据，并且在两个相邻轨道之间的位置记录不相同的数据两个相邻轨道上的不同径向方向。

8. 发明申请

US20040231151A1 Multilayer circuit board and method for manufacturing the same 失效
标题翻译：多层电路板及其制造方法
公开(公告)号：US20040231151A1
公开(公告)日：2004-11-25
申请号：US10842900
申请日：2004-05-10
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
发明人： Yasuhiro Nakatani , Hideki Higashitani , Tadashi Nakamura , Fumio Echigo
IPC分类号： H05K001/16 , H05K001/11
CPC分类号： H05K3/4614 , H05K1/113 , H05K3/4069 , H05K3/4652 , H05K2201/0195 , H05K2201/09045 , H05K2201/096 , H05K2201/10378 , H05K2203/068 , H05K2203/1461 , Y10S428/901 , Y10T29/49124 , Y10T29/49126 , Y10T428/24917
摘要： It is an object of the present invention to provide a multilayer circuit board, and a method for manufacturing the same, in which a plurality of circuit boards are layered, wherein as regards at least one circuit board positioned on an outer side, a conductive substance is filled into holes passing through the circuit board in the thickness direction and cured, and the wiring layers of the plurality of circuit boards are electrically connected by the conductive substance that has been cured, wherein in the multilayer circuit board, the wiring layer positioned outside the conductive substance that has been cured projects outward from its surroundings. Thus, the conductive paste is sufficiently compressed during hot pressing to yield a stable electrical connection, and thermosetting resin can be filled in between the inner layer wiring pattern without leaving gaps.
摘要翻译：本发明的目的是提供一种层叠多个电路板的多层电路板及其制造方法，其中至少一个位于外侧的电路板，导电物质填充穿过电路板的厚度方向的孔并固化，并且多个电路板的布线层通过已固化的导电物质电连接，其中在多层电路板中，位于外侧的布线层已经固化的导电物质从其周围向外突出。因此，导热膏在热压期间被充分压缩，从而产生稳定的电连接，并且可以在内层布线图案之间填充热固性树脂，而不会留下间隙。

9. 发明申请

US20040194999A1 Wiring board, method for manufacturing a wiring board and electronic equipment 审中-公开
标题翻译：接线板，制造布线板和电子设备的方法
公开(公告)号：US20040194999A1
公开(公告)日：2004-10-07
申请号：US10816485
申请日：2004-04-01
申请人： Matsushita Electric Industrial Co., Ltd.
发明人： Yoshihiro Tomita , Tadashi Nakamura , Yukihiro Ishimaru , Yasuhiro Sugaya , Kazuyoshi Honda , Sadayuki Okazaki
IPC分类号： H05K001/11 , H05K007/06
CPC分类号： H05K3/4007 , H01L23/49816 , H01L23/49822 , H01L2224/16 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/15174 , H01L2924/15311 , H01L2924/3011 , H01L2924/3025 , H05K1/117 , H05K3/243 , H05K3/28 , H05K3/4069 , H05K3/467 , H05K2201/0367 , H05K2201/0919 , H05K2201/09436 , H05K2201/09709 , H05K2201/09736 , H05K2201/09845 , H05K2203/0733 , H01L2224/0401
摘要： A wiring board that allows the high-density connection with a plurality of circuit boards within a limited area, a manufacturing method for the same and electronic equipment using the same are provided. A wiring board includes: a plurality of conductive layers each including one or more wirings for transmitting signals; and a plurality of insulation layers for insulating the respective conductive layers. The conductive layers and the insulation layers are laminated alternately, and each of the plurality of conductive layers is provided with a terminal at at least one of both ends. The terminals are formed stepwise and separated by the insulation layers in a cross-sectional shape of a lamination structure of the conductive layers and the insulation layers.
摘要翻译：提供了允许在有限区域内与多个电路板进行高密度连接的布线板，其制造方法以及使用该布线板的电子设备。布线板包括：多个导电层，每个导电层包括用于传输信号的一个或多个布线; 以及用于绝缘各导电层的多个绝缘层。导电层和绝缘层交替层叠，并且多个导电层中的每一个在两端中的至少一个处设置有端子。端子形成为阶梯状，并以导电层和绝缘层的叠层结构的横截面形状由绝缘层隔开。

10. 发明申请

US20030174608A1 Information reproducing method and information reproducing device 失效
标题翻译：信息再现方法和信息再现装置
公开(公告)号：US20030174608A1
公开(公告)日：2003-09-18
申请号：US10385881
申请日：2003-03-11
申请人： Matsushita Electric Industrial Co., Ltd.
发明人： Tadashi Nakamura , Yasumori Hino , Norio Miyatake
IPC分类号： G11B007/005
CPC分类号： G11B20/10046 , G11B20/10009 , G11B27/19 , G11B27/24 , G11B27/3027
摘要： An information reproducing device for reproducing digital signals with an optical head from an optical disk includes a first equalizer for waveform-equalizing a reproduction signal, an adaptive learning device for renewing the equalization properties of the first waveform equalizer with an adaptation algorithm, a memory for storing a reproduction signal, a second waveform equalizer that reads signals from the memory and performs waveform equalization after an adaptive learning operation for the first waveform equalizer has been terminated, and a demodulator for demodulating the output of the second waveform equalizer. Thus, adaptive equalization processing can be performed with constantly superior equalization properties and without sacrificing data capacity.
摘要翻译：一种用于从光盘用光学头再现数字信号的信息再现装置包括用于对再现信号进行波形均衡的第一均衡器，用于利用自适应算法更新第一波形均衡器的均衡特性的自适应学习装置，存储再现信号的第二波形均衡器，在第一波形均衡器的自适应学习操作结束之后从存储器读取信号并执行波形均衡的第二波形均衡器，以及用于解调第二波形均衡器的输出的解调器。因此，可以以不间断优异的均衡性能并且不牺牲数据容量来执行自适应均衡处理。

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