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1. 发明申请

US20140146476A1 AUTOMATION DEVICE HAVING A HEATSINK 有权
标题翻译：具有HEATSINK的自动化设备
公开(公告)号：US20140146476A1
公开(公告)日：2014-05-29
申请号：US14090608
申请日：2013-11-26
申请人： Mathias BÄUML , Julia Michl , Jürgen Schmelz
发明人： Mathias BÄUML , Julia Michl , Jürgen Schmelz
IPC分类号： H05K1/02
CPC分类号： H05K1/0203 , H05K7/1464 , H05K7/20127 , H05K7/20154 , H05K7/2039
摘要： An automation device configured for an automation environment and for automating an industrial process includes a first printed circuit board, a second printed circuit board, a first electronic component arranged on the first printed circuit board and a second electronic component arranged on the second printed circuit board, a heatsink arranged on the first printed circuit board, wherein the first electronic component is arranged between the first printed circuit board and the heatsink, the heatsink has a cuboid shape and rests on the first electronic component with a first cooling contact surface incorporated in a first lateral surface of the cuboid and a second cooling contact surface incorporated in a second lateral surface of the heatsink rests on the second electronic component, and the second printed circuit board is arranged essentially vertically with respect to the first printed circuit board.
摘要翻译：配置用于自动化环境并用于自动化工业过程的自动化设备包括第一印刷电路板，第二印刷电路板，布置在第一印刷电路板上的第一电子部件和布置在第二印刷电路板上的第二电子部件布置在所述第一印刷电路板上的散热器，其中所述第一电子部件布置在所述第一印刷电路板和所述散热片之间，所述散热器具有长方体形状并且搁置在所述第一电子部件上，并且所述第一冷却接触表面包括在长方体的第一侧表面和结合在散热器的第二侧表面中的第二冷却接触表面搁置在第二电子部件上，并且第二印刷电路板相对于第一印刷电路板基本垂直地布置。

2. 发明授权

US09338876B2 Automation device having a heatsink 有权
标题翻译：具有散热器的自动化设备
公开(公告)号：US09338876B2
公开(公告)日：2016-05-10
申请号：US14090608
申请日：2013-11-26
申请人： Mathias Bäuml , Julia Michl , Jürgen Schmelz
发明人： Mathias Bäuml , Julia Michl , Jürgen Schmelz
IPC分类号： H05K7/20 , H05K1/02 , H05K7/14
CPC分类号： H05K1/0203 , H05K7/1464 , H05K7/20127 , H05K7/20154 , H05K7/2039
摘要： An automation device configured for an automation environment and for automating an industrial process includes a first printed circuit board, a second printed circuit board, a first electronic component arranged on the first printed circuit board and a second electronic component arranged on the second printed circuit board, a heatsink arranged on the first printed circuit board, wherein the first electronic component is arranged between the first printed circuit board and the heatsink, the heatsink has a cuboid shape and rests on the first electronic component with a first cooling contact surface incorporated in a first lateral surface of the cuboid and a second cooling contact surface incorporated in a second lateral surface of the heatsink rests on the second electronic component, and the second printed circuit board is arranged essentially vertically with respect to the first printed circuit board.
摘要翻译：配置用于自动化环境并用于自动化工业过程的自动化设备包括第一印刷电路板，第二印刷电路板，布置在第一印刷电路板上的第一电子部件和布置在第二印刷电路板上的第二电子部件布置在所述第一印刷电路板上的散热器，其中所述第一电子部件布置在所述第一印刷电路板和所述散热片之间，所述散热器具有长方体形状并且搁置在所述第一电子部件上，并且所述第一冷却接触表面包括在长方体的第一侧表面和结合在散热器的第二侧表面中的第二冷却接触表面搁置在第二电子部件上，并且第二印刷电路板相对于第一印刷电路板基本垂直地布置。

3. 发明授权

US09210827B2 Automation device having a heatsink 有权
标题翻译：具有散热器的自动化设备
公开(公告)号：US09210827B2
公开(公告)日：2015-12-08
申请号：US14090892
申请日：2013-11-26
申请人： Mathias Bäuml , Julia Michl , Jürgen Schmelz
发明人： Mathias Bäuml , Julia Michl , Jürgen Schmelz
IPC分类号： H05K7/20 , G06F1/20 , H05K5/00 , H05K7/14 , H05K5/02
CPC分类号： H05K7/1464 , G06F1/20 , H05K5/00 , H05K5/02 , H05K7/20127 , H05K7/2039
摘要： An automation device configured for an automation environment and for automating an industrial process includes a basic housing, a front hood, a primary heatsink for dissipating heat from a microprocessor, wherein the front hood is slottable onto the basic housing and assembles to form a closed housing which encloses the primary heatsink, the primary heatsink is rigidly connected to the basic housing on a bottom side of the basic housing via a locating bearing, the front hood includes a projecting retaining element on an inner side, a recess is arranged on a top side of the primary heatsink and into which the retaining element engages when the housing is closed, an elastic shaped element is arranged between the projecting retaining element and the recess, and the elastic shaped element absorbs oscillating forces of the primary heatsink in three spatial axes (x,y,z).
摘要翻译：配置用于自动化环境并用于使工业过程自动化的自动化装置包括基本壳体，前罩，用于从微处理器散热的主散热器，其中前罩可插入到基本壳体上并组装以形成封闭壳体其包围主散热器，主散热器通过定位轴承刚性地连接到基本壳体的底侧上的基本壳体，前罩包括在内侧上的突出保持元件，凹部布置在顶侧并且当壳体关闭时保持元件接合到其中，弹性形状元件布置在突出的保持元件和凹部之间，并且弹性成形元件吸收三个空间轴中的主散热器的振荡力（x ，y，z）。

4. 发明申请

US20140146478A1 AUTOMATION DEVICE HAVING A HEATSINK 有权
标题翻译：具有HEATSINK的自动化设备
公开(公告)号：US20140146478A1
公开(公告)日：2014-05-29
申请号：US14090892
申请日：2013-11-26
申请人： Mathias BAEUML , Julia Michl , Jürgen Schmelz
发明人： Mathias BAEUML , Julia Michl , Jürgen Schmelz
IPC分类号： H05K7/20
CPC分类号： H05K7/1464 , G06F1/20 , H05K5/00 , H05K5/02 , H05K7/20127 , H05K7/2039
摘要： An automation device configured for an automation environment and for automating an industrial process includes a basic housing, a front hood, a primary heatsink for dissipating heat from a microprocessor, wherein the front hood is slottable onto the basic housing and assembles to form a closed housing which encloses the primary heatsink, the primary heatsink is rigidly connected to the basic housing on a bottom side of the basic housing via a locating bearing, the front hood includes a projecting retaining element on an inner side, a recess is arranged on a top side of the primary heatsink and into which the retaining element engages when the housing is closed, an elastic shaped element is arranged between the projecting retaining element and the recess, and the elastic shaped element absorbs oscillating forces of the primary heatsink in three spatial axes (x,y,z).
摘要翻译：配置用于自动化环境并用于使工业过程自动化的自动化装置包括基本壳体，前罩，用于从微处理器散热的主散热器，其中前罩可插入到基本壳体上并组装以形成封闭壳体其包围主散热器，主散热器通过定位轴承刚性地连接到基本壳体的底侧上的基本壳体，前罩包括在内侧上的突出保持元件，凹部布置在顶侧并且当壳体关闭时保持元件接合到其中，弹性形状元件布置在突出的保持元件和凹部之间，并且弹性成形元件吸收三个空间轴中的主散热器的振荡力（x ，y，z）。

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